IBM Wins Gordon Bell Prize News & Analysis 11/25/2013 5 comments World's most complex simulation of cloud cavitation collapse was awarded the prestigious Gordon Bell prize at Supercomputer 2013 (SC13, Nov. 17-22, Denver).
Apple Buys 3D Depth Sensor Company for $345M News & Analysis 11/25/2013 12 comments Apple has confirmed the purchase of israeli motion sensor tech developer PrimeSense for approximately $345 million. PrimeSense’s technology could be used in an iTV or next generation Apple TV as well as future iPhones and iPads.
China Investigates Qualcomm News & Analysis 11/25/2013 19 comments Qualcomm Incorporated Monday disclosed that China's National Development and Reform Commission, which regulates prices, has begun investigating Qualcomm regarding compliance with the Chinese Anti-Monopoly Law.
Spansion Exec Reassures Fujitsu Customers News & Analysis 11/25/2013 9 comments The most tangible technology advances, after Spansion acquired Fujitsu Semiconductor's MCU/analog business, will come from the adoption of Spansion’s proprietary eCT technology in embedded MCUs -- to be released in 2015.
Apple Awarded $290M in Patent Dispute with Samsung News & Analysis 11/22/2013 6 comments A federal jury awarded Apple over $290 million Thursday in an ongoing patent dispute with Samsung Electronics regarding technology used in iPhones and iPads. This latest legal win brings Apple's damages against Samsung to $929 million.
Omron: Never Underestimate Blood Pressure News & Analysis 11/21/2013 10 comments To win the next-generation smart healthcare battle, Omron executive says it's important to know the types of data your technology must "sense, track, accumulate, and send" to doctors who are treating patients' lifestyle illnesses.
EDN Releases Top 100 Products of 2013 News & Analysis 11/20/2013 1 comment The electronics community has voted. The annual EDN Hot 100 Products list is out, with offerings in 12 categories from microcontrollers to test and measurement equipment.
Intel to Customize High-End Processors News & Analysis 11/20/2013 13 comments Intel's roadmap for its future high-end processors promises greater levels of integration as well as customized models of its Xeon and Xeon Phi processors with in-package memory, high-speed switches, optical fabrics, next-generation storage, and 3D stacked memory.
IBM Broadens Access to Ask Watson Apps News & Analysis 11/19/2013 5 comments IBM's Watson Developers Cloud will enable software developers in a wide variety of application domains to access Watson's cognitive computing abilities for their third-party apps.
Marvell Does Comms for Sony PS4 News & Analysis 11/15/2013 7 comments Marvell supplied a comms ASIC and the WiFi controller in the Sony PS4, according to a teardown by Chipworks. Two of the companies chips in the new game console were among the few surprising finds of the teardown.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.