Sipex cuts workforce by 15%, plans to reduce chip production at foundries News & Analysis 6/29/2001 Post a comment BILLERICA, Mass. - Citing the ongoing IC downturn, Sipex Corp. plans to slash its workforce by 15% and will reduce its chip production at outside silicon foundry providers.
Instead of using outside foundries, the supplier of analog and mixed-signal chips will boost the production in its own fab by 30%. The move will save the company about $3 million per quarter.
Germany's Osram Opto to build new LED chip fab News & Analysis 6/29/2001 Post a comment REGENSBURG, Germany -- Bucking the trend in the semiconductor industry, Osram Opto Semiconductors GmbH & Co. here announced plans to build a new wafer fab in Germany. The total cost of the fab is about $100 million.
The fab will make chips for light-emitting diodes (LEDs), laser diodes and sensors, according to Osram Opto. The Regensburg-based company is joint venture between Infineon Technologies AG and Osram GmbH, a manufacturer of lighting products.
Free download of ARM clone source code offered News & Analysis 6/29/2001 Post a comment A Chinese graduate student is offering freely downloadable source code for the description of a synthesizable processor core claimed to be compatible with the ARM7 32-bit RISC processor developed by ARM Holdings plc (Cambridge, England).
Motorola, AMD's Ruiz settle suit over recruitment dispute News & Analysis 6/29/2001 Post a comment SCHAUMBURG, Ill. -- Motorola Inc. and the former president of its semiconductor business, Hector de J. Ruiz, here have reached an out-of-court settlement in their suit over the alleged illegal recruitment of Motorola executives to Advanced Micro Devices Inc.
In January of 2000, Ruiz surprised the industry and Motorola by deciding to join AMD as president and chief operating officer.
Architecture melds DSP with MCU News & Analysis 6/29/2001 Post a comment Next-generation wireless applications combining voice, video and data require a processor that can efficiently implement advanced third-generation (3G) algorithms.
Microtune affirms expected drop in Q2 sales, but Q3 backlog increases News & Analysis 6/29/2001 Post a comment PLANO, Tex. -- Radio-frequency IC supplier Microtune Inc. here today reiterated that it expects to report second-quarter revenues in a range of $14.1 million to $15.0 million, a 15-to-20% sequential drop from $17.7 million in the first quarter this year. The guidance is similar to what the Plano startup issued on April 23.
DSPs drive merger of voice, data News & Analysis 6/29/2001 Post a comment Voice-over-packet technology converts narrowband voice, fax and data traffic from the circuit-switched format used in telephone and wireless cellular networks to packets that can travel over next-generation Internet Protocol (IP) or asynchronous transfer mode (ATM) optical networks.
Orders from TI and others may boost Teradyne, but outlook is still cloudy News & Analysis 6/29/2001 Post a comment BOSTON -- Teradyne Inc.'s outlook remains cloudy in spite of a recent uptick orders for its automatic test equipment (ATE) from several established and new customers, reportedly including Texas Instruments Inc., according to analysts.
It's been a rough time for Teradyne and other ATE companies. The downturn in the ATE business caused Teradyne earlier this month to reduce its workforce and lower its forecast for the second quarter of 2001.
Fixed wireless ready for wide rollout News & Analysis 6/29/2001 Post a comment Bolstered by hints that the Federal Communications Commission is unlikely to take away their spectrum, developers at a packed industry conference this past week said fixed broadband wireless systems are now primed for major deployment.
Japanese analyst sees cause for cheer in 2002 News & Analysis 6/29/2001 Post a comment Recovery for the global semiconductor business will occur next summer, an analyst predicted this week during a seminar on prospects for the world electronics and chip industries. Akira Minamikawa, senior analyst at WestLB Securities Pacific Ltd.'s Tokyo office, was one of the few to warn of disaster for the industry last summer.
Inficon claims first multi-sensor e-diagnostics system for fabs News & Analysis 6/29/2001 Post a comment EAST SYRACUSE, N.Y.-- Inficon Holding AG today said it will be the first to offer a multi-sensor system for e-diagnostics in wafer fabs and process tools. The company plans to introduce its eFabGuard Global Support Network and the multi-sensor e-diagnostics system during Semicon West next month in San Francisco.
European collaboration for SoC News & Analysis 6/29/2001 Post a comment Fujitsu Microelectronics Europe (FME) and Europe Technologies (ET), Sophia Antipolis, of France, have pooled their resources to offer a solution which reduces time-to-market for RISC/ARM based System-on-Chip (SoC) designs.
PowerPC 440 SoC support News & Analysis 6/29/2001 Post a comment Innoveda will enhance its V-CPU hardware/software co verification tool with a processor support package for IBM's PowerPC 440 core.
Wales Foundry issues design kit service News & Analysis 6/29/2001 Post a comment Analogue and mixed signal semiconductor foundry, European Semiconductor Manufacturing (ESM), and Nordic VLSI of Trondheim, Norway, have developed a new foundry design kit service for ESM customers.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.