Report: Taiwan seeks merger with restructured Elpida News & Analysis 2/29/2012 1 comment Taiwan's government said it would continue to push for Taiwanese DRAM makers to consolidate with Japan's Elpida Memory if the firm is restructured after filing for bankruptcy, according to an Associated Press report.
Intel creates $100 million automotive fund News & Analysis 2/29/2012 7 comments Intel Capital, the venture capital arm of Intel, said it has created a $100 million investment fund to help accelerate innovation and the adoption of new technology and services in the automotive industry.
MIPS shows off $99 tablet at MWC News & Analysis 2/29/2012 8 comments MIPS Technologies, which makes the processors that power appliances like TVs and DTV boxes has come out with its own $99 tablet running Google’s Android 4.0 (Ice Cream Sandwich).
Video: Android booth at MWC News & Analysis 2/29/2012 Post a comment Google’s Android Booth at MWC 2012 is one of the major hotspots at the mobile show this year, attracting tens of thousands of visitors daily, most on the lookout for Google’s signature Android pins.
Mentor achieves first $1 billion sales year News & Analysis 2/29/2012 2 comments As expected, Mentor Graphics reported that its annual sales eclipsed $1 billion for the first time ever, as the company reported sales and earnings that beat analysts' expectations for its fiscal fourth quarter.
Sensor fusion enables e-compass News & Analysis 2/29/2012 1 comment Sensor fusion algorithms are being offered for free to users of Freescale's accelerometers and magnetometers corrects for magnetic interference in the environment.
Intel, AMD pull out of WSTS News & Analysis 2/28/2012 15 comments Intel and AMD confirmed that they have left the World Semiconductor Trade Statistics organization, which publishes widely cited monthly reports on global semiconductor sales.
Google's Schmidt talks up the transformative power of connectivity News & Analysis 2/28/2012 5 comments Rather than spend a lot of time talking about Google, Android OS or even recent changes in the company's privacy policies, Executive Chairman Eric Schmidt used his Mobile World Congress keynote to highlight the need for bringing greater Internet connectivity to the world's most under-served markets.
Initiative on 450-mm moves gets Europe's full attention News & Analysis 2/28/2012 Post a comment At ISS Europe 2012 here semiconductor chip, tools and material companies concluded 450mm wafer production will catapult Europe back on the competitive stage along the U.S. and Asia to produce leading-edge semiconductors sometime in the next 15 years.
Intel's new partnerships and processors for the mobile space News & Analysis 2/28/2012 2 comments Intel’s foray into the smartphone space is a “marathon, not a sprint,” according to the firm’s CEO Paul Otellini.
Speaking at a company press conference on Monday, where the firm announced new partnerships with Orange, Lava International Ltd., ZTE and Visa, Otellini reminded attendees that Intel was no stranger to the mobile market, having been involved in RF for many years.
IBM reports progress on quantum computing News & Analysis 2/28/2012 12 comments The last major engineering hurdle to quantum computers—millisecond coherence times—has been surmounted by researchers at IBM Research, making commercialization of the technology possible "within our lifetimes," according to Matthias Steffen, manager of IBM's Experimental Quantum Computing group.
Facebook joins W3C to combat browser fragmentation News & Analysis 2/28/2012 3 comments At Mobile World Congress (MWC) Facebook said it would be joining over 30 device manufacturers, carriers, and developers in an industry-wide effort to help accelerate the improvement and standardization of mobile browsers.
Nokia announces camera phone with 41 megapixel sensor News & Analysis 2/27/2012 18 comments A notable announcement that took those attending today's press conference by surprise was about the new Symbian camera phone that could well up the mobile phone game: Nokia's new 808 PureView, with a jaw-dropping 41 Megapixel sensor. It's expected to start shipping in May with a hefty retail price tag of 450 euro.
Mindspeed/Astri TD-LTE demo a first at MWC News & Analysis 2/27/2012 2 comments Mindspeed Technologies, Inc. and Hong Kong Applied Science and Technology Research Institute (ASTRI) are demonstrating what they claim is the industry’s first commercial-grade, production-ready time division long-term evolution (TD-LTE) small cell reference design.
Silicon and IMEC to cooperate on RF R&D at 28nm News & Analysis 2/27/2012 Post a comment HiSilicon, a China-based company, and European R&D consortium IMEC have signed a strategic research collaboration to develop RF transceiver architectures for next-generation mobile terminals using 28nm process technology.
SEMI book-to-bill improves for fourth straight month News & Analysis 2/24/2012 2 comments The three-month average book-to-bill ratio for North American semiconductor equipment manufacturers improved to 0.95 in January, the fourth consecutive month of improvement after six consecutive months of declines, according to the fab tool vendor trade group SEMI.
Micron increases stake in Inotera News & Analysis 2/24/2012 5 comments Micron Technology is increasing its stake in Inotera Memories, its Taiwanese DRAM joint venture with Nanya Technology, according to a regulatory filing made by Inotera this week.
Qualcomm chooses MasterImage 3D for development tablet News & Analysis 2/24/2012 5 comments Just ahead of Mobile World Congress in Barcelona next week, MasterImage said its glasses-free 3-D screen had been selected by the mobile chip giant for a 10-inch Mobile Development Platform based on Qualcomm’s Snapdragon S4 processor.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.