Google, Intel, TAG Heuer Plan Smartwatch News & Analysis 3/20/2015 2 comments Google, Intel, and TAG Heuer on Thursday announced plans to collaborate on a Swiss smartwatch based on Intel electronics and Google's Android Wear software. The Swiss watch industry faces a challenge from Apple, which plans to launch the Apple Watch next month.
Amazon Drones Need a Few Breaks from the FAA News & Analysis 3/20/2015 2 comments Amazon received an “experimental airworthiness certificate” from the FAA, but it isn't quite a breakthrough?. Not so much. Here’s why Amazon Prime Air’s dream of package delivery via drones is still a long shot.
Patent Filings: Who Made the Cut for Top 50? News & Analysis 3/19/2015 5 comments We often measure the technology prowess – of a nation, a company – by the number of international patents filed and granted. China’s Huawei Technologies was the top applicant for international patents in 2014, according to a WIPO report.
Broadcom v ASICs, Part 2 News & Analysis 3/18/2015 Post a comment Broadcom announced the first 28nm versions of its StrataDNX chips from its Dune acquisition, driving deeper into competition with OEM ASICs.
Bi-directional RF Doubles Cellular Capacity News & Analysis 3/18/2015 16 comments Full-duplex sending and receiving over the same frequency at the same time is possible, unlike what you learned in engineering school. According to researchers at Columbia University, you just have to cancel out the signal from the much more powerful transmitter at the receiver's antenna.
Industrial IoT Drives Microsemi-Vitesse Merger News & Analysis 3/18/2015 Post a comment Microsemi Corp. will acquire Vitesse Semiconductor Corp. for $389 million to focus on “communications semiconductors.” On horizon is the MIPS vs. ARM conflict as the two companies use two diverging processor cores of their product lines.
Marvell Touts MoChi, FLC in Shanghai News & Analysis 3/17/2015 6 comments The president of Marvell painted broad strokes about its Final-Level Cache memories and a new interconnect technology called MoChi during a keynote in Shanghai. She described them as basic building blocks for the company’s newly proposed scalable SoCs.
SoC Spec Hits Version 1.0 News & Analysis 3/16/2015 2 comments The AMD-led Heterogeneous Systems Architecture Foundation has finished its 1.0 spec, turning attention to what SoCs will support it.
Scientists Pursue Super-Fast Material News & Analysis 3/16/2015 10 comments Researchers may have realized an 80-year-old-dream of forming a pure electron crystalline lattice with 200-times the electron mobility of graphene and 1700-times the electron mobility of silicon.
ams and ST Team Up to Secure NFC Mobile Payments News & Analysis 3/16/2015 1 comment There are some problems and security issues with NFC. ams AG and STMicroelectronics have collaborated to introduce an NFC system reference design that assures easy, reliable and secure contactless transactions while suiting the form factor of mobile and wearable devices.
Layoffs Hit 1,600 in Cypress Deal News & Analysis 3/13/2015 1 comment Cypress and Spansion are expected to lay off more than 20% of combined staff or about 1,600 people following their recently approved merger.
5G Challenges Ahead, Experts Say News & Analysis 3/13/2015 4 comments 5G was undoubtedly a hot topic at Mobile World Congress, with industry officials and vendors excited about the next-generation communications system. A bevy of legal and economic requirements, however, may temper a bit of the excitement.
PC Drop & iPhone Rumors Color Intel Forecast News & Analysis 3/13/2015 9 comments Intel’s forecast warning raise the issue of its ability to diversify its business. A recent report that Intel’s LTE modems “getting into iPhones in 2016” stirred some noise, but it’s still a rumor at this point.
Vehicle-in-the-Loop Speeds Automotive Design Cycles News & Analysis 3/13/2015 Post a comment Confronted with increasing complexity and safety requirements for tomorrow’s vehicles, car designers increasingly use virtual test approaches to assure the correct functions of their systems. Complementing the known tool array of Hardware-in-the-Loop (HiL) and Software-in-the-Loop (SiL), technology company IPG GmbH suggests an approach it calls Vehicle-in-the-Loop (ViL), allowing users to significantly reduce the time to develop their Advanced Driver Assistance Systems (ADAS).
ST's Vigna Wins IEEE Award News & Analysis 3/12/2015 Post a comment Benedetto Vigna, executive vice president for the analog, MEMS, and sensors group at STMicroelectronics NV has been given a top IEEE award for his role in the development and commercialization of micro-electro-mechanical systems (MEMS).
Smart Glasses Go To Work News & Analysis 3/12/2015 1 comment Epson, Google, Sony and others are seeking traction for their smart glasses among business users, according to exhibitors at an event on wearable devices.
Free Sirius One-Ups Siri News & Analysis 3/12/2015 7 comments University of Michigan researchers one-up Apple's Siri, Google's Now and Microsoft's Cortana with their free, open-source Sirius.
Marvell CEO: The Tinkerer at The Top News & Analysis 3/12/2015 10 comments Marvell CEO has been obsessed with a computer architecture that’s unchanged for decades. Why must its progress depend on more memory and faster CPU? “We are going to fix it for once and all.”
Sigfox, Sequans: Tale of Two French IoT Firms News & Analysis 3/11/2015 4 comments There is an underlying thread in both 5G and IoT: Diversification. Diversified networks, network topologies and network infrastructures are necessary to enable both. Carriers realize that there will be no one-size-fits-all network for either 5G or IoT.
Heart On-A-Chip Beats News & Analysis 3/11/2015 6 comments Researchers at the University of California have created a heart-on-a-chip that will be followed by a liver-on-a-chip, lungs-on-a-chip, spleen-on-a-chip, until they have all human organs on a single wafer connected by microfluidic channels carrying blood.
Taking on Industrial IoT with Real-Time DDS News & Analysis 3/11/2015 1 comment Building on its experience in high reliability Data Distribution Services for the military/aerospace market, Prismtech launchs a "DDS for things" platform for networked devices requiring real-time, deterministic delivery.
FinFETs Race Toward Silicon News & Analysis 3/10/2015 Post a comment As Cadence announced a new physical-design tool, Synopsys said it has 100 production tape outs in FinFET processes, 90% of the advanced chips made to date.
Startup Lights New Way to Wireless Charging News & Analysis 3/10/2015 2 comments Israeli company Wi-Charge developed transmitters and receivers that use laser light to charge a variety of devices. Originally based in lightbulb and plug-in form factors, the transmitters are designed to provide a constant charge while eliminating the unsafe radiation associated with infrared light.
Infineon: Why It's Back at MWC News & Analysis 3/10/2015 1 comment Since 2011, when it sold its wireless business to Intel, Infineon’s name – along with its baseband and RF technologies — has faded into the memory of the mobile world. But they are back in Barcelona this week. Why?
Intersil Fined for TAOS Patent Infringement News & Analysis 3/10/2015 Post a comment Intersil Corp. has been found guilty of infringing patents held by Texas Advanced Optoelectronic Solutions Inc. (TAOS) and fined $58.8 million in a court case that dates back to 2008. Taos was acquired by AMS AG (Unterpremstaetten, Austria) in 2011.
NXP to Focus on All CMOS Radar Future News & Analysis 3/9/2015 9 comments NXP CEO sees making “big and clunky radars” small is critical for ADAS. NXP has an RF CMOS-based 80GHz radar front-end transmitter chip — a working prototype – in the hands of its lead customers for several months.
Stick a PUF to Your Board News & Analysis 3/6/2015 1 comment The Fraunhofer Institute for Applied and Integrated Security (AISEC) is developing a very versatile and flexible form of Physically Unclonable Function (PUF), one that can wrap an entire circuit board to secure it from physical attacks.
A Book For All Reasons Bernard Cole3 comments Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...