DRAM rankings: Q1 sales down on weak ASPs News & Analysis 5/31/2011 1 comment Global DRAM revenue fell to $8.3 billion in the first quarter, down 5.6 percent from the fourth quarter of 2010 due to weak pricing, according to a report by market research firm IHS iSuppli.
Danaher T&E cos contribute to Vietnam's hi-tech News & Analysis 5/31/2011 1 comment Tektronix, Fluke and Keithley have joined the Higher Engineering Education Alliance Program (HEEAP) with a $300,000 donation which will go toward the electrical and mechanical engineering curricula needs of Vietnam’s growing high-tech industry.
Actions Semi tips MIPS-based Honeycomb SoC News & Analysis 5/31/2011 2 comments Actions Semiconductor will collaborate with MIPS Technologies to offer a MIPS-based, 1.3 GHz chipset optimized for version 3.0 of Google's Android operating system, also known as Honeycomb, the companies said.
ST Foundation appoints chairman News & Analysis 5/31/2011 Post a comment The ST Foundation, an independent charitable organization created by STMicroelectronics, has appointed Pietro Fox as chairman. Fox takes up the position previously held by the prime instigator of the organization, Carlo Ottaviani, who passed away in January of this year.
Report: IDC cuts chip growth on poor PC sales News & Analysis 5/31/2011 1 comment Market research firm International Data Corp. has cut its forecast on the annual revenue growth of the semiconductor sector to between 4 and 5 percent from 6 to 8 percent, according to a Dow Jones report.
India starts hunt for fab-building chipmakers News & Analysis 5/31/2011 12 comments A committee recently set up by the Indian government to help drive the establishment of semiconductor manufacturing in the sub-continent, has conducted its first meeting and has started approaching chip companies to ask them to set up wafer fabs there.
Intel Ultrabooks attack tablet market News & Analysis 5/31/2011 26 comments Intel will push down the power and size of the notebook computer to create a so-called. Ultrabook, its answer to tablets that have so far chosen ARM over x86 processors.
European EMS firm broken in three News & Analysis 5/30/2011 Post a comment TES Electronics Solutions (Langon, France), an electronics design and manufacturing services company, is being broken up and sold off to three different companies by order of the Tribunal de Commerce de Rennes, according to local reports.
Singapore starts training Abu Dhabi fab workers News & Analysis 5/30/2011 6 comments Teaching institute Singapore Polytechnic has signed an agreement to train wafer fab workers for Abu Dhabi. Some 50 men and women from the Emirate of Abu Dhabi will form the pioneering class following an agreement signed between the Abu Dhabi owned Advanced Technology Investment Co. (ATIC); foundry Globalfoundries Inc., which is majority-owned by ATIC; and Singapore Polytechnic.
OEMS speed adoption of IPv6 News & Analysis 5/30/2011 3 comments The first of over two dozen IPv6 systems from leading OEMs that are using NetLogic Microsystem's NL11k knowledge-based processors will begin shipping in production in 3Q 2011, with the remaining customer systems expected to commence shipping over the following twelve months.
Mentor, Magma top expectations News & Analysis 5/27/2011 1 comment Mentor Graphics CEO Walden Rhines said Mentor's board has met once by phone since three members nominated by billionaire financier Carl Icahn were elected to join it.
Tessera sues Sony again News & Analysis 5/27/2011 2 comments Tessera Technologies filed a complaint through one of its subsidiaries against Sony in California state court.
Zarlink tips 5% job cuts on 'strong' results News & Analysis 5/27/2011 13 comments Canadian mixed-signal chip company Zarlink Semiconductor Inc. has said it plans to reduce its global workforce by approximately 5 percent by the end of fiscal Q2 2012, which ends in September 2011. Zarlink (Ottawa, Ontario) made the announcement within its statement of its fourth fiscal quarter and 2011 fiscal year results.
TI selects G24i as energy harvest partner News & Analysis 5/27/2011 2 comments G24 Innovations Ltd., a pioneer of dye-sensitized thin-film solar cells, is working with Texas Instruments to combine G24i's solar cell technology with TI power conversion ICs.
Image gallery: Xperia Play handset teardown News & Analysis 5/26/2011 5 comments The first "PlayStation certified" smartphone features Qualcomm's Snapdragon, Broadcom's BlueTooth/WiFi/FM combo chip and memory ICs from Micron and Elpida, among others, according to a teardown analysis.
High-temp MEMS goes seismic News & Analysis 5/26/2011 4 comments Analog Devices claims to have designed the world's first MEMS chip that can tolerate temperatures as high as 342 degrees Fahrenheit.
Smart meters wait on home net spec News & Analysis 5/26/2011 17 comments Some smart meter projects are on hold while engineers re-work a road map for Smart Energy Profile 2.0, a key standard for tomorrow's home energy networks.
Freescale CEO bullish on IPO News & Analysis 5/26/2011 6 comments Rich Beyer, Freescale Semiconductor's chairman and CEO, said he was happy with the opening of the company's IPO despite the fact that the opening price was lowered. Shares climbed up more than 5 percent by mid-day trading.
Analyst sees flat April for global chip sales News & Analysis 5/26/2011 1 comment The three-month average of global chip sales for April are likely to be $25.3 billion April, similar to the $25.26 billion reported in March by the World Semiconductor Trade Statistics organization, according to Bruce Diesen, an analyst at Carnegie Group (Oslo, Norway).
Wipro teams with EADS to manufacture aerospace actuators News & Analysis 5/25/2011 1 comment Wipro Infrastructure Engineering announced it has concluded an agreement with Spain's Compania Espanola De Sistemas Aeronauticos SA (CESA), a subsidiary of the global Aerospace and Defense Corporation, to manufacture precision engineered components for the aerospace and defense sector.
ST Micro ramps up MEMS production News & Analysis 5/25/2011 1 comment STMicroelectronics reports it is significantly increasing its MEMS production capacity to more than 3 million sensors a day, by the end of 2011 to sustain exploding demand.
Audio test & measurement seminar in UK (June 2-3) News & Analysis 5/25/2011 Post a comment A two-day audio test and measurement training seminar held by Prism Sound and its UK distribution partner, TTi distribution, will introduce engineers to the practical and theoretical aspects of accurately measuring audio for a wide variety of applications.
IBM to test wafer pruning News & Analysis 5/25/2011 10 comments IBM will test a wafer pruning technique developed at the University of California at Los Angeles said to spot bad wafers early with test structures in-between die that can reject wafers before costly metallization steps.
Nomura sees 2011 chip market growth of 4.4% News & Analysis 5/25/2011 5 comments Brokerage firm Nomura Securities has raised its forecast for growth in the value of the global semiconductor market to 4.4 percent, an increase from its previous projection of 3.1 percent given in December 2010.
Applied braces for sales decline News & Analysis 5/24/2011 Post a comment Applied Materials, the largest maker of semiconductor production equipment, reported second quarter sales and earnings that exceeded analysts' expectations but said it expects sales for the current quarter to decline due to sluggish near-term economic conditions.
IHS: Tablet's rise hurt Q1 PC sales News & Analysis 5/24/2011 10 comments First quarter global PC sales declined by 0.3 percent compared to the first quarter of 2010, in part because of rising interested in Apple's iPad and other tablets, according to IHS iSuppli.
Tessera loses appeal of ITC ruling News & Analysis 5/24/2011 1 comment The U.S. Court of Appeals for the Federal Circuit affirmed a decision by the U.S. International Trade Commission that DRAM vendors did not infringe on a Tessera patent by using wBGA laminate-based package substrates.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.