Samsung pursuit of Apple was abusive, says EC News & Analysis 12/24/2012 7 comments The European Commission has announced the "preliminary view" that Samsung's pursuit of injunctions against Apple in the courts of various European countries over alleged patent infringement is an abuse of its patent position.
TransferJet vs. NFC at CES News & Analysis 12/20/2012 Post a comment Toshiba hopes Samsung’s Galaxy S3 TV ads for NFC technology will boost its TransferJet technology by promoting the advantages of proximity wireless technologies.
Ericsson writes off $1.2 billion News & Analysis 12/20/2012 1 comment Swedish telecommunications equipment company Ericsson will not take over ST's half of loss-making mobile phone chip ST-Ericsson, but will take a $1.2 billion charge in its fourth quarter results.
Imagination wins MIPS bid News & Analysis 12/20/2012 1 comment DSP IP licensor Ceva has announced that it will not rebid against Imagination for processor IP company MIPS Technologies.
Samsung proceeding to expand Austin fab News & Analysis 12/17/2012 8 comments Samsung is proceeding with its investment of $4 billion at its Austin, Texas, site to expand production of mobile application processors beginning the second half of 2013.
Qualcomm, Broadcom climb in chip company ranking News & Analysis 12/17/2012 2 comments Although 2012 is not quite over, market research firm Gartner reckons it can already state that the global chip market will decline by 3 percent in 2012 to $297.6 billion with the top 25 vendors generating 68.2 percent of the total.
Top 10 shifts in chips, comms News & Analysis 12/17/2012 4 comments It was a down year for semiconductors that saw shifting fortunes for many chip and comms companies as growth fled to the extremes of mobile and cloud.
Imagination raises MIPS bid News & Analysis 12/17/2012 1 comment The bidding war between Imagination Technologies and Ceva for MIPS Technologies Inc. has reached $100 million. MIPS is a long-established licensor of processor architectures and IP.
IBM provides Russia with 90-nm process News & Analysis 12/15/2012 2 comments IBM has agreed to help Russia's Angstrem out with a 90-nm manufacturing process as part of a broader agreement on collaboration that will range from mathematics to microelectronics and computer science.
Altera eyes FDSOI process for FPGAs News & Analysis 12/15/2012 4 comments In what could signify a move away from foundry TSMC, Altera has been looking at a fully-depleted silicon-on-insulator manufacturing process as an option for future FPGAs.
FDSOI roadmap renames next node as 14-nm News & Analysis 12/12/2012 5 comments Documents presented at a meeting about fully depleted silicon on insulator (FDSOI) chip manufacturing in San Francisco show that the FDSOI roadmap now omits a 20-nm and goes straight to 14-nm and then on to 10-nm on a two-yearly period.
IBM details 3-D server chip stacks News & Analysis 12/12/2012 4 comments IBM will show work stacking 45-nm server processors with memory and transceivers at IEDM, techniques that could give it significant performance and power gains.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.