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| Found 86 items
in EE Times
for rf connector
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| Results 1 - 15 |
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Why I sometimes don't like short RF links
EE Times
, January 03, 2010
The reliability of short-distance, simplex RF links can be a problem
Quantenna debuts 802.11n 4x4 MIMO wireless video bridge reference design
EE Times
, December 16, 2009
Quantenna Communications Inc. has debuted a complete wireless LAN video bridge reference design based on its QHS600 IEEE 802.11n 4x4 multiple input, multiple output (MIMO) chipset in time for the Consumer Electronics Show and based on IEEE 802.11n wireless LAN technology with digital beamforming for multimedia distribution.
Alliance formed to boost VPX initiatives
EE Times
, December 10, 2009
VITA, the trade association which promotes open system architectures in critical embedded system applications, has formed the VPX Marketing Alliance.
Small WiEx cellular phone repeater solves large problem
EE Times
, October 26, 2009
In the case of the WiEx, the other challenging dimension lies in identifying design details in a fairly discrete RF circuit implementation.
Conference report: Hard to see the recession from the IMS show floor
EE Times
, June 10, 2009
Look over the floor and listen to the buzz at the IEEE's MTT-S International Microwave Symposium, and you'd hardly know there's a recession out there. A spate of tech advancements and the sheer pervasiveness of wireless could account for the industry's strong showing in a down economy
Top 25 Distributors 2009
EE Times
, May 04, 2009
Avnet is the world's largest distributor, based on sales, of electronic components, enterprise computer and storage products and embedded subsystems.
Samsung SPH-9000: Shrinking PC meets up with new broadband standards
EE Times
, April 20, 2009
The Samsung SPH-P9000 is a regional gadget, featuring a Windows XP-based PC melded into something closer to an overgrown smart-phone format.
EE Times launches Editors' Choice: Products of the Week
EE Times
, March 06, 2009
Welcome to the first of what is to be a weekly EETimes Editor's Choice product selections where we update you on what we consider to be the most outstanding products to come of out the minds of chip, component, board, module, development kit and software tool designers worldwide.
Good vibrations for energy harvesting
EE Times
, November 10, 2008
The combination of high-power-density piezoelectric element design with a high-efficiency converter takes energy-harvesting out of the lab to address the problem of powering remote and embedded devices.
Omron positioned for European growth
EE Times
, November 06, 2008
Much of the talk and many of the demonstrations at this month's Electronica exhibition and congress are likely to focus on how companies are responding to the economic downturn. One company that sees the turmoil as an opportunity is Omron, the diversified Japanese industrial and medical electronics group.
Agilent introduces electromagnetic design platform
EE Times
, October 31, 2008
Agilent introduced Electromagnetic Professional (EMPro), a new design platform for analyzing the electromagnetic (EM) effects of RF and microwave components.
Garmin Nuvi 205: Entry-level GPS in the great wide open
EE Times
, September 03, 2008
The $199 Garmin Nuvi 205 analyzed for this week's Under The Hood was one of the first "blister-pack" personal navigation devices (PNDs) that I had seen.
Converter box brings digital TV into analog realm
EE Times
, August 20, 2008
Under the Hood takes a look at new digital-to-analog signal converter boxes offered to help ease customers through the impending transition to digital TV.
Green Engineering: Tech comes clean
EE Times
, August 18, 2008
This article provides an overview of the trends in clean technologies and how they are impacting the electronics. In addition to data on the size and growth races of the markets and investment opportunities, the article touches on how electronics companies are participating in the cleantech boom. It also includes a look at how companies are adapting their internal operations to meet new environmental regulations such as REACH, as well as supply chain challenges.
Under the Hood - Update: Apple iPhone 3G exposed
EE Times
, July 12, 2008
Analysis of the Apple iPhone 3G shows contributions from many IC manufacturers, including Wi-Fi support from Marvell, Bluetooth support from CSR, applications processing from Samsung, UMTS from Infineon and TriQuint, as well as chips from Texas Instruments, Linear Technology, Broadcom and others.
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