Report: Broadcom acquires Israeli firm News & Analysis 11/30/2010 1 comment Broadcom last week acquired Israeli image processing vendor Sightic Vista for between $10 million and $20 million, according to the online, English-language version of Israeli business daily Globes.
Microchip narrows forecast News & Analysis 11/30/2010 Post a comment Microchip Technology Inc. said that based on bookings and sales activities in October and November that it expects its net sales for its third quarter of fiscal 2011 ending Dec. 31, 2010 to be down 3 percent to 7 percent sequentially.
Trio propose new card format News & Analysis 11/30/2010 5 comments SanDisk Corp., Nikon Corp. and Sony Corp. have announced the joint development of a set of specifications that addresses the future requirements of professional photography and video markets.
VLSI cuts estimates for chip, tool markets News & Analysis 11/30/2010 Post a comment This year has been a "two for one deal," with both semiconductors and chip manufacturing equipment cramming two years of growth into one year, resulting in overcapacity and declining chip prices, according to market research firm VLSI Research.
Built-in MEMS resonators beat quartz News & Analysis 11/30/2010 6 comments SiTime is offering world's first real-time clock resonator that can be wirebonded inside a semiconductor vendor's package thereby eliminating the need for external quartz crystals.
Applied rolls fast, 'intelligent' etcher News & Analysis 11/29/2010 6 comments Seeking to lower the IC manufacturing costs for 3-D designs, double-patterning and other applications, Applied Materials Inc. has rolled out a high-throughput, ''smart'' etch system.
NIST aims quartz microbalance at nanotech News & Analysis 11/29/2010 4 comments Using a new twist on the traditional thermogravimetric analysis technique, the National Institute of Standards and Technology demonstrated a new method for taking Nanoscale measurements of the purity of carbon-nanotubes, coated-nanoparticles and surface features on thin films.
CTO confirms IBM's PCM expectations News & Analysis 11/29/2010 17 comments Jai Menon, an IBM Fellow and chief technology officer with IBM's systems and technology group, has confirmed that IBM believes that phase-change memory (PCM), a non-volatile technology, could scale beyond where flash memory can go and could be of use in server computers in three to five years.
Rockchip, SMIC make 65-nm consumer SoC News & Analysis 11/29/2010 6 comments Fabless chip company Fuzhou Rockchip Electronics Co. Ltd. has started commercial production of a mixed-signal ARM9-based consumer processor using a 65-nm CMOS process from Chinese foundry SMIC.
Toshiba to source rare-earths from Mongolia News & Analysis 11/26/2010 17 comments Toshiba Corp. has signed a memorandum of understanding with Mongolia's MNFCC LLC agreeing to discussions on cooperation in the development of Mongolia's mineral resources, including uranium, rare earth and rare metals products.
Movea offers $1.99 'air mouse' for iPhone News & Analysis 11/26/2010 19 comments Motion sensing and gesture recognition company Movea SA has
announced its Air Mouse application for the iPhone4 is available for download from the App Store at a price of $1.99. The Air Mouse application enables iPhone4 users to turn their phone into a motion-operated remote control for home media and presentation uses.
Ontario microwave startup raises $8 million News & Analysis 11/25/2010 11 comments Peraso Technologies Inc., a fabless chip company working on millimeter-wave radio transceiver technology, has raised C$8 million (about $7.9 million) in an equity financing round led by Celtic House Venture Partners.
NXP's Mifare to add NFC support to SIMs News & Analysis 11/25/2010 10 comments NXP Semiconductors NV has struck a licensing deal so that its 13.56-MHz Mifare contactless smart card technology to be integrated into the Universal Integrated Circuit Card (UICC) smart card format of Gemalto NV used in mobile terminals in GSM and UMTS (European 3G) mobile communications networks.
CMOS optical pulse compressor debuts News & Analysis 11/24/2010 8 comments Silicon photonic pulse compressors to be used for optical time division multiplexing in future on-chip silicon photonics were demonstrated on CMOS chips by researchers at the University of California at San Diego.
Infineon signs Chinese IGBT deal News & Analysis 11/24/2010 5 comments Infineon Technologies AG has signed a license agreement with Xinjiang Goldwind Science and Technology Co. Ltd., a Chinese manufacturer of wind power equipments allowing the company to make core components for wind turbines.
Automotive MEMS sales rebound, says iSuppli News & Analysis 11/24/2010 6 comments Driven by the sharp rebound in the automotive production and inventory rebuilding, the market for automotive microelectromechanical system (MEMS) sensors will grow to record size in 2010, according to market research firm iSuppli.
Is IBM moving to fab-lite, research heavy? News & Analysis 11/24/2010 16 comments IBM appears set to gradually back away from semiconductor manufacturing and to rely for its leading-edge silicon on Samsung and GlobalFoundries as foundry suppliers. Both Samsung and GlobalFoundries are set to have wafer fabs for foundry operations in the United States, which could help cement relations.
Chinese web TV market booming, says In-Stat News & Analysis 11/24/2010 8 comments China’s web-enabled TV market started in 2009, with over 2 million web TV set shipments and about 250,000 web-TV set top box (STB) shipments, according to market research company In-Stat.
North American PCB book-to-bill slips News & Analysis 11/24/2010 3 comments The book-to-bill ratio for the North American rigid PCB industry in October 2010 fell below parity to 0.98, according to the Association Connecting Electronics Industries, a standards body for the electronics industry known as the IPC.
Car Wi-Fi shipments projected to soar News & Analysis 11/23/2010 7 comments Shipments of built-in car Wi-Fi systems are set to soar by more than 40 fold by 2017, as automakers increasingly view wireless connectivity as a key competitive differentiator, according to market research firm iSuppli.
ISSCC'11 picks of practical gems shine News & Analysis 11/23/2010 Post a comment The International Solid State Circuits Conference boasts advanced circuit design developments from around the globe. The 2011 conference to be held in San Francisco in February breaks down this way: out of 669 papers submitted to ISSCC 2011, 211 have been accepted, with 80 from North America, 69 from the Far East, and 62 from Europe.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.