Breaking News
News & Analysis, Opinion, Teardown
Content posted in February 2013
Page 1 / 2   >   >>
China's cyberespionage will continue unabated, say experts
News & Analysis  
2/28/2013   7 comments
Security experts at the RSA Security Conference weigh in on reports of information-stealing attacks and cyberespionage by China.
Intel will make 14nm FPGAs for Altera
News & Analysis  
2/28/2013   2 comments
Intel will let Altera make FPGAs in its 14nm FinFET process in a deal that turns up the heat on TSMC in foundry and Xilinx in high-end FPGAs.
AMD settles patent dispute with Tessera
News & Analysis  
2/28/2013   Post a comment
Agreement settles pending litigation between two firms. Financial terms not disclosed.
Slideshow: Samsung cagey on smartphone SoC at ISSCC
News & Analysis  
2/27/2013   8 comments
Samsung faced down archrivals at ISSCC but showed few details about its Exynos 5 Octa, while Renesas and Mediatek took more open approaches.
Quick links to DESIGN West classes
News & Analysis  
2/27/2013   Post a comment
The three new "From Napkin Sketch to Shenzhen" tracks are among 17 other tracks at DESIGN West 2013.
Wolfson and Sensory demonstrate world's lowest-power speech recognition solution for mobile
News & Analysis  
2/27/2013   Post a comment
Wolfson Microelectronics has worked with Sensory, a leader in speech technologies for consumer electronics to implement Sensory's TrulyHandsfree Voice Control and audio detect front-end on Wolfson’s latest ultra-low power platforms for mobile phone audio channel processing.
Let LTE and quad-core apps processor battle begin
News & Analysis  
2/27/2013   Post a comment
As the Mobile World Congress raises its curtain next week, both Nvidia and Marvell are rushing to announce new smartphone ICs with the mobile industry’s two new “must-have features”: quad-core and LTE modem.
Android, FreeRTOS top EE Times' 2013 embedded survey
News & Analysis  
2/27/2013   15 comments
Android has become the most popular third-party operating system for embedded applications according to a survey of engineers – but as they become more familiar respondents may be starting to shy away from the OS for future projects.
Firefox goes mobile, LG changes channels for WebOS
News & Analysis  
2/26/2013   9 comments
Mozilla shows off FireFox OS and its partnership with four OEMs and 18 carriers; LG Electronics changes channels for HP's WebOS.
Intel to make 14-nm FPGAs for Altera
News & Analysis  
2/26/2013   39 comments
Intel will build FPGAs for Altera in its 14-nm FinFET process in a deal that turns up the heat on TSMC in foundry and Xilinx in high-end FPGAs.
Sequans gung-ho for LTE Broadcast
News & Analysis  
2/26/2013   3 comments
LTE Advanced enables operators to get into LTE Broadcast -- multicasting popular content simultaneously to multiple devices.
What’s under the hood of Sony's PS4?
News & Analysis  
2/25/2013   9 comments
Although Sony did not show the PS4 game console, the spec sheets provide a glimpse of what’s inside in each unit.
Big Data streamlines fabs
News & Analysis  
2/25/2013   2 comments
Streamlined analytics in Microsoft's structured query language cut processing time for wafer fab data at AMD by 90 percent plus boost energy efficiency 10-times at Samsung.
Intel upgrades 32-nm SoC for smartphones
News & Analysis  
2/25/2013   5 comments
Intel will show an upgraded 32-nm processor for smartphones at Mobile World Congress and talk about an upcoming new 22-nm Atom core and SoC.
DESIGN West: Livin' La Vida Mobile
News & Analysis  
2/22/2013   1 comment
MLove Confestival founder Harald Neidhardt foresees "empathetic" electronics, which adapt their functions users' environments.
Slideshow: ISSCC spotlights nanotubes, wireless comms
News & Analysis  
2/22/2013   9 comments
Carbon nanotubes, video processing, 60 GHz and processors featured among the highlights from this year's ISSCCC presentations.
Baidu taps Marvell for ARM storage server SoC
News & Analysis  
2/20/2013   8 comments
China’s Internet search giant will use a Marvell Armada XP ARM-based SoC to power a storage server, one of the first big design wins for an ARM-based server SoC.
Linaro group gives ARM a hand in networking
News & Analysis  
2/20/2013   Post a comment
The newly formed Linaro Networking Group will develop for ARM low-level Linux code for virtualization, real-time tasks and packet processing.
App developers to be given Google Glasses
News & Analysis  
2/20/2013   6 comments
Google is developing a version of its prototype wearable computer that it will share with application developers in an effort to spread interest and create an ecosystem for the concept.
Six firms dominate 300-mm wafer fab capacity
News & Analysis  
2/20/2013   3 comments
Memory and foundry chip makers dominate the upper echelons of IC manufacturers ranked by 300-mm wafer production capacity, with the top six vendors holding nearly 75 percent.
China's Godson processors to power servers in 2014
News & Analysis  
2/20/2013   11 comments
Loongson Technology is sampling a 32-nm Godson server processor and plans to ship a 28-nm version this fall to as many as 10 server makers in China.
Apple processors: Designed differently but here to stay
News & Analysis  
2/20/2013   31 comments
What's next in Apple's iPhone- and iPad- powering A-series processor family? Two experts prognosticate.
Apple processors: Designed differently but here to stay
News & Analysis  
2/20/2013   30 comments
What's next in Apple's iPhone- and iPad- powering A-series processor family? Two experts prognosticate.
DESIGN West: How to win with Kickstarter
News & Analysis  
2/19/2013   9 comments
Learn from entrepreneur Bob Baddeley's failure and his friend's success as he talks crowd-sourced funding for startups.
Marvell rolls quad-core IC for 3G
News & Analysis  
2/19/2013   1 comment
Marvell’s new single-chip quad-core processor is a low-cost 3G platform designed for both smartphones and tablets.
ISSCC: ASML says EUV best option at 10nm
News & Analysis  
2/19/2013   17 comments
An ASML executive gave an update on the progress with extreme ultraviolet lithography systems and "cautious" plans for 450mm wafers in a keynote at ISSCC.
Carver Mead: Finish the physics revolution
News & Analysis  
2/19/2013   35 comments
Veteran semiconductor academic exhorts chip designers to question orthodox thinking in physics at a packed ISSCC keynote presentation.
Microsoft machine learning takes on 'big data'
News & Analysis  
2/18/2013   2 comments
Software giant celebrates 'big data' by describing how analytic software running on Windows servers is already extracting business intelligence.
Former Freescale CEO takes Dialog director's seat
News & Analysis  
2/18/2013   Post a comment
European mixed-signal, power and RF chip company appoints Richard Beyer and Michael Cannon as non-executive directors.
TransferJet to demo speedy wireless at MWC
News & Analysis  
2/18/2013   5 comments
Japanese companies are set to demonstrate speedy downloads of movies, music and e-books to smartphones and tablets at the Mobile World Congress in Barcelona.
Slideshow: Google updates fiber offer
News & Analysis  
2/18/2013   5 comments
Milo Medin, former cable Internet entrepreneur and head of the Google Fiber program, gave engineers an update on the search giant's progress testing the waters as a carrier.
Tensilica vs. Ceva in imaging/vision IP core battle
News & Analysis  
2/17/2013   Post a comment
Rapidly evolving embedded vision algorithms are opening up a new battleground for DSP core IP companies in mobile handsets, automotive and video products.
MEMS market growth accelerating
News & Analysis  
2/16/2013   3 comments
Additional MEMS sensor applications will emerge for mobile handsets and camera phones helping to drive MEMS growth towards double-digital percentage annual growth, says market researcher.
SEMI adds startup forum to Semicon West
News & Analysis  
2/15/2013   1 comment
Concerned that a lack of funding for startups could jeopardize the fortunes of its members, industry body SEMI has announced a half-day conference called the Silicon Innovation Forum.
Case studies highlight temperature solutions for 3-D ICs
News & Analysis  
2/15/2013   1 comment
Real case studies of temperature solutions for chips and transient responses of power mode changes in 3-D ICs the chip design flow are presented at DesignCon 2013.
Intel research improves moisture-tracking in PCBs
News & Analysis  
2/15/2013   2 comments
A senior Intel Corp. executive raises moisture sensitivity concerns in PCBs and explains Intel’s approach based on determining and controlling PCB insertion loss.
Slideshow: Berkeley wields big data to beat cancer
News & Analysis  
2/15/2013   8 comments
Researchers including Dave Patterson (pictured) showed progress in gene-based analysis of cancer, the Internet of Things and computer theory at an annual UC Berkeley event.
Indian chip industry body broadens remit
News & Analysis  
2/15/2013   2 comments
At its annual Vision Summit held in Bangalore the Indian Semiconductor Association has changed its name to the Indian Electronics and Semiconductor Association.
SK Telecom sets up Silicon Valley incubator
News & Analysis  
2/15/2013   1 comment
The South Korean giant that now own Hynix will open a small incubator in Silicon Valley for up to four startups in chips, networking or medical electronics.
Applied Materials' sales top estimates
News & Analysis  
2/14/2013   Post a comment
Chip gear vendor's CEO reports progress on re-org, expresses optimism about 2013.
Tower sees soft Q1, then growth
News & Analysis  
2/14/2013   Post a comment
Specialist foundry made a net loss in 2012 but after weak first quarter, due to customer transition in Japan, sees growth through 2013.
Ericsson demos Gbit LTE, talks OpenFlow at MWC
News & Analysis  
2/14/2013   Post a comment
Firm plans to show capabilities to deliver Gbit/s data rates to future handsets and embrace OpenFlow in hybrid software-defined networks.
Clouds shift in Taiwan’s favor, says Quanta exec
News & Analysis  
2/14/2013   8 comments
The head of the cloud computing group at Quanta shines a light on Taiwan’s growing server makers and what they want in software and silicon.
Intel discloses Internet TV service plan
News & Analysis  
2/14/2013   31 comments
Chip giant's plan goes far beyond Google TV, involving both the consumer box and the service business.
Ten chip sectors tipped to grow
News & Analysis  
2/13/2013   2 comments
Tablet and cellphone processors, NAND flash memory and telecom-specific ICs are set to enjoy best growth in 2013, says IC Insights.
Agilent gives Georgia Tech $90 million in software
News & Analysis  
2/13/2013   Post a comment
Agilent Technologies announced the largest software donation in its relationship with Georgia Institute of Technology: so why Georgia Tech, and why now?
Agilent expert explains DDR4 timing
News & Analysis  
2/12/2013   Post a comment
JEDEC board member Perry Keller, who's also manager for the digital memory applications program at Agilent Technologies, talked about the latest DDR iteration at DesignCon.
Slideshow: IBM outlines fab future beyond FinFETs
News & Analysis  
2/12/2013   28 comments
Foldable wafers, CMOS continuing to scale, and double patterning tricks were spotlighted at the recent Common Platform Technology Forum.
TSMC enjoys sales bonanza
News & Analysis  
2/8/2013   6 comments
Taiwanese foundries TSMC and UMC both enjoyed a sequential jump in sales in January but market leader TSMC's sales growth was stellar.
Silicon photonics vendors face tough call at IEEE
News & Analysis  
2/8/2013   6 comments
An IEEE group hopes to take a first stab at a key standard for 4 x 25G optics by May, but competing silicon photonics wannabes are divided over modulation schemes.
Page 1 / 2   >   >> Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

Brought to you by:

Like Us on Facebook
Special Video Section
The LTC2380-24 is a versatile 24-bit SAR ADC that combines ...
In this short video we show an LED light demo to ...
Wireless Power enables applications where it is difficult ...
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
The LT8602 has two high voltage buck regulators with an ...
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...