Troubled Brooks hit by shareholders suit News & Analysis 5/31/2006 Post a comment Troubled fab-equipment automation specialist Brooks Automation Inc. announced that it has been notified that a shareholder derivative lawsuit was filed against Brooks in the Superior Court of the Commonwealth of Massachusetts on May 23.
Ceragon Networks doubles Gigabit Ethernet speed News & Analysis 5/31/2006 Post a comment Calling it a breakthrough in wireless Gigabit Ethernet, Israel-based Ceragon Networks Ltd. has introduced a product that doubles the speed of wireless communications for wireless and cellular carriers that want to provide data-rich services such as triple-play.
Tronic’s Microsystems raises capital and extends capacity News & Analysis 5/31/2006 Post a comment Nearly three years have passed since Tronic’s Microsystems, French contract manufacturer of custom MEMS (micro-electromechanical systems) components, hit the news wire with the grand opening of its manufacturing site near Grenoble. The company is now coming back to the front stage with a series of announcements, including a 1.7 million euro round of funding and an extension of its capabilities for design, frontend/backend manufacturing and electronic interfacing for MEMS components.
Global PCB market continues to grow News & Analysis 5/31/2006 Post a comment In 2005, the global printed circuit board market has grown by 5,7 percent to a volume of $ 38,5 billion. For 2006, the party will continue, estimates Zentralverband Elektrotechnik und Elektronikindustrie (ZVEI), a German industry association that covers the electronics industry. For the year ahead, the association expects a growth of more than 6 percent. The bad news is that this growth will not be achieved in Europe.
Toshiba collaborating with DFM startup News & Analysis 5/31/2006 Post a comment Toshiba will apply startup Takumi Technology's automated layout modification methodology to its mask data preparation design flow in advanced IC manufacturing under the terms of a collaborative agreement between the two companies.
SMIC gains loan for 200-mm Tianjin fab News & Analysis 5/31/2006 Post a comment Responding to a growing demand for trailing-edge processes, Chinese silicon foundry provider Semiconductor Manufacturing International Corp. (SMIC) is beefing up its 200-mm fab capacity.
Sycamore subpoenaed for stock option practices News & Analysis 5/31/2006 Post a comment Sycamore Networks Inc. has been served a grand jury subpoena by the U.S. Attorney's Office for the District of Massachusetts, requesting documents related to an ongoing investigation of the company’s stock option practices, the company reported in its 8-K regulatory filing dated May 30.
Chipidea extends USB controller core IP News & Analysis 5/31/2006 Post a comment Analog and mixed-signal semiconductor intellectual property (IP) group Chipidea has started sampling a USB controller core, a block designed to complement the company’s range of USB physical layer transceiver (PHY) IP.
Finland, Israel form $12.8 million R&D fund News & Analysis 5/31/2006 Post a comment During a visit by a delegation of Finnish industrialists and investors to Israel, the two countries announced the formation of an R&D fund called Finland Israel Technology, according to a Globes online report.
AMCC reviews stock option practices News & Analysis 5/31/2006 Post a comment The list continues to grow in the so-called stock option scandal in the semiconductor industry. Applied Micro Circuits Corp. Wednesday (May 31) announced that it is reviewing the company's historical stock option grant practices and related accounting.
Survey: HSDPA networks to double by end 06 News & Analysis 5/31/2006 Post a comment The number of High Speed Downlink Packet Access (HSDPA) enabled third generation mobile networks deployed has doubled over the past six months and reached 100, spread across 49 countries, mostly in Europe.
Panelists explore system-to-silicon link News & Analysis 5/31/2006 Post a comment Panelists at the Medea+DAC conference in Germany offered suggestions for designing system-level silicon, including formal specifications, abstracted hardware-software interfaces and the use of regularity in silicon fabrics.
Samsung launches first European T-DMB phone News & Analysis 5/31/2006 Post a comment Samsung Electronics said it is supplying terrestrial digital multimedia broadcasting (T-DMB) phones to German mobile carrier Debitel. The phones will be used to launch Europe’s first commercial DMB-based mobile TV service.
Vodafone unveils convergence plans News & Analysis 5/31/2006 Post a comment Mobile giant Vodafone Group plc has unveiled its plans to enter the highly competitive fixed broadband market, kept analysts guessing on its M&A plans, particularly regarding Verizon Wireless , and posted an annual net loss of £21.8 billion ($40.9 billion).
Leoni acquires Swiss cable specialist Studer News & Analysis 5/31/2006 Post a comment Cable harness and on-board electrical supply systems vendor Leoni AG has agreed to acquire Swiss competitor Studer Draht- und Kabelwerk AG. The take-over, which is subject to approval by the respective anti-trust authorities, will enable Leoni to access Studer's worldwide sales network and hence new markets.
Tensilica touts contributions to EDA reference books News & Analysis 5/30/2006 Post a comment Book publisher Taylor & Francis is offering a two-book reference that provides an overview of the design automation algorithms, tools and methodologies used to design integrated circuits, according to Tensilica, employer of technologists who made major contributions to the books.
IXYS, Atmel release light ballast demo kits News & Analysis 5/30/2006 Post a comment IXYS released dimmable and non-dimmable demo kits for light ballast applications. These kits are the result of the cooperation between IXYS and Atmel Corp. to develop design tools and speed up the implementation of ballast solutions for the lighting market, IXYS said.
IDT-chef till Xelerated News & Analysis 5/30/2006 Post a comment Den tidigare chefen hos IDT, Bill Franciscovich, tar över rollen som ansvarig för den globala försäljningen på Xelerated.
Asyst's CFO leaving for Agilent spinout News & Analysis 5/30/2006 Post a comment Robert Nikl has resigned his position as chief financial officer at Asyst Technologies and accepted a similar position with Verigy, the planned test equipment spinoff from Agilent Technologies.
Memory Bulletin: NAND glut seen in '06 News & Analysis 5/30/2006 Post a comment There is expected to be a slight oversupply of NAND-based flash memories in the marketplace for 2006, although supply is projected to become tight in the second half of this year, according to an analyst.
Universal Display, Mitsubishi team on OLED materials News & Analysis 5/30/2006 Post a comment Universal Display Corp. has signed an agreement with Mitsubishi Chemical Corp. and Mitsubishi Chemical Group Science and Technology Research Center to collaborate on developing materials for phosphorescent OLED displays accessible through ink-jet printing.
Free Job Site to Help U.S. Veterans Find Jobs News & Analysis 5/30/2006 Post a comment OperationHeroforHire.com is a special job site that enables veterans to quickly identify employers who are sensitive to their employment needs and apply for positions in a variety of fields and locations in real time.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.