It’s Applegate, not 'antennagate' Blog 7/17/2010 10 comments The iPhone 4 antenna controversy was a minor problem but it highlights the need for Apple Inc. to develop a better system of managing issues related to the company’s public image than it has so far demonstrated.
Hubris, lessons from an Apple antenna debacle Blog 7/16/2010 17 comments Apple Inc. is paying a hefty price in lost market value and erosion of its image for not listening to its own engineer and others from a service provider who warned the design of the iPhone 4 could hurt signal reception.
Tracing shorted traces Engineering Investigations 7/16/2010 9 comments Determining the exact physical location of a short circuit in a PCB can be fiendishly hard.
Dispelling the myths of High-Level Synthesis Blog 7/15/2010 5 comments High-level synthesis (HLS) has been a hot topic for about the last 10 years, characterized as Electronic System Level (ESL) synthesis, algorithmic synthesis, and behavioral synthesis, and C synthesis by some. I just call it “simply, a better way to design hardware.”
Democratization of MEMS design and manufacturing Blog 7/7/2010 3 comments A perfect storm is brewing in semiconductor design and it reminds of a period about 20 years ago when many of the same forces were at work. The storm is all about challenges and opportunities to expand a market for a specific type of semiconductor technology, and the main thing missing is coherent infrastructure or ecosystem to facilitate it.
IP protection not standard in electronics organizations Blog 7/7/2010 2 comments Inventions are the lifeblood of many communications and electronics companies. But if those ideas and products are not protected from theft, all that hard work and creativity has been in vain. Unfortunately too many organizations are failing to ensure that their intellectual property (IP) is secure.
How productive is your R&D organization? Blog 7/7/2010 4 comments Productivity drives development throughput in your R&D organization - the higher the productivity, the greater the throughput. And throughput is a measure of how much product the engineering organization churns out during a given period of time.
Fundamental challenges of PCB assembly and test Blog 7/5/2010 Post a comment This white paper provides a description of the PCB manufacturing process along with the challenges facing today's electronics manufacturers with respect to the Manufacturing System Solutions (MSS) portfolio of the Valor Division of Mentor Graphics.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.