4DS ReRAM Hits DRAM Speeds
News & Analysis 6/22/2017 1 comment
Interface Switching ReRAM has overcome the hurdle of high bit rate errors without error correction techniques that have historically slowed read access time
Much Ado About China’s Big IC Surge
News & Analysis 6/22/2017 3 comments
It’s been two years since China announced a huge capital investment intended to kick-start an indigenous semiconductor industry. So, how’s that working out for China?
Intel Brings VR, 5G to Olympics
News & Analysis 6/21/2017 6 comments
Intel will build experiences using virtual reality, 360-degree video, 5G cellular and drones for the Olympics starting with the 2018 winter games.
Siemens Lays Out Vision for Mentor
News & Analysis 6/21/2017 1 comment
The executive chairman of Siemens PLM Software used his keynote address at the Design Automation Conference to lay out the company's plan for the newly acquired Mentor Graphics.
AMD Rolls Epyc Server SoCs
News & Analysis 6/20/2017 3 comments
AMD formally announced Epyc, a family of server SoCs using its Zen x86 core, weeks before Intel is expected to debut its 10-nm Skylake Xeon chips.
Alibaba Fuels China's CPU Gambit
News & Analysis 6/20/2017 Post a comment
C-Sky, designer of China’s home-grown 32-bit embedded CPU processing cores, is quite possibly China’s best kept secret. Its CEO explains why its unique tie with Alibaba is C-Sky's ace in the hole in winning China’s IoT market.
Cray Moves to Lasso 'Big Data Deluge'
News & Analysis 6/20/2017 1 comment
Cray’s Urika Big Data Analytics Suite, for its biggest XC supercomputers, brings all the analytic tools necessary to handle the deluge of data today including deep learning and artificial intelligence in a free open-source downloadable package.
MediaTek Chooses TSMC for 7nm
News & Analysis 6/16/2017 6 comments
MediaTek, the second-largest designer of mobile phone chips after Qualcomm, says it has chosen the world's biggest chip foundry to make 7nm products.
Hybrid Memory Cube Powers Galaxy Quest
News & Analysis 6/16/2017 1 comment
Micron's Hybrid Memory Cube technology is a key part of the digital processing platform for the MeerKAT telescope to match processing power to memory size and data bandwidth.
Exascale Project Awards $258M
News & Analysis 6/15/2017 1 comment
Six U.S. chip and systems companies will split $258 million in grants to do research toward building an exascale-class supercomputer by 2021.
Google Ramps Mobile SoC Team
News & Analysis 6/14/2017 11 comments
Google is hiring mobile SoC designers to build chips for its smartphones and has already snagged one senior designer from its chief rival Apple.
Paris Accord: As U.S. Drops Out, Chipmakers Double Down
News & Analysis 6/14/2017 3 comments
The semiconductor industry has responded to President Trump’s plan to pull the United States out of the Paris Climate Accord with resounding reaffirmations of the industry’s commitment to sustainable and energy-efficient manufacturing practices.
Riding Mobileye Coattails, MIPS Juices CPU IP
News & Analysis 6/14/2017 1 comment
Imagination Technologies has rolled out a high-performance, multi-threaded MIPS CPU IP, driving MIPS cores further into automotive and industrial applications that require functional safety. The new CPU core is at the heart of Mobileye’s EyeQ5 SoC.
IMS 2017: 10 Things Not 5G
News & Analysis 6/14/2017 Post a comment
The 2017 International Microwave Symposium, billed as #Hawaii5G, had much more. Here are 10 samples of things that don't fall under the 5G hype.
Achronix Growth Spurt More Than 'Luck'
News & Analysis 6/14/2017 2 comments
Achronix Semiconductor, a privately held FPGA company founded in 2004, reached a critical juncture this year with projected 2017 revenue in excess of $100 million -- a 700 percent increase in 12 months. What's going on here?
Germanium Displacing GaAs for RF Transistors
News & Analysis 6/13/2017 1 comment
The world's first sub-10 nanometer Germainium gate-all-around (GAA) nanowire transistors accompany the world's lowest source/drain contacts claims the International Micro-Electronics Center (Imec Intl., Belgium) at this month's 2017 Symposia on VLSI Technology and Circuits in Kyoto, Japan.
TI’s Shrewd Robo-Car Strategy
News & Analysis 6/12/2017 5 comments
While Nvidia and Intel are busy sparring for glory as innovators of fully autonomous vehicle platforms, TI has kept its profile low. What are the plans for TI to shift its current ADAS platform to Level 4/Level 5 autonomy?
EC Refs Whistle Qualcomm-NXP Deal
News & Analysis 6/10/2017 4 comments
The European Commission Friday (June 9) officially opened an in-depth investigation into the proposed acquisition of NXP by Qualcomm. Qualcomm's increased isolation in the world is palpable.
DARPA Funds Development of New Type of Processor
News & Analysis 6/9/2017 22 comments
The Defense Advanced Research Project Agency (DARPA) is building the world's first graph-analytics processor in its Hierarchical Identify Verify Exploit (HIVE) program that is 1000-times faster than today's CPUs and GPUs.
Big Data Makes Big Waves
News & Analysis 6/8/2017 Post a comment
The rise of big data continues to expand out from the web, touching many businesses, spawning data scientists, and reshaping the job of technologists.
IBM Optics Go CMOS
News & Analysis 6/8/2017 3 comments
IBM demonstrates an optical interconnect receiver that achieves 60-Gbits per second speed using silicon photonics at a price point lower than conventional copper 50-Gbit per second interconnects.
PCI Express Preps Shift to 32G
News & Analysis 6/7/2017 8 comments
The PCI Express bus will get a doubling to 32 GTransfers/s with a Gen 5 planned in 2019 following the rollout of the first Gen 4 systems this year.
Autonomous Cars Tackle Antenna Glut
News & Analysis 6/7/2017 2 comments
How many antennas does it take to screw autonomy into a car? In the emerging era of highly automated vehicles, as many as 18 antennas “are needed to power the next-generation connected car,” according to antenna supplier Taoglas.
Why Qualcomm's New JV Irks Tsinghua Unigroup
News & Analysis 6/6/2017 Post a comment
China's two high-profile investment firms, JAC Capital and Wise Road Capital, investors of semiconductor business units divested by NXP, are now backing a new Qualcomm-Leadcore JV focused on chipsets for mass-tier smartphones in China.