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Content posted in December 2003
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Sequence wins power, inductance patents
News & Analysis  
12/31/2003   Post a comment
Adding to its patent portfolio, Sequence Design has been awarded U.S. patents for RTL power analysis and extraction of parasitic mutual inductance. Technology described in the patents has been integrated into Sequence products.
Global semiconductor sales jump 5% in November
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12/31/2003   Post a comment
Worldwide sales of semiconductors rose 5 percent in November over the previous month, and were also up 25.7 percent over the same month last year, according to a new report from Pacific Crest Securities Inc.
Boston to host UWB compatibility meeting in June
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12/31/2003   Post a comment
The International Telecommunication Union - Radiocommunication Sector (ITU-R) task group 1/8 has accepted an invitation sent on behalf of U.S. industry to hold its third meeting on compatibility between ultrawideband and radiocommunication services in Boston from June 9 to 18.
Wireless LANs/PANs
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12/31/2003   Post a comment
Band interleaving paves way for 802.11a
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12/31/2003   Post a comment
The number of wireless-LAN users is growing exponentially. But with the majority of this equipment operating in the 2.4-GHz band with only three clear channels, as per 802.11b (11 Mbits/second) and 802.11g (54 Mbits/s),
Mesh networks gather steam with standards
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12/31/2003   Post a comment
Many organizations recognize the value that a wireless mesh network can provide, but are unsure whether they should implement one that is managed or ad hoc.
Swarm logic for wireless net management
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12/31/2003   Post a comment
As the volume of Wi-Fi products increases, how do we control the escalation of radio frequency (RF) interference?
Designing high-density voice-capable WLANs
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12/31/2003   Post a comment
The territory for large-scale enterprise wireless LANs is mostly uncharted, yet many are now looking at how to build a standards-based, enterprise-grade WLAN for both voice and high-user-density data.
802.11n: Defining a high-throughput WLAN
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12/31/2003   Post a comment
At the January IEEE 802.11 interim meeting in Vancouver, British Columbia, Jan. 12-15, Task Group "n" is expected to issue a call for proposals for the high-throughput amendment to the 802.11 standard.
Wireless eyes throughput challenge
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12/31/2003   Post a comment
The proliferation of wireless networking in the office, at home and in public spaces has generated considerable interest in the technology's potential for serving an ever-expanding list of applications.
Channel bonding revs WLANs past 100 Mb
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12/31/2003   Post a comment
Using a number of techniques, Atheros' Super G and Super AG technology has enabled a doubling of data rates beyond the industry-standard wireless-LAN maximum.
MIMO answers high-rate WLAN call
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12/31/2003   Post a comment
Wireless-LAN technology is not keeping up with the demands of home video networks, interactive gaming, voice-over-Internet Protocol, transportation system access and last-mile data distribution.
WLAN innovation relentless
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12/31/2003   Post a comment
While the impact of China's decision to opt for an encryption scheme that is incompatible with IEEE 802.11 standards has yet to be fully ascertained, it does not overshadow the rampant innovation sprouting from startups and established wireless-LAN players alike.
Sensor nets top R&D list for Homeland Security agency
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12/31/2003   Post a comment
As the pieces of its R&D agenda fall into place, the U.S. Department of Homeland Security expects to play a significant role in such areas as sensor networks.
Digital camera shipments up 15% in November
News & Analysis  
12/31/2003   Post a comment
Digital camera shipments from Japanese vendors totaled 5.1 million units in November, up 72 percent from the like period a year ago and up 15 percent sequentially, according to a report.
Boston to host UWB compatibility meeting in June
News & Analysis  
12/31/2003   Post a comment
The International Telecommunication Union - Radiocommunication Sector (ITU-R) task group 1/8 has accepted an invitation sent on behalf of U.S. industry to hold its third meeting on compatibility between ultrawideband and radiocommunication services in Boston from June 9 to 18.
Boston to host UWB compatibility meeting in June
News & Analysis  
12/31/2003   Post a comment
The International Telecommunication Union - Radiocommunication Sector (ITU-R) task group 1/8 has accepted an invitation sent on behalf of U.S. industry to hold its third meeting on compatibility between ultrawideband and radiocommunication services in Boston from June 9 to 18.
Analyst's Couch: ICs to grow 18% in '04
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12/31/2003   Post a comment
Fueled by cellular phones, PCs and other products in the marketplace, the semiconductor business is expected to grow 18 percent in 2004 over 2003, according to International Data Corp. (IDC).
Juniper, Ciena land U.S. Defense Department contract
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12/31/2003   Post a comment
Juniper Networks and Ciena have landed a multi-year contract with the Science Applications International Corp. (SAIC), under which the two networking giants will provide equipment for the U.S. Defense Information Systems Agency's Global Information Grid—Bandwidth Expansion (GIG-BE) program.
32-tap dual potentiometer
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12/31/2003   Post a comment
The X93254 is a dual digitally controlled potentiometer optimized for mobile designs.
SEMI, Commerce Department to support China trade mission
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12/31/2003   Post a comment
The Semiconductor Equipment and Materials International (SEMI) trade group will support a U.S. government-sponsored trade mission in China for the chip equipment industry.
Herscher out, Ping Chao in at Cadence
News & Analysis  
12/30/2003   Post a comment
A major management shuffle has taken place at Cadence Design Systems as Penny Herscher, executive vice president and general manager of that company's Design and Verification division, has stepped down, EE Times has learned. Herscher will be replaced by Ping Chao, who had subsequently been responsible for Cadence's digital IC solutions business.
Micron may admit to DRAM price fixing
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12/30/2003   Post a comment
Esec, Unaxis merger delayed again by legal move
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12/30/2003   Post a comment
The pending merger between chip equipment makers Esec Holding SA and Unaxis Holding AG has been delayed by up to six months after a management fund moved to appeal the plan.
Bomb blast simulator looks to 'harden' structures
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12/30/2003   Post a comment
The world's first bomb blast simulator aims to catapult "battle hardening" from a medieval black art into a 21st-century science.
Vitesse acquires chip maker Cicada for $66 million
News & Analysis  
12/30/2003   Post a comment
Vitesse Semiconductor Corp. said Monday (Dec. 29) it has acquired communications IC maker Cicada Semiconductor Corp. for approximately $66 million in cash.
Energy-harvesting component runs wireless nets
News & Analysis  
12/30/2003   Post a comment
Engineers at Microstrain Inc. have developed an "energy-harvesting" component that can power wireless nodes directly from ambient energy in the environment.
ROSAs/TOSAs for legacy fiber apps
News & Analysis  
12/30/2003   Post a comment
Legacy-10GT line of TOSA/ROSA solutions have been developed for 62.5-micron legacy fiber applications.
Energy-harvesting component runs wireless nets
News & Analysis  
12/30/2003   Post a comment
Wireless sensor networks are becoming an attractive solution in a wide variety of applications, but one aspect of the approach — how to wirelessly generate power — tends to cancel out their advantages.
India weighs lower tariffs to boost PC sales
News & Analysis  
12/30/2003   Post a comment
Two recent developments have given India's hardware industry hope for a vastly improved PC market here, where penetration rates are below 10 systems per 1,000 people.
Chartered, ZTE team up on networking foundry deal
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12/30/2003   Post a comment
Foundry provider Chartered Semiconductor Manufacturing Pte. Ltd. and Chinese communications equipment maker ZTE Corp. said they will collaboration to produce switching and router ICs.
EDA startup offers graphical Verilog tool
News & Analysis  
12/29/2003   Post a comment
Aiming to simplify HDL code development and documentation, Orion Consulting Inc. (Austin, Texas) is rolling out Visual RTL, a tool that generates synthesizable Verilog code from graphical logic-block schematics.
SMIC to supply Elpida with 0.1-micron DRAMs
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12/29/2003   Post a comment
Elpida Memory Inc. and SMIC (Semiconductor Manufacturing International Corp.) of Shanghai, China, have signed a foundry contract for DRAM production using a 0.1- micron process.
Toshiba first to market with 512-Mbit XDR DRAM
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12/29/2003   Post a comment
Toshiba Corp. has begun sampling a 512-megabit XDR DRAM part for the first time among Rambus XDR licensees.
Vitesse acquires chip maker Cicada for $66 million
News & Analysis  
12/29/2003   Post a comment
Vitesse Semiconductor Corp. said Monday (Dec. 29) it has acquired communications IC maker Cicada Semiconductor Corp. for approximately $66 million in cash.
How co-verification speeds firmware development
News & Analysis  
12/29/2003   Post a comment
LSI Logic was able to cut its firmware development and verification time in half by using a new methodology centered around hardware/software co-verification. Here's how it works.
Stronger Indonesian currency slows electronic exports
News & Analysis  
12/29/2003   Post a comment
The strengthening of the Indonesian rupiah by more than 5 percent against the U.S. dollar has made Indonesia's exports of electronics and other commodities more expensive and less competitive when compared to other Asian countries.
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