Libya appoints electrical engineer interim PM News & Analysis 10/31/2011 13 comments An electronics engineer by the name of Abdel Rahim al-Kib has been appointed Libya’s interim Prime Minister by the country’s National Transitional Council, just a week and a half after former Libyan leader Muammar Gaddafi was killed by rebels October 20, effectively liberating the country.
Thailand floods take toll on PC makers News & Analysis 10/31/2011 3 comments The ongoing floods in Thailand have created shortages in the hard disk drive (HDD) market which are beginning to trickle down and affect both the pricing and availability of PCs according to industry wide reports.
Global chip sales show September growth News & Analysis 10/31/2011 Post a comment A Japanese recovery and continued demand for mobile personal electronics helped the three-month average of worldwide sales of semiconductors in September reach $25.76 billion, according to the Semiconductor Industry Association quoting figures compiled by World Semiconductor Trade Statistics organization.
EUV litho source is much brighter, says Ushio News & Analysis 10/31/2011 6 comments Xtreme Technologies GmbH (Aachen, Germany) has reported a doubling of the brightness of its laser-assisted discharge plasma (LDP) illumination source for extreme ultraviolet (EUV) lithography with more progress to come.
Daimler presents comprehensively integrated infotainment system News & Analysis 10/30/2011 Post a comment Several weeks after the first presentation of its futuristic F125 research car, Daimler has provided details on the car's infotainment system. It embraces elements such as cloud computing, seamless media integration, many apps as well as the new MirrorLink open infotainment interface.
NXP shows smart home control using 6LoWPAN News & Analysis 10/30/2011 1 comment At an IPSO Alliance event on the “Internet of Things”, NXP Semiconductors presented a smart home control demo using JenNet-IP – its ultra-low-power wireless connectivity network layer software based on 6LoWPAN.
Downturn drags on chip equipment sales News & Analysis 10/29/2011 6 comments As expected, semiconductor equipment suppliers KLA-Tencor, Novellus Systems and Teradyne reported declines in sales and they expect more of the same in the fourth quarter.
IHS: MStar still leads DTV SoC market News & Analysis 10/28/2011 Post a comment Taiwanese fabless chip vendors MStar Semiconductor and MediaTek continued to dominate the digital TV SoC market in the first half of 2011, holding market shares of 39 percent and 12 percent, according to market research firm IHS.
UN stresses ICTs role in energy sustainability News & Analysis 10/28/2011 8 comments The head of the UN’s Global Compact Lead Ole Lund Hansen has stressed the importance of sustainability, while calling on ICT companies to align strategies in order to promote better energy efficiency.
Imec launces organic PV project with partners News & Analysis 10/28/2011 3 comments Europe’s Imec research consortium (Leuven, Belgium) and 16 project partners have launched the European FP7 project X10D to bring organic photovoltaic technologies as competitive commercial alternatives to thin-film photovoltaic technologies.
TSMC reports Q3 sales decline News & Analysis 10/27/2011 2 comments TSMC reported a third quarter sales decline and said it expects a further decline in the fourth quarter. But TSMC said it expects its capacity utilization to improve slightly in the fourth quarter.
ARM unveils 64-bit architecture News & Analysis 10/27/2011 41 comments ARM Holdings has announced that its next-gen ARMv8 architecture will include the firm’s first 64-bit instruction set, pushing ARM-based processors into new segments of the consumer and enterprise markets.
Cadence CEO talks venture capital News & Analysis 10/26/2011 1 comment Collaboration and more semiconductor VC investment is what’s needed to continue innovation in the hi-tech space said Lip-Bu Tan, president and chief executive officer of Cadence Design Systems in a fireside chat with ARM’s executive VP Simon Seagers at TechCon.
UMC sees utilization falling below 70% in Q4 News & Analysis 10/26/2011 2 comments UMC reported double-digit sales declines in the third quarter on both a sequential and annual basis and said it expects capacity utilization to slip to below 70 percent in the fourth quarter, down from more than 90 percent at the beginning of the year.
ARM, Avnet launch embedded software store News & Analysis 10/26/2011 9 comments Electronics distributor Avnet's Electronics Marketing group and IP vendor ARM Holdings launched an e-commerce store dedicated to selling embedded software from a range of vendors to the embedded design community.
Broadcom joins the party with low Q4 target News & Analysis 10/25/2011 Post a comment Broadcom became the latest chip vendor to predict a fourth quarter sales decline, as the company turned in a third quarter performance in line with analysts' expectations but called for lower than expected fourth quarter revenue.
First Solar CEO resigns stock sinks News & Analysis 10/25/2011 12 comments News that First Solar CEO Robert Gillette had stepped down sent shares in the company plummeting by 25 percent on Tuesday, in a year where the Arizona-based company’s stocks have already lost over 70 percent of their value.
New licensees give ARM strong Q3 News & Analysis 10/25/2011 Post a comment Microprocessor architect ARM Holdings announced it had seen strong growth in the third quarter despite the global economic downturn thanks to a boon in new customers and an increase in the number chips based on its processor technology shipped.
VLSI confabs call for mutual interest topics News & Analysis 10/25/2011 Post a comment The 2012 Symposia on VLSI Technology & Circuits will feature joint circuit and technology focus sessions for the first time, including design in scaled technologies; design enablement; memory technology and design; and 3-D (TSV) and heterogeneous integration.
Samsung, Cadence tout collaboration on SoC News & Analysis 10/25/2011 Post a comment Executives from Samsung's foundry unit and EDA vendor Cadence Design Systems say their collaboration on Ambarella's new HD digital camera SoC recalls another era before the fabless-foundry model evolved.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.