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Content posted in May 2010
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Intel preps many-core 'Knights Corner' processor
News & Analysis  
5/31/2010   1 comment
Intel Corp. has said it plans to offer many-core processors targeting certain applications in high performance computing. The first product, codenamed "Knights Corner," will be implemented on Intel's 22-nm manufacturing process and integrate more than 50 processors.
Strong April chip sales drive prediction higher
News & Analysis  
5/31/2010   Post a comment
Actual global chip sales were $23.41 billion in April, according to the European Semiconductor Industry Association, which quotes numbers from World Semiconductor Trade Statistics. Cowan LRA model moves annual prediction up.
April averaged chip sales beat expectations
News & Analysis  
5/31/2010   Post a comment
The three-month average of global sales of semiconductors for April was $23.579 billion, up 2.25 percent compared with the previous month and up 50.4 percent compared with the year before, according to the European Semiconductor Industry Association.
BOARDS - CANbus PC/104-Plus board consumes less than 2W
News & Analysis  
5/31/2010   Post a comment
Advanced Micro Peripherals' new CAN4000-8S PC/104-Plus board has 4 isolated CANbus channels and 8 RS-422/485 ports and consumes less than 2W.
BOARDS - COM Express modules are compact, low power
News & Analysis  
5/31/2010   Post a comment
congatec's new COM Express modules conga-CS45, conga-BS45 and conga-BM45 have 13 variants and re compact, low power.
Saxony agrees to aid Abu Dhabi with technology
News & Analysis  
5/31/2010   Post a comment
The German state of Saxony has entered into a Memorandum of Understanding (MoU) with Abu Dhabi's Executive Affairs Authority agreeing to set up opportunities to share and exchange knowledge and expertise in advanced technology R&D, in particular in microelectronics, according to the Advanced Technology Investment Co.
Startup proposes SOI JFETs for low power
News & Analysis  
5/31/2010   Post a comment
SuVolta Inc., a startup formerly known as DSM Solutions Inc., has revealed some details of the company's plan to achieve low power IC operation through the use of complementary junction FET technology.
PicoChip cofounder joins antenna, backhaul firm
News & Analysis  
5/31/2010   Post a comment
Peter Claydon, co-founder and former chief operating officer of PicoChip Design Ltd., has joined Deltenna Ltd., a developer of wireless communications systems, according to a report in the Silicon South West newsletter.
Strengths and weaknesses of common resistor types
News & Analysis  
5/31/2010   3 comments
Understand the key parameters of this vital passive component and how they trade off against each other
Hynix raises capex, breaks with Numonyx
News & Analysis  
5/31/2010   Post a comment
South Korean memory maker Hynix Semiconductor Inc. has said it plans to raise its capital expenditure for 2010 to 3.05 trillion won (about $2.5 billion) from an earlier planned 2.3 trillion won (about $1.9 billion). The company is also planning to spend 522 trillion won (about $425 million) to buy Numonyx NV out of a joint-venture wafer fab in China.
Leaders lost share in 2009 wafer market, says Gartner
News & Analysis  
5/31/2010   Post a comment
Market leaders lost out in the supply of silicon wafers to chip makers in recession-hit 2009, according to market research company Gartner Inc (Stamford, Conn.). Worldwide silicon wafer demand in 2009 was $7.23 billion, down 38.5 percent in comparison with 2008, the company said.
China taps Nvidia for world's second biggest computer
News & Analysis  
5/31/2010   1 comment
Using Intel and Nvidia processors, a Chinese computer maker has installed in Shenzhen what experts say theoretically is the fastest supercomputer in the world, an indication both of the rise of China and of graphics processors as a growing ingredient in high-performance but relatively low power systems.
BYD, Daimler form electric car JV in China
News & Analysis  
5/31/2010   Post a comment
China's BYD Co. Ltd. and Germany's Daimler AG have formed a joint venture called Shenzhen BYD Daimler New Technology Co. Ltd., which will develop an electric vehicle for China.
Honda shuts China plants amid strike
News & Analysis  
5/30/2010   Post a comment
China continues to experience labor problems at foreign firms.
ICs - ETG offers CANopen drive profile update
News & Analysis  
5/29/2010   Post a comment
Updated EtherCAT sample code simplifies development of drives, and now includes the CANopen drive profile according to the ETG implementation guideline.
NETWORKING - Fairchild's USB technology meets now and future demands
News & Analysis  
5/29/2010   Post a comment
Fairchild’s micro-USB switch (FSA9280A) and USB transceiver (FUSB2500) have been designed to serve the ever-evolving demands placed upon USB ports in today's market. In addition to being the universal interface for mobile applications, today's USB must handle file transfers, battery-charging, music, and factory programming.
Dongbu claims record in 180-nm process
News & Analysis  
5/29/2010   Post a comment
South Korean foundry vendor Dongbu HiTek has rolled out BD180LV, a new 180-nm process technology.
RIM sets up $100 million fund in China
News & Analysis  
5/29/2010   Post a comment
The BlackBerry Partners Fund has announced the expansion of its investment activities with the launch of a $100 million affiliate fund focused on mobile investment opportunities in China.
CECS, Chengdu firm to build solar stations
News & Analysis  
5/29/2010   Post a comment
Apollo Solar Energy Inc., a refiner and producer of tellurium-based compounds and other metals for the solar photovoltaic (PV) industry, here has entered into a non-binding collaboration agreement with China Energy Conservation Solar Energy Technologies Inc. (CECS) to build scaled thin-film solar energy power stations.
ASE breaks ground on 3-D packaging plant
News & Analysis  
5/29/2010   Post a comment
Amid booming demand, Taiwan's Advanced Semiconductor Engineering Inc. (ASE) has broken ground on a new IC-packaging plant in the southern Taiwan city of Kaohsiung, according to an analyst.
Counterpoint: 450-mm era still remote
News & Analysis  
5/29/2010   1 comment
Contrary to some reports, the shift towards 450-mm fabs is still unlikely for the foreseeable future due to costs, according to VLSI Research Inc.
SOFTWARE TOOLS - Rapita Systems launches improved version of RapiTime
News & Analysis  
5/28/2010   Post a comment
Rapita Systems Ltd has added new advanced features to RapiTime, the company's tool for the measurement and timing analysis of real-time embedded software. The latest release, RapiTime v2.3, improves execution time measurement, code coverage and worst-case execution time analysis.
SOFTWARE TOOLS - RTI and Remedy IT Integrate CORBA Component Model and DDS Standards
News & Analysis  
5/28/2010   Post a comment
Real-Time Innovations (RTI) has partnered with Remedy IT to support the DDS for Lightweight CCM (DDS4CCM) standard. This is the first integration of Object Management Group (OMG) Data Distribution Service for Real-time Systems (DDS)-compliant middleware with the OMG's Lightweight CORBA Component Model (CCM) framework.
Activist investor Icahn says Mentor undervalued
News & Analysis  
5/28/2010   2 comments
Activist investor Carl Icahn disclosed owning nearly 7 percent of EDA vendor Mentor Graphics, requested a meeting with the company's management and said its shares are undervalued, it was widely reported.
Semis on longest quarterly growth streak since '04
News & Analysis  
5/28/2010   Post a comment
Global semiconductor revenue increased by 2 percent in the first quarter compared to the fourth quarter of 2009, marking the fourth consecutive quarter of sequential growth, the longest such stretch since 2004, according to market research firm iSuppli.
Wi-Fi IC shipments set to grow 33% in 2010, says ABI
News & Analysis  
5/28/2010   Post a comment
Global shipments of Wi-Fi ICs are forecast to surpass 770 million units in 2010, up almost 33 percent compared to 2009, according to the ABI Research wing of Allied Business Intelligence Inc.
Pace tops 2009 global set-top-box vendor ranking
News & Analysis  
5/28/2010   Post a comment
Pace plc was the top selling vendor of digital set-top-boxes shipped to pay-TV customers worldwide in 2009, according to market research company Intex Management Services Ltd., which trades as IMS Research.
Daimler, BYD of China join forces to develop e-cars
News & Analysis  
5/28/2010   Post a comment
BYD Company Limited and Daimler AG have created a research and technology joint venture aiming at developing an electric vehicle for China.
Foxconn to raise workers' wages by 20%, says FT
News & Analysis  
5/28/2010   Post a comment
Hon Hai Precision Industry Co. Ltd., which trades as Foxconn and makes electronic products for high profile brands such as Apple, Hewlett-Packard and Sony, is planning to raise the wages of its Chinese workers by about 20 percent, according to a Financial Times report.
Boston-Power signs up BMZ to make battery packs
News & Analysis  
5/28/2010   Post a comment
Boston-Power Inc., a vendor of lithium-ion batteries, is teaming up with Batterien-Montage-Zentrum, a European supplier of rechargeable battery packs.
Update: China claims record in quantum cat state
News & Analysis  
5/28/2010   7 comments
The University of Science and Technology of China in Chengdu recently claimed a new breakthrough and record in the so-called ''hyper-entangled Schrodinger cat state.''
Nokia, CEA-Leti to present high-speed NFC
News & Analysis  
5/28/2010   Post a comment
CEA-Leti and Nokia have developed a radio frequency front-end IC that supports high-data rate short-range communications between a reader, typically a mobile phone, and a memory tag, which is due to be presented at the upcoming VLSI Symposium.
Cisco expands efforts in Chengdu
News & Analysis  
5/28/2010   1 comment
Communications equipment giant Cisco Systems Inc. has recently expanded its efforts in Chengdu, China.
Will proteins revolutionize computing?
News & Analysis  
5/28/2010   Post a comment
A living protein found in every cell of the human body could become a self-assembler of future information processing systems that are smaller, faster and cheaper than the inorganic computer circuitry we use today.
Smart grid standards expected by mid-2011
News & Analysis  
5/28/2010   2 comments
Engineers aim to deliver within a year a broad suite of standards needed to build smart electric grids and reported on stepwise progress at the end of Connectivity Week here.
Surging memory markets shake up top 20 IC vendors
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5/28/2010   Post a comment
Ten of the top 20 semiconductor vendors as ranked by sales changed positions in the first quarter, with surging markets for DRAM and NAND flash memory largely responsible for shaking up the rankings, according to a report from market research firm IC Insights.
SOFTWARE TOOLS - Mentor, Lauterbach team on accelerated hardware/software debug/verification suite
News & Analysis  
5/27/2010   Post a comment
Mentor Graphics Corp. and Lauterbach GmbH have collaborated to deliver a hardware-accelerated software development and debug platform for the verification of Systems-on-Chip (SoCs) and embedded systems.
Magma sharply narrows annual loss
News & Analysis  
5/27/2010   Post a comment
EDA vendor Magma Design Automation again topped its own sales target for the quarter ended May 2, but the company posted another loss in accordance with generally accepted accounting principles. The company's annual loss for the fiscal year narrowed sharply compared with the previous year.
SOFTWARE TOOLS - eTools Design Suite 8.1 boosts performance, cuts design time
News & Analysis  
5/27/2010   Post a comment
New features and utilities in eTools 8.1 Design Suite from eASIC enable designers to reduce overall design time by up to 40 percent while increasing design performance by up to 30 percent compared to eTools 8.0.
Critics again hammer proposed NASA's manned flight plan
News & Analysis  
5/27/2010   Post a comment
Lawmakers remain skeptical about NASA's blueprint will ensure continued U.S. access to low-Earth orbit and beyond.
Report predicts 75 million stereo 3-D PCs in 2014
News & Analysis  
5/27/2010   Post a comment
Nearly one million PCs will ship this year equipped to display stereo 3-D content, rising to 75 million by 2014 valued at a whopping $30 billion, according to a new report from Jon Peddie Research.
Unisem eyes IC-packaging expansion in Chengdu
News & Analysis  
5/27/2010   Post a comment
Seeking to break out from the crowded IC-packaging pack, Malaysia’s Unisem Berhad here outlined its ambitious growth strategy amid robust demand and shortages in the market.
Rambus acquires more lighting and display technology
News & Analysis  
5/27/2010   Post a comment
Rambus will pay $2.25 million to acquire intellectual property related to dynamic backlighting, field sequential color displays and time multiplexed optical shutter display technology from Uni-Pixel.
Autoelectronics market to reach $210 billion in 2014, says analyst
News & Analysis  
5/27/2010   Post a comment
The market for automotive electronic systems is set to grow from a 2009 low of $125 billion to about $210 million in 2014, a CAGR over the period of 11 percent, according to market research firm Strategy Analytics. Over the longer period to 2017 the company is forecasting a CAGR of 9 percent to yield an annual market of about $244 billion.
Rambus acquires Uni-Pixel backlighting display IP
News & Analysis  
5/27/2010   Post a comment
Rambus has acquired a portion of Uni-Pixel's intellectual property portfolio relating to dynamic backlighting, field sequential color displays, and Time Multiplexed Optical Shutter display technology for $2.25 million.
Analyst sees chip market uptick over next decade
News & Analysis  
5/27/2010   Post a comment
The global chip market will likely rise annually by about 8 to 10 percent on average over the next decade, due to the demands of environmental engineering on semiconductor technologies, according to an industry analyst.
Oclaro backs ClariPhy in $24 million VC round
News & Analysis  
5/27/2010   Post a comment
ClariPhy Communications, a vendor of mixed-signal, digital signal processing (MXSP) integrated circuits for optical networks, has raised $24 million in Series C funding.
Group breaks logjam over smart meter standard
News & Analysis  
5/27/2010   1 comment
Developers have agreed on a process to define by the end of the year a "seed" standard describing how to present data to devices that monitor smart electric grids, breaking a logjam that has drawn attention from Obama Administration officials and others trying to drive the move to a digital networked grid.
New loss measurement requirement coming for circuit board fab shops
News & Analysis  
5/27/2010   1 comment
Intel is setting expectations with their circuit board fab houses that loss measurements will become a required performance metric for their high end server circuit boards.
Intel further retreats from discrete GPUs
News & Analysis  
5/26/2010   13 comments
Intel has further retreated from plans to bring a high-performance stand-alone graphics processor to market, but will continue to develop its multi-core Larrabee architecture for the high-performance computing market, the company revealed in a blog posting.
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