Intel has late metal fix for design error News & Analysis 1/31/2011 15 comments Some more details of a design error in companion chip to the Sandy Bridge processor, and the fix being implemented, have emerged in a conference call held by Intel to discuss the issue and the impact on revenues and margins.
Rambus CEO sees light in semi growth News & Analysis 1/31/2011 1 comment In the first DesignCon keynote today here president and chief executive officer of Rambus Inc. painted an optimistic forecast for semiconductors and electronics in general, and of course touted Rambus' IP business model as ideal to produce "one SoC that addresses a broad range of performance levels and price points. "
U.S. reaches H-1B cap for 2011 News & Analysis 1/31/2011 27 comments The U.S. Citizenship and Immigration Services (USCIS) agency has received a sufficient number of H-1B petitions to reach the statutory cap for fiscal year 2011.
Synopsys: IC Compiler speeds DRC up to 7X News & Analysis 1/31/2011 Post a comment Synopsys released the latest version of its Galaxy Implementation Platform and IC Compiler, including enhancements that the company claims make automatic design rule check repair up to 7 times faster.
Intel finds design error in chip News & Analysis 1/31/2011 13 comments Intel has found a design error in a support chip for the recently announced Sandy Bridge processor. The company says it has implemented a solution but that the error could cost the company $700 million.
Intel commits $200 million to Obama startup plan News & Analysis 1/31/2011 8 comments Intel Corp. has joined President Obama's Startup America campaign to strengthen entrepreneurship in the United States and, through Intel Capital, has pledged to invest an additional $200 million in U.S. technology companies and joined the campaign's board of advisors.
DesignCon: National, Rambus rev to 20G+ News & Analysis 1/31/2011 1 comment National, Molex and Rambus will be among dozens of companies at DesignCon unveiling capabilities to drive signals to 20 Gbits/s or higher for next-generation systems.
Powerchip exits DRAM business News & Analysis 1/31/2011 3 comments Taiwan's Powerchip Technology Corp. is exiting the DRAM market, and is transferring the business over to Japan's Elpida Memory Inc.
ITC finding for ADI over Knowles to stand News & Analysis 1/28/2011 Post a comment The U.S. International Trade Commission will let stand a determination last year by an administrative law judge finding that patents asserted by Knowles Electronics against Analog Devices are invalid.
China's ZTE cracks handset vendor top 5 News & Analysis 1/28/2011 7 comments China's ZTE placed fourth in sales globally among handset vendors in the fourth quarter of 2010, marking the first time that a Chinese company cracked the top five in any quarter, according to market research firm IDC.
Dongbu licenses EnSilica RISC processor News & Analysis 1/28/2011 Post a comment Design house EnSilica Ltd. has announced that Korean foundry Dongbu HiTek has licensed the eSi-1600 embedded RISC processor.
The eSi-1600, part of a configurable family of processor cores, is a 16-bit CPU core suitable for integration into ASIC and FPGA designs.
Samsung raises capex after IC sales climb News & Analysis 1/28/2011 1 comment Amid a plan to raise its capital spending in 2011, Samsung Electronics Co. Ltd. announced revenues of 41.87 trillion won ($37.7 billion) on a consolidated basis for the fourth quarter ended Dec. 31, 2010, a 7 percent increase year-on-year.
Tessera cuts jobs; outlook mixed News & Analysis 1/27/2011 1 comment As part of Tessera Technologies Inc.’s recent reorganization of its Imaging & Optics segment, the company announced a reduction of its Imaging & Optics employees that is anticipated to be up to 15 percent of the company’s worldwide employee base.
Nanotech boosting piezoelectrics, thermoelectrics News & Analysis 1/27/2011 2 comments Nanoscaling critical dimensions of advanced piezoelectric and thermoelectric materials is inching them toward commercial energy harvesting applications, according to separate research groups at Northwestern University and Boston College.
Firms hatch landfill electricity plant News & Analysis 1/27/2011 5 comments Is this the next big thing in energy? The Republic Services Vasco Road Landfill will be home to a new 4.3 megawatt landfill gas-to-electricity plant that will be owned and operated by Ameresco Inc.
Europe awards contract to assess 450-mm pilot line News & Analysis 1/27/2011 Post a comment Two consultancy firms with expertise in the semiconductor industry – Future Horizons Ltd. and Decision SA – have been awarded a one-year joint contract to assess the benefits of a 450-mm semiconductor prototyping line being located in Europe.
Four-core ARM A9 to run Sony game console News & Analysis 1/27/2011 18 comments Sony Computer Entertainment Inc. (SCE) has announced its next-generation portable entertainment system (codenamed NGP) will be run on a four-core Cortex-A9 processor from ARM and a PowerVR SGX543MP4+ graphics core from Imagination Technologies. NGP will make its debut at the end of the year 2011, Sony said.
EDA firm Calypto names new CEO News & Analysis 1/27/2011 Post a comment Privately held EDA vendor Calypto Design Systems announced that Doug Aitelli, currently the company's current vice president of worldwide sales, would assume the position of CEO.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.