Palm cuts workforce by 19 percent News & Analysis 2/28/2003 Post a comment MANHASSET, N.Y. Palm Inc. (Milpitas, Calif.) slashed its overall workforce by 19 percent, or about 250 employees, largely in the United States during its fiscal third quarter.
Contest offers free layout or schematic editor News & Analysis 2/28/2003 Post a comment SAN MATEO, Calif. One-man EDA company Stabie-Soft Inc. is running a contest in which the winner gets his or her choice of Stabie-Soft's layout or schematic editor. The winner gets their choice of a license for the Slam layout editor valued at $3,500, or the Scheture schematic editor valued at $1000, and can also choose the platform -- Linux or Solaris.
Cisco creates wireless-LAN adapter extensions News & Analysis 2/28/2003 Post a comment Cisco Systems Inc. has announced client-side wireless local-area network adapter extensions that will address the security and network-management concerns that have slowed WLAN deployment to date, the company said. Intended as augmentations to the current IEEE 802.11 standard and its associated Wi-Fi interoperability testing, the enhancements have garnered support from leading WLAN semiconductor suppliers as well as PC and mobile-device OEMs.
90-nm design still a year and some big hurdles away
News & Analysis 2/28/2003 Post a comment IBM believes it will be first. Intel will start before the end of the year. Texas Instruments will start early next year. Others will follow. Leading chip makers are working to move 90-nanometer process technologies into volume production, and several are already offering samples of 90-nm designs. But the hurdles of 90-nm design and production are still significant, according to a panel of industry executives convened last week.
No end in sight for DDR price meltdown News & Analysis 2/28/2003 Post a comment Contract prices for mainstream DDR SDRAM have plunged 25% to 33% in a month amid a glutted global market. Although DDR prices have been declining steadily from a peak in November, the latest sharp drop was welcomed by OEM buyers caught in their own competitive product pricing squeeze.<
Rival groups aim for auto 'by-wire' spec News & Analysis 2/28/2003 Post a comment TTA Group and the FlexRay Consortium, two key organizations battling for the high ground of the automotive "by-wire" arena, said today that they now hope to agree on a common safety-critical standard.
Infineon CEO backs tech transfers to China News & Analysis 2/28/2003 Post a comment Infineon Technologies' top boss said last week that the most advanced semiconductor production technologies should get a green light for export to China. "Effectively, China needs to be up to speed just like every other region," said chief executive officer Ulrich Schumacher.
SafeNet acquires assets of Raqia Networks News & Analysis 2/28/2003 Post a comment PARIS SafeNet, a provider of private and public network security technologies based in Baltimore, MD., announced today (Feb. 28th) that it has purchased the technology assets of Raqia Networks, a Newton, Mass.-based fabless chip company which specializes in the development of system-on-a-chip and co-processors for content inspection.
Consolidation a hot potato in EDA News & Analysis 2/28/2003 Post a comment Debate over the need for vendor consolidation in the design automation industry tested the tempers of EDA chief executives at the Design and Verification Conference here last week, or at least those who dared attend.
EDA divided on SystemVerilog News & Analysis 2/28/2003 Post a comment Enthusiastic support for SystemVerilog alternated with undercurrents of concern at last week's DVCon Design and Verification Conference in San Jose, Calif.
Package twist stacks dice against SoCs News & Analysis 2/28/2003 Post a comment Stacked-die packaging in which IC dice are literally stacked one on top of the other, electrically connected and encapsulated has taken root in the cell-phone handset market as a way to increase memory capacity while reducing footprint. But now the technology is growing in complexity and appears on the way to becoming a serious alternative to system-level IC design.
Lithography roadmap remains unsettled News & Analysis 2/28/2003 Post a comment Papers at the Future of Lithographic Systems track at SPIE here Thursday (Feb. 27) revealed a far from settled roadmap for production lithography, with serious alternative paths branching off from the main road as early as the 90 nm process node.
Small fields save bucks, vendors argue News & Analysis 2/28/2003 Post a comment A paper presented Friday (Feb. 28) at the SPIE conference disclosed recent work in support of the movement for small-field lithography. Co-authored by researchers from Numerical Technologies Inc. (San Jose, Calif.) and Photronics, Inc. (Dallas), the paper presents quantitative arguments in favor of using only part of the available reticle on advanced steppers.
Swedish design firm offers 'regression analyzer' News & Analysis 2/28/2003 Post a comment Aiming to automate the process of managing simulation runs over multiple CPUs, the ISS Group, a design services company in Stockholm, Sweden, has introduced a product called Rose. It works with Verisity's Specman offering and supports a random-based testing methodology.
Equipment makers dip toe in immersion litho News & Analysis 2/28/2003 Post a comment Lithography vendors at the SPIE Microlithography conference here last week said they are getting their feet wet with a technology that could possibly be the industry's next breakthrough immersion lithography.
Mobile gaming drives plans for 3-D graphics News & Analysis 2/28/2003 Post a comment Lured by the siren call of mammoth shipments for cellular handsets, graphics companies will come to the Game Developers Conference (GDC) in San Jose, Calif., this week to ponder technology game plans for the phone-based game market.
PDA-Markt soll wieder wachsen News & Analysis 2/28/2003 Post a comment Niedrigere Preise, verbesserter Leistungsumfang und die Kompatibiltät mit Wireless- und Multimedia-Technologien werden den PDA-Markt in diesem Jahr wieder auf Wachstumskurs bringen. Das hat das Marktforschungsinstitut InStat/MDR ermittelt.
Flomerics set to combine EMC and thermal analysis News & Analysis 2/28/2003 Post a comment LONDON -- Flomerics Ltd., a provider of thermal and electromagnetic compatibility (EMC) simulation software for electronics systems, is planning to show visitors to the DATE exhibition an EDA tool that combines both types of simulation in a single piece of software.
Application processors to drive handset IC growth News & Analysis 2/28/2003 Post a comment Applications processors represent the biggest opportunity for semiconductor manufacturers targeting the mobile handset business, according to a just published report from market research group Allied Business Intelligence (ABI).
Ericsson backs microwave link for faster 3G roll-out News & Analysis 2/28/2003 Post a comment Ericsson has developed a scalable microwave aggregation node for mobile networks which, according to the company's head of research, has the potential to increase significantly the pace at which operators can roll out 3G networks. The traffic node is already undergoing trials with several operators, and is due to be commercially available during the third quarter of this year.
NEC présente MRAM pour mobiles à l'ISSCC News & Analysis 2/28/2003 Post a comment NEC a profité de l'International Solid-State Circuit Conference (ISSCC), à San Francisco, pour présenter une nouvelle solution de mémoire qui remplacerait les mémoires DRAM et flash dans les téléphones mobiles.
ARM trotzt der Krise News & Analysis 2/28/2003 Post a comment Gut gehalten hat sich der Prozessortechnologie-Lieferant ARM Holding im Abschwungjahr 2002: Während viele Unternehmen in diesem Segment ihren Umsatz einbrechen sahen, konnte ARM immerhin um 3 Prozent wachsen. Und die Zukunft sieht man bei ARM auch nicht gar so grau in grau: Die gut gefüllte Produktpipeline der ARM-Lizenznehmer lasse eine stetige Zunahme der Lizenzeinnahmen erwarten.
Aptix emulation supports ARM926, ARM11 News & Analysis 2/28/2003 Post a comment Aptix Corp., a supplier of FPGA-based emulation systems, plans to demonstrate the ability to emulate the ARM926EJ-S microprocessor core and PrimeXsys peripherals on an Aptix Software Integration Station at the DATE exhibition and conference. Aptix has also hosted RTL code for the ARM11 core on an Aptix emulator, the company said.
Infineon und ProMos begraben das Kriegsbeil News & Analysis 2/28/2003 Post a comment Just zu dem Zeitpunkt, an dem die Infineon Technologies AG und ProMos Technologies bereit schienen, ihre unschöne Scheidungsschlacht zu Ende zu führen, haben die beiden entfremdeten Partner einen Kurswechsel vollzogen und bei einem Treffen einen erneuten Versöhnungsversuch unternommen.
Le courant de fuite fait obstacle à la complexité des puces News & Analysis 2/28/2003 Post a comment Au cours des dix prochaines années, l'industrie des semi-conducteurs devra réduire le courant de fuite de deux ordres de grandeur dans les conceptions de puce ou bien faire face à une interruption dans la complexité anticipée des puces, déclare le professeur Takayasu Sakurai de l'Université de Tokyo dans son allocution principale lors de l'International Solid-State Circuits Conference (ISSCC) sur les circuits à semi-conducteurs, le lundi 10 février.
Quad-band PA module News & Analysis 2/28/2003 Post a comment The RF3133 power amplifier operates in the 850, 900, 1800, and 1900 MHz GSM bands. It operates from a +3V supply and delivers 55% typical efficiency in the 850 and 900MHz bands.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.