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Content posted in May 2012
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Arizona display center develops 7.4-inch protoype OLED
News & Analysis  
5/31/2012   3 comments
An Arizona State University display center working with Army researchers have developed a 7.4-inch OLED prototype device using mixed oxide thin film transistors.
Asahi Glass to demo 0.1mm glass laminate at SID
News & Analysis  
5/31/2012   4 comments
At next week’s Society for Information Display exhibition manufacturer of glass, chemicals and high-tech materials AGC will showcase carrier glass on which to laminate its 0.1 mm-thick ultra-thin glass for next-generation displays and various other applications.
EE Times Live Stream
News & Analysis  
5/31/2012   1 comment
EE Times Live Stream @ DAC 2012
Slideshow: Pinpoint splashdown ends first visit to space station
News & Analysis  
5/31/2012   27 comments
The Dragon cargo ship returned to Earth on May 31 after completing a nearly flawless first mission to the International Space Station. We present a mission summary.
Cadence tools out 20nm SoC test chip for STMicro
News & Analysis  
5/31/2012   2 comments
Cadence Design Systems has announced it has helped tape out STMicroelectronics’ 20nm test SoC chip, an industry milestone for Cadence delivering an end-to-end mixed-signal design flow for 20 nm.
Snapped up before DAC – there will be no Missing Link
News & Analysis  
5/31/2012   1 comment
One of the new exhibitors for DAC this year has been snapped up before the show begins….
Nissan turns auto/home power-sharing into reality
News & Analysis  
5/31/2012   13 comments
Nissan launched here what it calls its “Leaf-to-home” power supply system, designed to turn Nissan’s electric vehicle Leaf into a backup electricity supply for residential homes.
Samsung, LG lead on tablet displays
News & Analysis  
5/31/2012   4 comments
Thanks to continued strong sales of Apple iPad and Amazon Kindle Fire, Korean display makers Samsung Electronics Co. Ltd. and LG Electronics Inc. remained the top suppliers of tablet screens in 2011, with more than 80 percent of all shipments combined, according to IHS iSuppli.
Intel phone debuts in China
News & Analysis  
5/31/2012   11 comments
Intel has released another Atom-powered smartphone, this time by Chinese electronics vendor Lenovo Group, which said it will put out an Intel Inside device at CES 2012 back in January.
Freescale pushes wireless recharge
News & Analysis  
5/31/2012   15 comments
Freescale Semiconductor's reference designs for recharging tablets and smartphones allow automobiles, airports, coffee shops and other public areas to supply almost invisible recharging stations built into tables, kiosks or nearly any horizontal surface.
Insufficient baseband chip supply hurting LTE smartphone sales
News & Analysis  
5/30/2012   9 comments
Since there has been greater than originally expected demand for LTE smartphones and tablets, international vendors are worried that their shipments are not enough to meet demand due to short supply of LTE solution chips from Qualcomm, currently the only provider of integrated multimode 3G/4G LTE baseband chips.
Teledyne acquires LeCroy
News & Analysis  
5/30/2012   4 comments
Military and aerospace specialist Teledyne Electronic Technologies has acquired Lecroy Corp., expanding its portfolio of analytical instrumentation products.
HP cuts data center power in lab tests
News & Analysis  
5/30/2012   13 comments
Engineers at HP Labs claim they have demonstrated software in a research setting that significantly lowers power consumption for large data centers.
Globalfoundries selects Synopsys' tool for yield management
News & Analysis  
5/30/2012   Post a comment
Globalfoundries has selected Synopsys' Yield Explorer tool for use as part of its next-generation yield management system for faster yield ramp based on volume diagnostics, Synopsys said.
Next growth market for EMS providers: renewable energy
News & Analysis  
5/30/2012   3 comments
OEMs are looking for help in entering the emerging renewable energy and smart grid markets. With the right strategy, electronic manufacturing services providers could cash in on the opportunity.
Invisible bike helmet protects with air-bag shell
News & Analysis  
5/30/2012   31 comments
Motion sensors and microcontrollers from STMicroelectronics enable the operation of the airbag bicycle helmet invented by Hövding, a Swedish design house.
Marvell wins as Dell starts shipping ARM-based servers
News & Analysis  
5/30/2012   7 comments
Dell Inc. said it has started shipping server computers called Copper based on the ARM processor architecture to selected customers. The servers are based on Marvell's quad-core Armada XP SoC products.
ASTC, Tanner EDA to deliver ASIC design services
News & Analysis  
5/30/2012   Post a comment
Australian Semiconductor Technology Co. and Tanner EDA have reached an agreement to deliver analog/mixed signal IP and custom ASIC design services.
Xilinx ships loaded FPGA for linecard applications
News & Analysis  
5/30/2012   Post a comment
Xilinx Inc. has begun initial shipments of the Virtex-7 H580T FPGA, a single-chip solution for addressing key Nx100G and 400G line card applications and functions.
Industrial apps go multi-platform
News & Analysis  
5/30/2012   3 comments
Motorola Solutions has crafted a universal app platform for its developers, enabling a single HTML5 app to be deployed on iOS, Android, Windows Phone, Windows Mobile, Windows CE and Blackberry mobile devices.
Ansys to acquire embedded software firm
News & Analysis  
5/29/2012   2 comments
Simulation software provider Ansys said it signed a definitive agreement to acquire France-based Esterel Technologies, a provider of embedded software simulation tools for mission critical applications, for about $53 million in cash.
U.S. manufacturing effort targets regional clusters
News & Analysis  
5/29/2012   10 comments
The Obama administration wants to foster the creation of regional manufacturing clusters under a $26 million program.
Globalfoundries to use Mentor's SmartFill at 20-nm
News & Analysis  
5/29/2012   Post a comment
EDA vendor Mentor Graphics said Globalfoundries would use the SmartFill facilities of its Calibre YieldEnhancer product to enable advanced fill techniques for 20-nm manufacturing processes.
Slideshow: MEMS in the midnight sun
News & Analysis  
5/29/2012   3 comments
A trip to Finland to find out more about MEMS has been captured in pictures.
LG Display ups HD panel for smartphones to 5 inches
News & Analysis  
5/29/2012   2 comments
LG Display has introduced a 5 in. full high definition LCD panel for smartphones, which the company claims provides the same quality as on TVs and monitors.
Black solar cells have lowest reflectance for silicon solar cells
News & Analysis  
5/29/2012   4 comments
Scientists at Natcore Technology using simple liquid bath processes said they have created a black surface on a silicon wafer with an average reflectance in the visible and near-infrared region of the solar spectrum of 0.3 percent.
Lfoundry announces 110-nm PDK with embedded flash
News & Analysis  
5/29/2012   Post a comment
Lfoundry Rousset SAS has announced the availability of its physical design kit (PDK) for 110-nm aluminum process. The PDK includes options including an embedded flash memory which is proposed in 90-nm resolution.
Intel invests in Dnote audio for use in ultrabooks
News & Analysis  
5/29/2012   14 comments
Intel Capital has invested an undisclosed sum of money in Trigence Semiconductor Inc. to help expand use of its Dnote audio technology in computers based on Intel processors.
Renesas, TSMC tout licensable MCU platform using 40-nm eFlash
News & Analysis  
5/28/2012   7 comments
Renesas and TSMC Monday outlined joint plans to develop an embedded flash-based MCU platform licensable to other chip suppliers around the world.
Renesas extends MCU work with TSMC to 40-nm
News & Analysis  
5/28/2012   1 comment
As expected Japan's Renesas and foundry TSMC have announced an increase in the collaboration between the companies on microcontrollers.
MEMS wafer maker Okmetic outsources amid SOI push
News & Analysis  
5/28/2012   1 comment
Okmetic Oyj a manufacturer of silicon wafers for sensor, semiconductor and solar applications, has begun outsourcing wafer manufacture even as it is expanding its factory at its Finland headquarters to make more silicon-on-insulator wafers.
Murata wants to build from MEMS to Internet of Things
News & Analysis  
5/27/2012   7 comments
Murata Manufacturing Co. Ltd. has been on the acquisition trail for several years and it is now fine tuning its approach as it seeks to move up in complexity and value through MEMS to the Internet of Things.
Intel confirms Ireland for 14-nm silicon
News & Analysis  
5/27/2012   24 comments
The Intel wafer fab complex in Leixlip Ireland is set to receive investment to allow it to manufacture 14-nm silicon and beyond, the company revealed in a presentation to analysts on May 10. The investment is expected to be more than $1 billion.
Energy Micro and Spectrum Design Solutions to offer energy-efficient wireless designs
News & Analysis  
5/27/2012   2 comments
The folks at Energy Micro develop energy-friendly MCUs and RF transceivers based on the ARM Cortex processor core.
Video: Indy 500 pit boss talks tires
News & Analysis  
5/27/2012   Post a comment
We get down and dirty in the pits at the Indy 500, where we learn how 0.5 increments of tire pressure can make or break a race, how many laps a driver can go on one set of wheels, and how far rival tire makers will go to steal another firm's secrets.
Stuff to see at DAC: Blue Pearl Software
News & Analysis  
5/26/2012   Post a comment
Blue Pearl Software Suite accelerates FPGA implementation by generating SDCs for Synopsys Synplify Pro and Xilinx Vivado.
Renesas cuts 14,000 jobs; fab sale to TSMC
News & Analysis  
5/26/2012   10 comments
Renesas Electronics Corp. plans to eliminate up to 14,000 jobs, while selling the company’s leading system-chip fab in Yamagata to TSMC, according to a report in Nikkei, Japan’s economic newspaper.
Former Conexant CEO tapped to lead Lantiq
News & Analysis  
5/25/2012   Post a comment
Dan Artusi, a former CEO of both Silicon Laboratories and Conexant Systems, was named to the same position at German broadband and networking chip vendor Lantiq.
Murata completes takeover of VTI with name change
News & Analysis  
5/25/2012   2 comments
The takeover of MEMS manufacturer VTI Technologies Oy here by Murata Manufacturing Co. Ltd. was completed with a name change to Murata Electronics Oy.
Update: Dragon docked to space station
News & Analysis  
5/25/2012   30 comments
Astronauts aboard the International Space Station reached out and grabbed a U.S. commercial spacecraft in darkness over Australia on Friday (May 25).
Sharp to transfer LCD technology to Hon Hai’s China plant
News & Analysis  
5/25/2012   11 comments
Terry Gou, founder of Taiwan’s contract manufacturer Hon Hai (known as Foxconn), has been consistent in its one naked ambition: To build technology prowess at Foxconn that surpasses Korean giant Samsung Electronics.
ST's priorities: Sustain analog, expand into digital
News & Analysis  
5/25/2012   3 comments
The loss a key customer Nokia resulted in a $1 billion loss for STMicroelectronics. ST executives explained this week how they plan to make up for the setback. If it wasn’t for the pesky $1 billion loss of business from a “significant customer” recently ST Microelectronics might be a much better financial and strategic shape.
SIA holds yearly council and drafts global chip tariff policy
News & Analysis  
5/25/2012   Post a comment
Executives from leading companies in the semiconductor industry laid the groundwork for lobbying governments to completely eliminate tariffs on chips.
Intel to spend $40 million on international university research
News & Analysis  
5/24/2012   4 comments
Intel CTO Justin Rattner announced that the company plans to plow more than $40 million into a worldwide network of university research centers over the next five years in an international counterpart to the Intel's U.S.-based university research program.
Renesas still struggling with restructuring plan
News & Analysis  
5/24/2012   6 comments
Japanese chip maker Renesas again finds itself at a crossroads as it struggles to come up with a restructuring plan that would ensure its survival.
High-G MEMS help detect concussions
News & Analysis  
5/24/2012   8 comments
Analog Devices has crafted a MEMS sensor that is says can help detect concussion symptoms when they happen, giving doctors time to administer preventative therapies.
Inertial measurement unit integrates accelerometer, gyro
News & Analysis  
5/24/2012   10 comments
Bosch Sensortec said it has integrated an inertial measurement unit with a three-axis accelerometer and a three-axis gyroscope into the smallest package yet available for consumer-grade applications such as mobile phones, tablets and digital cameras.
Dragon cargo ship, space station fly in formation
News & Analysis  
5/24/2012   8 comments
SpaceX's Dragon cargo ship has completed a series of rendezvous maneuvers that have placed it within sight of the International Space Station. An historic docking is planned for Friday (May 25).
SRC clears path to 14-nm with directed self-assembly litho
News & Analysis  
5/24/2012   13 comments
Researchers at Stanford University claim to have perfected a novel self-assembly lithography technique for creating the irregular patterns necessary to build semiconductors with 14-nm linewidths.
High Voltage CMOS process tackles power
News & Analysis  
5/24/2012   Post a comment
The new process provides low specific On-resistance 700V power devices and the lowest mask count in the foundry industry…
Page 1 / 5   >   >>


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