Breaking News
News & Analysis, Opinion, Teardown
Content posted in May 2013
Page 1 / 2   >   >>
IBM breakthrough could alleviate mobile data bottleneck
News & Analysis  
5/31/2013   8 comments
Integrated phased-array transceiver contains all millimeter- wave components necessary for high data-rate communications.
STEM on Tektronix agenda
News & Analysis  
5/31/2013   5 comments
What is Tektronix doing to ensure the next-generation of experts in physics and electronics?
Satellites support drones in commercial airspace
News & Analysis  
5/31/2013   2 comments
European defense and research companies have successfully demonstrated satellite control of Remotely Piloted Aircraft Systems (RPAS) in commercial, non-segregated airspace, opening up wider use of such drones.
Intel wins CPU slot in Samsung tablet
News & Analysis  
5/31/2013   21 comments
Atom processor gain design win in Samsung Galaxy tablet computer, according to reports.
Analyst: Chip sales were weak in April
News & Analysis  
5/31/2013   Post a comment
Financial analyst sees signs of weakness in the chip market and predicts market contraction in 2013.
Intel, ARM on even footing in Net of Things, says IDC
News & Analysis  
5/30/2013   12 comments
More than 25 billion intelligent systems valued at $4 trillion could ship in 2020, said an IDC analyst helping create a new trade group for the sector.
Global GDP woes dragging on chip growth
News & Analysis  
5/30/2013   12 comments
IC Insights trimmed its forecast for 2013 chip market growth after preliminary Q1 GDP estimates from several regions came in soft.
Europe adds to chip pilot line support list
News & Analysis  
5/29/2013   Post a comment
The European Commission has added LEDs, power, MEMS and 450-mm to the list of chip manufacturing pilot lines it will support.
Tablets expected to outship notebooks in 2013
News & Analysis  
5/29/2013   8 comments
IDC cuts PC market forecast as consumers turn increasingly to tablets, smartphones.
SRC sponsors research in Abu Dhabi
News & Analysis  
5/29/2013   1 comment
The Semiconductor Research Corporation is jointly funding semiconductor development efforts with the Globalfoundries parent company.
AMD rolls 'Kyoto' server processors
News & Analysis  
5/29/2013   Post a comment
Firm claims small core processors outperform Intel's Atom server chips with better power efficiency.
MOST Forum sketches 5-Gbps future
News & Analysis  
5/28/2013   Post a comment
At the recent MOST Forum in Germany, experts discussed the presence and future of the MOST data bus used in automotive environments against the background of the AVB/Ethernet camp seemingly having gained ground recently.
Slideshow: Ethernet yesterday, today and tomorrow
News & Analysis  
5/28/2013   15 comments
The 40th anniversary of Ethernet unearthed old war stories, a couple poems, a robotic-assisted videoconferencing demo and talk of a big, insecure future.
Wolfson to move integrated MEMS mics to 8in wafers
News & Analysis  
5/28/2013   2 comments
Wolfson Microelectronics is integrating digital signal processing on the same die as its MEMs microphones and moving production to 8in (200mm) wafers in the first to make the move.
HiWave spinoff to develop new haptics, embedded audio
News & Analysis  
5/28/2013   Post a comment
Led by HiWave's former CEO and CTO, James Lewis and Chris Travis, start-up Redux Labs has been spun out to advance its Surface Sensation technology for third generation haptic and embedded audio technology.
Intel invests in Irish R&D
News & Analysis  
5/28/2013   10 comments
Intel is investing $1.5 million in the Tyndall National Institute at University College Cork to help collaboration in R&D in photonics, microsystems and nanoelectronics.
Cloud-based virtualization goes mobile
News & Analysis  
5/24/2013   6 comments
Innovations by Citrix and Nvidia could take virtualization to its logical conclusion, allowing users to access their desktops from any mobile device.
Research gap threatens innovation, experts warn
News & Analysis  
5/24/2013   22 comments
The decline of big corporate R&D groups such as Bell Labs has created a hole in the innovation pipeline said Bill Spencer (pictured) at an event celebrating the 40th anniversary of Ethernet.
Global FDSOI ecosystem rising
News & Analysis  
5/24/2013   5 comments
So far, STMicroelectronics has been identified as the only company tilting at the FDSOI windmill. That perception, and a lonely market landscape, are about to change.
SOI wafer supplier sees cash halved
News & Analysis  
5/24/2013   Post a comment
Soitec has seen cash resources fall by 50 percent as it made net loss that was 80 percent of sales in financial year to end of March 2013.
Intel Haswell packs integrated voltage regulator
News & Analysis  
5/23/2013   12 comments
Integration eliminates as many as seven external third party chips—one of many power improvements driven by competition with ARM.
Europe launches $12 billion chip support campaign
News & Analysis  
5/23/2013   34 comments
Europe is planning to spend $12 billion to reverse the continent's decline in chip production. Recreate the success of Airbus in semiconductors, said official.
AMD launches three mobile APUs
News & Analysis  
5/23/2013   2 comments
Additions to AMD's lineup of mobile accelerated processing units include chips formerly codenamed Temash, Kabini and Richland.
Broadcom: Time to prepare for the end of Moore’s Law
News & Analysis  
5/23/2013   52 comments
CTO Henry Samueli says Broadcom is starting to prepare customers for the end of CMOS scaling in the next 15 years, and it is working out plans for 3-D chip stacks.
Sony’s dilemma: Short-term gain vs. long-term strategy
News & Analysis  
5/22/2013   8 comments
Sony CEO reiterated that restoring its electronics business is the company’s priority. But how exactly is a partial spinoff of its entertainment divisions going to help?
More varied research needed beyond 10-nm, says Intel
News & Analysis  
5/22/2013   8 comments
Intel's director of component research says more varied research is needed to catch the next opportunity beyond conventional silicon.
Broadcom’s CTO on Ethernet’s six key directions
News & Analysis  
5/22/2013   3 comments
As the industry celebrates the 40th anniversary of Ethernet, Broadcom CTO Henry Samueli talks about six directions in which it is heading.
Europe backs FDSOI wafer fabs
News & Analysis  
5/21/2013   3 comments
A $465 million collaborative R&D project is set to support pilot lines in Dresden and Grenoble for production of fully depleted silicon on insulator manufacturing process.
Windows 8 learning curve: Two customers speak
News & Analysis  
5/21/2013   5 comments
Microsoft users expect Windows 8.1 to lessen the learning curve for the new OS. But it may not be as bad as you fear, two education customers report.
Qualcomm, Samsung pass AMD in microprocessor sales
News & Analysis  
5/21/2013   13 comments
Thanks to PC sales slowdown coupled with increase in smartphone and tablet sales, AMD slipped to fourth in MPU sales for first time since 1990s.
Taiwanese researchers take aim at environmental issues
News & Analysis  
5/21/2013   Post a comment
Taiwan has long been recognized for its contributions to microelectronics, but its research labs are now working on pressing social issues.
Slideshow: Maker Faire returns to Silicon Valley
News & Analysis  
5/21/2013   8 comments
Our man in Silicon Valley spent his Saturday afternoon taking in Maker Faire and here's a glimpse of some of the makers, robots, LEDs and whatnot he saw there.
Android drives cameras to GPUs, plans IR support
News & Analysis  
5/20/2013   4 comments
Google will update Android camera API to support computational photography on graphics cores and build support for infrared into Android.
ST to deny rivals FDSOI access
News & Analysis  
5/20/2013   Post a comment
In an interview Jean-Marc Chery, ST's CTO (shown), said his company could install its FDSOI process in multiple foundries but for now has an agreement in place that will deny certain companies access to the process.
Arduino board plugs DIYers into the cloud for $69
News & Analysis  
5/19/2013   8 comments
Massimo Banzi launched a $69 Arduino board that plugs do-it-yourselfers into the cloud using a Wi-Fi chip from Qualcomm Atheros running a custom variant of Linux.
Slideshow: Google I/O puts 7 platforms on parade
News & Analysis  
5/17/2013   6 comments
At its annual developer's conference, Google showed advances across seven major platforms--Android, Chrome, Glass, Google+, Maps, Search and Google TV.
Taiwan funds smartphone innovations
News & Analysis  
5/16/2013   4 comments
National Taiwan University has developed several innovations for tablets and smartphones designed to win the hearts of mass-market users.
ST's strategy is a tale of two segments
News & Analysis  
5/16/2013   3 comments
ST tells analysts it is going to report financial results for both its digital and analog business segments for "transparency" but remains committed to exploiting manufacturing technologies it has Crolles, including its FDSOI process.
Ten percent of notebooks using touch screens
News & Analysis  
5/16/2013   2 comments
Despite the sluggish uptake of Windows 8, nearly 4.6 million notebooks tapped into capacitive touch screen displays last quarter, a figure one market watcher sees rising.
Mellanox to acquire silicon photonics developer Kotura
News & Analysis  
5/16/2013   Post a comment
Mellanox expects acquisition to enhance competitiveness, expand its ability to deliver next-generation optical connectivity.
Google I/O: Larry Page talks, search box listens
News & Analysis  
5/15/2013   7 comments
No shiny new gadgets debuted, but Google did show search responding to voice recognition and CEO Larry Page gave a surprise Q&A.
E Ink preps flexible e-paper display
News & Analysis  
5/15/2013   1 comment
E Ink is preparing to launch a 13.3-inch sized flexible e-paper display. Mass production due in 2H13.
Q1 mobile phone sales buoyed by Asia-Pac
News & Analysis  
5/14/2013   5 comments
Handset sales were down year-over-year in all regions expect Asia-Pacific, according to Gartner.
Exclusive: TSMC plots microelectronics future
News & Analysis  
5/13/2013   9 comments
TSMC's chief technology officer and vice president of R&D reveals future of semiconductors from perspective of world's foremost microchip foundry, in exclusive interview with EE Times.
‘Sentrollers’ taking over from ‘People’ as the majority population on the Internet, says GreenPeak Technologies
News & Analysis  
5/13/2013   1 comment
GreenPeak Technologies has released a white paper called “Sentrollers and the Internet of Things” where it defines Sentrollers as a new, all-encompassing term for sensors, actuators and controllers – the various devices that make up the new Internet of Things.
Japan's chip vendors slide down Q1 global rankings
News & Analysis  
5/13/2013   12 comments
Japan's chip vendors in the top 20 ranked by sales in Q1 all suffered declining sales compared with 1Q12 and were four of the worst five performing in the top 20 in terms of growth.
Slideshow: How knockoff nation mastered ecosystem
News & Analysis  
5/13/2013   58 comments
Da Fen Village, where replicas of Van Gogh, Rembrandt or Monet are mass-produced by Chinese artists and art students, represents everything that gives China a bad name: Knockoff nation.
LED luminaires transmit data at high bandwidth
News & Analysis  
5/13/2013   1 comment
The Heinrich Hertz Institute (HHI) in Berlin has further developed its broadband optical communications technology which utilizes standard commercial LEDs used for lighting purposes to transmit data.
Group backs publish/subscribe open protocol for M2M messaging
News & Analysis  
5/13/2013   Post a comment
Organizations from around the world are collaborating on a lightweight reliable messaging transport protocol for Machine-to-Machine (M2M) connections and Internet of Things (IoT).
High-performance set-top box SoC supports high-end Android-based IPTV
News & Analysis  
5/13/2013   Post a comment
STMicroelectronics says that the company’s Orly system-on-chip (SoC) is now powering a new generation of advanced set-top boxes introduced by NTT Plala Inc., a leading Internet / IPTV service provider in Japan.
Page 1 / 2   >   >>


Most Recent Comments
mhrackin
 
Max The Magnificent
 
Stargzer
 
Michael.Markowitz
 
Stargzer
 
mhrackin
 
mhrackin
 
Stargzer
 
antedeluvian
Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Andrew Binstock

Lack of Manual Labor
Andrew Binstock
Post a comment
The lack of quality manuals and documentation for developer tools greatly diminishes our ability to work well in subtle but important ways.

Max Maxfield

Saddleback Sale – It's Happy Dance Time
Max Maxfield
4 comments
It's no secret that I'm a huge fan of the products from Saddleback Leather. As I sit here at my desk, I'm wearing one of their 1¾" wide Tow Belts, upon which rests one of their Belt ...

Engineering Investigations

Air Conditioner Falls From Window, Still Works
Engineering Investigations
1 Comment
It's autumn in New England. The leaves are turning to red, orange, and gold, my roses are in their second bloom, and it's time to remove the air conditioner from the window. On September ...

David Blaza

The Other Tesla
David Blaza
5 comments
I find myself going to Kickstarter and Indiegogo on a regular basis these days because they have become real innovation marketplaces. As far as I'm concerned, this is where a lot of cool ...