Powerline group breaks two-year deadlock News & Analysis 12/22/2008 Post a comment Thanks to growing momentum behind the ITU G.hn standard covering all wired home networks, the IEEE P1901 has taken a significant step toward defining a standard for competing power line technologies, breaking a two-year deadlock.
Chip gear recovery seen in second half of 2010 News & Analysis 12/22/2008 Post a comment A sustainable recovery in the semiconductor capital equipment market will not begin until the second half of 2010, after the memory sector resumes a supply/demand balance and the general demand for chips recovers, according to a Wall Street analyst.
Updated: Memory spot prices stage rally News & Analysis 12/22/2008 Post a comment Spot prices for memory parts showed some increases for the week ending Dec. 19 on news of DRAM production cutbacks and better-than-expected holiday sales of NAND flash products, according to market research firm Gartner.
Infineon praises 'generous' Saxony for role in Qimonda bail-out News & Analysis 12/22/2008 Post a comment Infineon Technologies AG (Munich, Germany) has successfully negotiated a financing package for its struggling memory making subsidiary Qimonda AG worth 325 million euro (about $450 million). After contentious exchanges between Infineon and the State of Saxony last week, this week Infineon welcomed the contributions from the German and Portuguese authorities as "generous."
Portugal joins Qimonda bail-out worth $450 million News & Analysis 12/22/2008 Post a comment Struggling memory maker Qimonda AG announced Sunday (Dec. 21) that is has arranged a 325 million euro (about $450 million) financing package. In return, Qimonda has promised to continue to develop its R&D and manufacturing sites in Porto, Portugal and Dresden, Germany.
Report calls for restructuring patent office News & Analysis 12/19/2008 Post a comment The U.S. Patent and Trademark Office needs to be overhauled if it is to come to grips with rising backlogs and a perception of declining patent quality, according to a report the U.S. Chamber of Commerce sent to President-elect Barack Obama.
Qimonda, DRAM and bail-outs lead story ranking News & Analysis 12/19/2008 Post a comment Here are the top five online stories for the week beginning Sunday, Dec. 14, as ranked by EE Times Europe readers, up to and including Friday, Dec. 19. The ranking is based on the number of reader "views" or "hits" on a particular article.
Cabot buys Taiwanese CMP firm News & Analysis 12/19/2008 Post a comment Cabot Microelectronics Corp. (Aurora, Ill.), a supplier of chemical mechanical planarization (CMP) polishing slurries, has entered into a definitive agreement to acquire Epoch Material Co. Ltd. for $66 million.
Stop shooting yourself in the chip News & Analysis 12/19/2008 Post a comment It is to be hoped that the season of good will to all will wash over Stanislaw Tillich, the prime minister of German state of Saxony, and Peter Bauer, president and CEO of Infineon Technologies AG, parent of stuggling memory maker Qimonda AG.
Panasonic finally gains control of Sanyo News & Analysis 12/19/2008 Post a comment The on-off sale by Goldman Sachs of its stake in Sanyo Electric Co. to Japanese electronics conglomerate Panasonic Corp. is back on, after Panasonic raised its offer by Yen 1 a share, clearing the way for Japan's largest consumer electronics acquisition.
Sky readying 3D-TV broadcasts News & Analysis 12/19/2008 Post a comment Digital broadcaster Sky has demonstrated and tested the delivery of 3D programming to a television in the U.K. via a high-definition set-top box.
Infineon counterclaims in Volterra patents dispute News & Analysis 12/19/2008 Post a comment Infineon Technologies AG and Primarion, Inc., a wholly owned subsidiary of Infineon Technologies North America Corp. have filed a counterclaim against Volterra Semiconductor alleging fraud on the U.S.
Patent and Trademark Office, as well as for antitrust violations.
Analysis: IC market gloom won't last News & Analysis 12/19/2008 1 comment The semiconductor industry is forecast to experience a steep sales drop in 2009 but the market could witness bounce back strongly in the second half of the year as various stimulus programs, government fiscal actions and improvement in the global economy lift corporate and consumer demand for electronic equipment.
ITC to investigate Spansion complaint against Samsung, others News & Analysis 12/19/2008 Post a comment
The U.S. International Trade Commission has agreed to investigate a complaint by flash memory specialist Spansion against certain flash memory chips made by South Korean giant Samsung Electronics and products based on those chips marketed by some of the biggest names in electronics.
ST, Synopsys partner to deliver complete design flow for 32-nm News & Analysis 12/18/2008 Post a comment Synopsys, Inc. (Mountain View, Calif.) and STMicroelectronics NV (Geneva, Switzerland) have joined efforts to enable the readiness of key components in a 32-nm design flow, including ST's standard cell library for low power and high-performance design, and the support of the latest route rules in Synopsys' IC Compiler Zroute technology.
Argonne supercomputer goes green News & Analysis 12/18/2008 Post a comment Operators of the supercomputing center at Argonne National Laboratory used innovations in both computer architecture and cooling methods to achieve over $1 million in annual energy savings for its IBM Blue Gene/P supercomputer.
STATS ChipPAC cuts 1,600 jobs News & Analysis 12/18/2008 Post a comment Hit hard by the downturn, Singapore's STATS ChipPAC Ltd. plans to cut approximately 1,600 employees, representing approximately 12 percent of the company's global workforce.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.