HP lays foundation for embedded's future News & Analysis 2/26/1999 Post a comment Beyond the flood of compilers, debuggers and controller cores that will roll out at the Embedded Systems Conference Spring next week, a fresh vision of the embedded future is beginning to take shape. A project still in the research stage at Hewlett-Packard Co. promises to catapult beyond the patchwork-quilt approach of systems-on-a-chip, and for the first time make it economically feasible to quickly roll custom processors, in low volumes, for specialized, deeply embedded applications.
Optical schemes pick up steam in LAN, WAN News & Analysis 2/26/1999 Post a comment A record attendance of 10,000 and a flood of venture-backed startups at the Optic Fibers Conference this week betrayed the rising belief that optical networks will become ubiquitous as we head into the new millennium.
JEIDA adopts digital-interface spec for monitors News & Analysis 2/26/1999 Post a comment The Japan Electronic Industry Development Association has approved the Digital Interface Standards for Monitor (DISM) as the JEIDA-59-1999 standard. DISM defines the connection among video boards in a personal computer and the monitor display.
Philips bids for VLSI Technology News & Analysis 2/26/1999 Post a comment Royal Philips Electronics has made what is being seen as a friendly bid for VLSI Technology Inc. In a proposal that values VLSI at about $800 million, Philips is offering to pay $17 a share for the U.S. ASIC vendor approximately a 60 percent premium over VLSI's closing NASDAQ share price on Thursday, Feb. 25.
Wireless transceivers support HomeRF spec News & Analysis 2/26/1999 Post a comment New 2.4-GHz integrated transceivers announced at the Wireless Symposium this week show that manufacturers are eyeing the potentially explosive wireless home-networking consumer market. Offerings from Harris Semiconductor (Melbourne, Fla.), National Semiconductor (Santa Clara, Calif.) and Philips Semiconductors (Sunnyvale, Calif.) demonstrated an affinity for wireless consumer schemes, though they were not specifically intended for products based on an emerging HomeRF specification.
Standards dispute hits IC physical design News & Analysis 2/26/1999 Post a comment Attempts to link logical and physical design ran into partisan squabbling this week, as a group of Cadence Design Systems Inc. competitors formed a new standards organization that calls on Cadence to provide an open, textual version of its Library Exchange Format (LEF). The organization, Open Physical Exchange Format (OPEF), claims that Cadence's plan to provide an LEF applications programming interface (API) is "anti-competitive and inadequate."
Philips Seeks To Buy VLSI News & Analysis 2/26/1999 Post a comment Dutch electronics giant says the acquisition would strengthen its semiconductor portfolio and boost its presence in the United States.
GaAs foundry open to orders News & Analysis 2/26/1999 Post a comment Network Device Inc. (NDI), a startup backed by large investors from Taiwan, has emerged as the world's first pure-play foundry making gallium arsenide (GaAs) chips. NDI has begun taking its first orders for its newly-completed, 4-inch GaAs wafer-processing plant in Sunnyvale, Calif.
Philips seeks to buy VLSI Technology News & Analysis 2/26/1999 Post a comment Royal Philips Electronics NV here today announced a proposal to buy VLSI Technology Inc. (San Jose, Calif.) for $17 a share in cash, making the value of the offer about $806 million.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.