Design Con 2015
Breaking News
Blog
Content posted in September 2011
A Ham's Eye View
Blog  
9/29/2011   23 comments
Welcome to the first installment of a new blog in the EETimes empire. First, a few words of introduction…I’m Doug Grant, amateur radio callsign K1DG.
Models, models, models…
Blog  
9/29/2011   3 comments
Without models the EDA industry could not exist and when it comes to trying to promote a new abstraction level, models become the sticking point. Synopsys intends to change that…
Boeing delivers first 787 Dreamliner--now the real work begins
Blog  
9/28/2011   3 comments
The wide-body jet is not the only thing flying high—so is the market for commercial jets. But is there a bubble forming?
Many may get burned by Kindle Fire
Blog  
9/28/2011   52 comments
The Kindle Fire brings welcome competition to a tablet market dominated by Apple and a services market led by cellular carriers, and it could curb hopes for Taiwan and Wintel.
Cypress’s Gen4 TrueTouch touchscreen controllers were worth the wait
Blog  
9/28/2011   4 comments
Cypress's Dhwani Vyas put it best, "Finally [we] have the part I have been waiting for!" He was referring to the company's new Gen4 family of touchscreen controllers that are the first to feature an ARM 32-bit core, along with proprietary LCD noise cancellation technology called DisplayArmor that eliminates the need for an extra shield layer of glass and its associated air gap, thereby reducing display thickness by up to 1 mm and lowering overall cost and weight.
EDA/IP Roundup
Blog  
9/27/2011   Post a comment
There are often many news items that are not worth writing a full blog about, but may still be of interest to people. This is a roundup of those items…
10X productivity boost is nothing to be sneezed at
Blog  
9/27/2011   Post a comment
Press releases that claim productivity improvement are a dime a dozen, but this one caught my eye and maybe there is something to it…
PCB design and supply chain standards group gains momentum
Blog  
9/27/2011   Post a comment
IPC-2581 is a generic standard for printed circuit board assembly products' manufacturing description data and transfer methodology…
Travel Nightmares: A bad day for an interview
Blog  
9/27/2011   16 comments
When I first saw this series I thought “Well, I’m glad nothing bad ever happened to me.” And then I started to remember some of the things that have happened…
Call for Papers!
Blog  
9/27/2011   Post a comment
Have you got something to say about the latest RF and microwave design techniques?
opinion: Unethical companies make us “opt out”
Blog  
9/26/2011   6 comments
Opinion: Corporations seem to believe that the option to opt out is good enough to protect our privacy, but I disagree. Those options are usually buried in a pile of fine print…
Chips in Space: Lessons learned (Part 2)
Blog  
9/24/2011   8 comments
For those who have been following this blog and the reader comments, you know that the battery failed eight days into the mission. For the next mission, we need to design a power system where a shorted battery will not render the satellite inoperable. Thankfully, the ARISSat-1 battery failed open; but that was luck. For an extraordinary story about amateur-satellite batteries, read how the battery shorted then reopened 21 years later on AMSAT OSCAR 7.
Whitman's challenge: An inside view of HP
Blog  
9/23/2011   12 comments
One veteran HP engineer--who asked to remain nameless--shared his thoughts on the revolving door in the company's corner office after Meg Whitman was named HP's new chief executive.
London Calling: A weighty issue
Blog  
9/22/2011   6 comments
The integrated circuit revolution helped make things smaller, faster, lighter and cheaper. But some people resisted....all the way to the bank.
HP: How to polish a Silicon Valley gem
Blog  
9/22/2011   9 comments
HP's engineers and managers need a CEO that can quietly get behind them to provide the blocking and tackling needed to help solve some really, really big problems.
Are you kidding? This Android Certificate Program is worth the price of ESC admission!
Blog  
9/22/2011   Post a comment
At ESC Boston, there’s an Android™ Certificate Program available to all access pass holders.
Si2 announces agenda and speakers for 16th Si2 conference
Blog  
9/22/2011   Post a comment
The Silicon Integration Initiative (Si2) has announced that its 16th Si2 Conference will be held on October 20, 2011, at the Network Meeting Center-Techmart, Santa Clara…
Slideshow: BlackBerry PlayBook tablet teardown
Blog  
9/22/2011   1 comment
A detailed look at the UBM TechInsights teardown of the the packaging and design internals of the PlayBook tablet from Research in Motion, the maker of the BlackBerry smartphone.
Are you signed up yet? What are you waiting for?
Blog  
9/21/2011   Post a comment
Several ESC Boston tracks are dead on with articles that you’ve been scarfing up on the site.
EDA Roundup
Blog  
9/21/2011   Post a comment
There are many news stories out every week that are interesting, but on their own don't warrant a full writeup. This is a roundup of such information...
CoFluent helps Intel with virtual platform creation
Blog  
9/20/2011   4 comments
A quiet acquisition puts Intel back in the EDA business for virtual platforms. I am sure they don’t see it as a way to make money, but to sell hardware…
NextOp adds a logo for assertion synthesis
Blog  
9/20/2011   Post a comment
Normally I would not comment on a product being sold to a company, but I do take more notice when a) it is a startup company that is creating a new field and b) when the company…
DFI helps speed up the memory sub-system
Blog  
9/19/2011   Post a comment
A revision to the DFI standard promises faster memory access and support for DDR4 memory sub-systems. Cadence also announced availability of supporting IP.
Viewpoint: What lies ahead for on-chip interconnect technology?
Blog  
9/19/2011   1 comment
What are the technological options available for improving on-chip interconnects? Let’s take a look…
Poised on the brink of a new era…
Blog  
9/19/2011   3 comments
The EDA DesignLine is in new hands! As of today, I am the new editor and I intend to return this corner of the EE Times universe it to be the vibrant community it should be…
High-speed memory controller spec released for DDR4
Blog  
9/19/2011   Post a comment
DFI Technical Group releases latest high-speed memory controller and PHY interface specification that enables transition to next-generation DDR4 memory
Managing IP quality in the SoC era requires a purpose-built DM approach
Blog  
9/19/2011   Post a comment
With the steady advancement of manufacturing process geometries enabling new levels of integration on a single chip, the use of IP--whether internally developed or sourced from a third-party--has become more complex.
Chips in Space: Lessons learned (Part 1)
Blog  
9/17/2011   7 comments
Project management teaches us to do a post-mortem review at the end of every project, to muse about the things that did and didn’t go right. If things went right, they are called “best practices.” If they did not go as planned or we overlooked something, we call them “lessons learned.” A polite way of saying, we goofed and we promise not to do that again (we hope).
Picking up the pieces after Solar-gate
Blog  
9/16/2011   19 comments
Where do we go after the apparent demise of the U.S. solar industry?
More advice on navigating patent law shifts
Blog  
9/15/2011   2 comments
Patent expert Jason Kipnis provides some guidelines on how to deal with pending changes in patent disclosure and re-exam procedures.
Preview: Conference looks beyond 32-nm to 3-D
Blog  
9/14/2011   Post a comment
The 2011 Advanced Metallization Conference will be devoted to leading-edge research in the field of advanced metallization and 3-D integration for ULSI IC applications.
GeekDown—an adventure in techie art
Blog  
9/14/2011   6 comments
From eye-popping wearable tech (so hideous it's hip) to a stereoscopic video installation, the GeekDown exhibit at 92YTribeca was truly geek chic.
Intel and Microsoft file for divorce, both seen dating today!
Blog  
9/14/2011   3 comments
Why isn't Intel talking about Microsoft at IDF?
Navigating the shifts in U.S. patent law
Blog  
9/14/2011   6 comments
The new U.S. patent reform bill makes a handful of significant changes that impact how you should manage your patent portfolio, says UBM TechInsights.
EDA in the clouds
Blog  
9/13/2011   1 comment
Cloud computing offers benefits and challenges to EDA tool users, but either way it is here to stay.
FPGA and MCU integration is a game-changer for many system designs
Blog  
9/13/2011   2 comments
FPGA and MCU integration means that designers can create the products they want with the features they need, without compromise...
An engineering icon is swept away
Blog  
9/13/2011   15 comments
Hurricane Irene destroys world's longest covered bridge.
ESC Preview: Memory
Blog  
9/12/2011   Post a comment
I've taken a look at the sessions and picked out a few that I think are worth a closer look for designers working with memory.
Chips in Space: Just the FAQs Ma’am
Blog  
9/10/2011   6 comments
It’s a lot of fun telling the tale about ARISSat-1. So, when we were offered a table at the Microchip MASTERs Conference, we accepted the invitation with enthusiasm. For the conference, we shipped in our fully functional demonstration satellite from the East Coast to Northern Phoenix and put it on display.
Respect your ELDRS
Blog  
9/7/2011   4 comments
How can we effectively test electrical components for enhanced low-dose radiation sensitivity (ELDRS)?
Thirteen reasons you should go to ESC 2011 (Boston)
Blog  
9/6/2011   2 comments
In the spirit of David Letterman, but with more rationality, I offer these reasons
Why the British got out of fabs
Blog  
9/5/2011   67 comments
In response to a forum discussion and a request from a participant there I have tried to answer the questions: "Why the British had to get out of fabs and end up just with design / IP a la ARM ?" and "Why fabs still survive ( if not exactly thrive ) in the UK's traditional rival France ?"
Chips in Space: Design challenges, intrigue and solutions
Blog  
9/3/2011   4 comments
We’ve covered a lot of ground in the past seven blog posts. The story had a beginning of an idea (hey, let’s fill a suit with electronics and toss it out of the International Space Station!). Twist and turns (we lost the suit, now what?!). Heroic recovery (that’s a nice aluminum space frame you got there!). And a happy ending (We have liftoff! ARISSat-1 is successfully operating in space!).
New JEDEC spec online
Blog  
9/2/2011   2 comments
I just heard from my contacts at JEDEC that they have issued Release 4 of the DDR3 Serial Presence Detect (SPD) Specification.
An entrepreneur's view of solar
Blog  
9/1/2011   15 comments
Solar Cities Asia founder Valdis Dunis saw back in July that China had won the game in solar panels by massive investments in crystalline technology.
When the smart money got into/out of manufacturing
Blog  
9/1/2011   5 comments
For every sell off there is a buy in. So, of the two companies that have agreed to the transfer of an Oregon wafer fab, IDT and Alpha and Omega Semiconductor, which is right?


Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Book Review: Deadly Odds by Allen Wyler
Max Maxfield
8 comments
Generally speaking, when it comes to settling down with a good book, I tend to gravitate towards science fiction and science fantasy. Having said this, I do spend a lot of time reading ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
13 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).