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Content posted in June 2004
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Cutting RF power in W-CDMA phones
News & Analysis  
6/30/2004   Post a comment
The spread-spectrum wireless communications standard, IS-95/3GPP, embodies stringent specifications for linearity and adjacent-channel power ratio (ACPR), says this Maxim engineer. The power amplifier does not operate continuously in voice mode. When the phone user isn't speaking, it runs at a half rate (50 percent of the time) or at a one-eighth rate, so there's no worry about the phone's heating during voice mode. But in data mode the PA runs continuously until the data transmission is complet
Power reduction remains top priority for 3G mobiles
News & Analysis  
6/30/2004   Post a comment
Earlier this year, Vodafone chief executive officer Arun Sarin said that product quality deficiencies would slow the rollout of third-generation (3G) mobile phones. They are bulky, they get hot, and they don't have enough battery life," he said. Rob Keenan uses this as the kick-off point from an EE Times' article package on cell phone power managmenet. The big issue is in W-CDWA power consumption, he warns.
Panasonic follows Sony into Blu-ray disk market
News & Analysis  
6/30/2004   Post a comment
Matsushita Electric Industrial Co. will become the second Japanese manufacturer to introduce a Blu-ray disk recorder here on July 31.
DVD players, LCD screens driving DTV adoption
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6/30/2004   Post a comment
High-quality LCD and plasma screens capable of showing crisp, vivid images, coupled with the popularity of DVD players, are coaxing a growing number of consumers to buy digital televisions. For CMP's TechWeb.
Sharp sets road map for silicon-on-glass
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6/30/2004   Post a comment
Sharp Laboratories Europe has established a road map for the miniaturization of integrated circuits manufactured on the glass substrate used in displays.
Experts worry that synthetic biology may spawn biohackers
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6/30/2004   Post a comment
Design automation systems tailored to the task of genetic engineering could prove to be double-edged tools. While they represent a central thrust of the emerging synthetic biology movement, they also can lead to the accidental or deliberate creation of pathogenic biological components. Chappell Brown has this report.
Study: RFID saves money, displaces workers
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6/30/2004   Post a comment
As companies spend several billion dollars over the next three years installing inventory-tracking technology, the financial benefits they reap from increased supply-chain efficiency will be at the expense of millions of displaced workers.
U.S. Robotics management buys out Solectron
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6/30/2004   Post a comment
The U.S. Robotics management team has bought out Solectron, a move that will give the managers a majority stake in the modem manufacturer.
ReShape raises $12 million as EDA funding soars
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6/30/2004   Post a comment
Riding a wave of new venture capital funding for EDA companies, IC physical design provider ReShape Inc. announced Wednesday (June 30) that it has closed a $12 million round of series C funding. ReShape is among nine EDA companies who have collectively received over $87 million in the first six months of 2004.
Analyse : Les réseaux optiques passifs conviennent-ils à tous ?
News & Analysis  
6/30/2004   Post a comment
L'un des débats actuels dans le secteur des réseaux optiques concerne ce que l'on appelle les 'réseaux optiques passifs' (passive optical networks) ou PON. Certaines entreprises de notre industrie promeuvent l'utilisation des PON pour les résidences à occupants multiples et les zones urbaines denses. Font-ils la promotion de leur technologie aux dépens des conceptions de réseaux efficaces et du sens pratique ? Existe-t-il un meilleur moyen pour livrer des services de réseautage haute largeur de
EDA startup secures $12 million in Series C funding
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6/30/2004   Post a comment
EDA company ReShape Inc. has closed a $12 million Series C round of funding, the company said Wednesday (June 30). The money is set to be used to expand sales and customer support, the company said.
Digitale Schnittstelle gibt WLAN neue Möglichkeiten
News & Analysis  
6/30/2004   Post a comment
Die räumliche Trennung von von WLAN-Modem und HF-Chip erlaubt eine Entwicklung des IP-Anbieters NewLogic. Die Technik beruht auf der Digitalisierung der Schnittstelle zwischen den beiden Funktionseinheiten und gibt WLAN-Chipdesignern eine Reihe von Vorteilen an die Hand.
TI set to start building $3 billion fab early, says report
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6/30/2004   Post a comment
Leading mobile phone chipmaker Texas Instruments Inc. expects to start construction of a $3 billion wafer fab in Richardson, Texas, by the end of 2004, up to a year earlier than a previous schedule, according to an Associated Press report.
Vicor licenses Sony to use, supply 'V-I Chips'
News & Analysis  
6/30/2004   Post a comment
Power supply manufacturer Vicor Corp. has licensed Sony Corp. to use various power conversion technologies, including Vicor's Factorized Power Architecture, V-I Chip power converters and the enabling technologies and semiconductor components used within them.
DVD players, LCD screens driving DTV adoption
News & Analysis  
6/30/2004   Post a comment
High-quality LCD and plasma screens capable of showing crisp, vivid images, coupled with the popularity of DVD players, are coaxing a growing number of consumers to buy digital televisions.
Infineon, Nanya open 300-mm DRAM wafer fab
News & Analysis  
6/30/2004   Post a comment
Inotera Memories Inc., the DRAM joint venture formed between Infineon Technologies AG and Nanya Technology Corp. in 2002, has opened its 300-mm wafer fab.
Panasonic follows Sony into Blu-ray disk market
News & Analysis  
6/30/2004   Post a comment
Matsushita Electric Industrial Co. will become the second Japanese manufacturer to introduce a Blu-ray disk recorder here on July 31.
LG.Philips LCD maker cuts IPO target, says report
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6/30/2004   Post a comment
Display maker LG.Philips LCD Co. Ltd. has cut the value of its initial public offering for the second time in four days, according to a Reuters report.
MIT-Spinout plant Angriff auf Datenwandler-Markt
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6/30/2004   Post a comment
Mit 17 Millionen Dollar Risikokapital und einer streng geheimen Technik aus den Laboratorien des 'Massachussetts Institute of Technology' (MIT) will das Startup-Unternehmen Kenet den Markt für ultraschnelle A/D-Wandler aufmischen.
Nortel lagert Massenfertigung an Flextronics aus
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6/30/2004   Post a comment
Einen der größten Fertigungsverträge der Telekommunikationsbranche haben Nortel Networks und Flextronics unter Dach und Fach gebracht: Für umgerechnet schätzungsweise 675 bis 725 US-Millionen Dollar wird Flextronics künftig fast die gesamte Fertigung für Nortel übernehmen.
TI et ARM s’associent pour sécuriser les transactions sans fil
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6/30/2004   Post a comment
Texas Instruments Inc. et ARM Ltd. regroupent leurs technologies respectives Omap et TrustZone afin de développer un système fondé sur les semi-conducteurs pour des transactions sans fil sécurisées.
Silterra et l’IMEC sur le point de développer un procédé 0,13 micron pour 2005
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6/30/2004   Post a comment
Silterra Malaysia Sdn. Bhd. et le centre de recherche IMEC signent un accord afin de créer un procédé de fabrication CMOS 0,13 micron compatible avec celui des fonderies. Ce procédé reposerait sur un procédé de fabrication 0,13 micron élaboré en interne par l’IMEC et modifié pour répondre aux exigences fixées par les clients de fonderies de plaquettes, indique Silterra mardi (29 juin).
ST, Hynix China fab plan due in two months, says report
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6/30/2004   Post a comment
The chief executive of Franco-Italian chip maker STMicroelectronics said Tuesday (June 29) he hoped talks with South Korea's Hynix Semiconductor Inc over setting up a manufacturing joint venture, could be settled within two months, according to a Reuters report.
Agere wins ports in Nortel multiservice edge box
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6/30/2004   Post a comment
In the wake of Nortel's announced shift in manufacturing, Agere announced that Nortel has tapped its silicon for the development of the Optical Multiservice Edge (OME) 6500 platform.
IEEE regelt Ethernet auf der 'letzten Meile'
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6/30/2004   Post a comment
Die Norm IEEE 802.3ah für das "Ethernet für die erste Meile" ist fertig. Das gab die Industriegruppe EFMA (Ethernet in the First Mile Allicance) vergangene Woche auf der Supercomm bekannt. Die neue Norm betrifft das 'Ethernet für die erste Meile'. Zum gleichen Zeitpunkt wurde auch der 'Resilient Packet Ring' als Standard 802.17 frei gegeben.
Sharp sets road map for silicon-on-glass
News & Analysis  
6/30/2004   Post a comment
Sharp Laboratories Europe has established a road map for the miniaturization of integrated circuits manufactured on the glass substrate used in displays.
Des chercheurs parviennent à téléporter des bits quantiques
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6/30/2004   Post a comment
Des physiciens du National Institute of Standards and Technology (NIST) aux Etats-Unis et de l’Université d’Innsbruck, en Autriche, ont transféré des informations entre deux emplacements sans utiliser de support physique.
Sharp sets roadmap for Moore's Law of silicon-on-glass
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6/30/2004   Post a comment
Sharp Laboratories Europe, the European R&D arm for Japan's Sharp Corp., has set out a roadmap for the miniaturization of integrated circuits manufactured on the glass substrate used for a system's display.
Programmable gain amplifier
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6/30/2004   Post a comment
The LT5514 is an 850 MHz programmable gain amplifier optimized for cellular base station and cable headend equipment designs.
Switched Ethernet – manchmal besser als Passive Optical Networks
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6/30/2004   Post a comment
Für die Anbindung von Mehrfamilienhäusern und dicht bewohnten Stadtvierteln an Breitband-Netze propagieren viele Unternehmen 'Passive Optical Networks'PONs als probate Lösung. Aber sind PONs wirklich der Garant für praktikables und effizientes Netz-Design oder favorisieren diese Anbieter ihre Technik nur aus Eigennutz? Gibt es vielleicht gar eine bessere Möglichkeit, Wohnbezirke mit hoher Bevölkerungsdichte mit Breitband-Diensten zu versorgen?
Selon un responsable de Soitec, la technologie SOI sera à la base de la Xbox et de la PlayStation
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6/30/2004   Post a comment
Signe qu’elle est en passe d’entrer dans la norme, la technologie silicium sur isolant (SOI) va être utilisée dans les prochaines générations de la PlayStation de Sony et de la Xbox de Microsoft, selon Pascal Mauberger, directeur d’exploitation du fabricant de tranches SOI Soitec SA (Grenoble).
IEEE verabschiedet WLAN-Sicherheitsstandard
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6/30/2004   Post a comment
Dreieinhalb Jahre wälzte die IEEE komplexe, oftmals schier unlösbare technische Fragen. Mit der Verabschiedung der Sicherheitsänderungen für den 802.11-WLAN-Standard - die Grundlage für Wi-Fi-Netze - scheint das Standardisierungsgremium jetzt auf einen grünen Zweig gekommen zu sein.
Tektronix pays $325 million for test group Inet
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6/30/2004   Post a comment
Test equipment maker Tektronix Inc. has acquired, for about $325 million, communications software group Inet Technologies Inc. in a move that Tektronix said would speed efforts to deliver test gear for next-generation mobile and IP based networks.
Broadcom releases single-chip for 802.11g wireless LAN
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6/30/2004   Post a comment
Broadcom has become the latest Wi-Fi chipmaker to release a single-chip 802.11g solution aimed at smaller mobile and converged devices.
Infineon, Nanya open 300-mm DRAM wafer fab
News & Analysis  
6/30/2004   Post a comment
Inotera Memories Inc., a DRAM-making joint venture formed between Infineon Technologies AG and Nanya Technology Corp. in 2002, opened its 300-mm wafer fab.
Tektronix pays $325 million for test group Inet
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6/30/2004   Post a comment
Test equipment maker Tektronix Inc. has acquired, for about $325 million, communications software group Inet Technologies in a move that the Beaverton, Oregon based company says will speed efforts to deliver test gear for next generation mobile and IP based networks.
Selon certains chercheurs, les téléphones portables sont potentiellement nuisibles à la fertilité masculine
News & Analysis  
6/30/2004   Post a comment
L’innocuité des téléphones portables est une fois de plus remise en question alors que des chercheurs, réunis cette semaine à Berlin pour une conférence mondiale consacrée à la fertilité, prétendent que les hommes qui portent leurs téléphones portables dans la poche de leurs pantalons risquent de présenter une numération réduite des spermatozoïdes.
Toshiba prolonge la durée de vie des CMOS sur substrat au nœud de 22 nm
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6/30/2004   Post a comment
Toshiba Corp. vient de développer des technologies qui, selon la société, permettront de prolonger la durée de vie des CMOS sur substrat jusqu’au nœud de 22 nm, lequel n’entrera pas en production avant 2016, selon le calendrier établi dans l’édition 2003 de l’International Technology Roadmap for Semiconductors (ITRS).
Les Etats-Unis et l’Europe se mettent finalement d’accord sur les réseaux GPS
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6/30/2004   Post a comment
Un accord signé ce week-end lors du sommet réunissant les Etats-Unis et l’Union européenne ouvre la voie à l’interopérabilité entre le système européen de positionnement mondial Galileo, toujours en phase de développement, et le système GPS américain.
NewLogic demos WLAN chip with direct radio-modem interface
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6/30/2004   Post a comment
Wireless networking chip and IP specialist NewLogic Technologies (Lustenau, Austria) has started sampling a demonstration platform that uses its 802.11a/b/g chip set and what it says is one of the first commercial implementations of a high speed digital interface between the modem and radio.
Broadcom readies single-chip 802.11g
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6/30/2004   Post a comment
Broadcom has become the latest Wi-Fi chipmaker to release a single-chip 802.11g solution aimed at smaller mobile and converged devices.
Renesas outlines product, cost-cutting strategies
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6/30/2004   Post a comment
Fifteen months after its formation, Japan's Renesas Technology Corp. has put the finishing touches on a corporate reorganization to sustain its future growth and prepare for the next semiconductor cycle.
TI to adopt ARM's mobile security scheme
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6/30/2004   Post a comment
Texas Instruments Inc. renewed its vows with microprocessor developer ARM Ltd. by announcing a plan to incorporate ARM's hardware security scheme for chip sets used in wireless handsets.
Carbon, CoWare link RTL to SystemC
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6/29/2004   Post a comment
Claiming that co-simulation between a SystemC simulator and an event-driven RTL simulator is no longer needed, EDA startup Carbon Design Systems has announced that its DesignPlayer hardware and software validation modeling system works in CoWare's ConvergenSC SystemC simulation environment.
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