China's BCD Semi scraps IPO News & Analysis 6/30/2008 Post a comment China's BCD Semiconductor Manufacturing Ltd. has withdrew its plan for a U.S. initial public offering of its common stock, according to a filing from U.S. Securities & Exchange Commission (SEC).
Private equity to take major stake in NDS News & Analysis 6/30/2008 Post a comment News Corporation is planning to sell a significant share in its NDS Group plc subsidiary to private equity group Permira. NDS Group is a supplier of software, conditional access systems and architectural blueprints for digital pay-TV systems around the world.
Opinion: ST-NXP Wireless needs a new name News & Analysis 6/30/2008 3 comments ST-NXP Wireless, the new communications IC joint venture floated by STMicroelectronics NV and NXP BV, is starting life with a name that confuses its identity with those of the parent companies. Even before the ink dries up on its birth certificate, CEO Alain Dutheil should consider changing the name.
Samsung invests in Inside Contactless News & Analysis 6/30/2008 Post a comment Samsung Ventures America announced it has invested in French fabless supplier of smartcard chips Inside Contactless SA. Building upon investments from Nokia Growth Partners, Motorola Ventures and institutional investors, this participation brings the total investment in the company to about $42 million.
Airless tire reinvents wheel News & Analysis 6/30/2008 Post a comment Resilient Technologies together with the University of Wisconsin's Madison Polymer Engineering Center, are developing an airless tire to solve the problem with a four-year, $18-million grant from the Pentagon.
Are IC thermal problems hot air, question panelists News & Analysis 6/30/2008 Post a comment At the Design Automation Conference mid-June in Anaheim, California, an educational panel addressed the thermal issue in integrated circuit (IC) design. Two key questions were raised: When will this issue be emerging as a crucial concern if at all? What are the solutions to solve this potential crisis?
Europe again lags in chip sales for May '08 News & Analysis 6/30/2008 Post a comment Europe was again the laggard in semiconductor growth in May, with the WSTS figures showing it fared worst in both the three month moving average and year-to-year calculations compared to other regions, and that it showed the largest decline, of 0.3 percent, for sales between April and May 2008.
Chip sales increased 7.5% in May, says SIA News & Analysis 6/30/2008 Post a comment The three month moving average of global chip sales was $21.8 billion in May, 7.5 percent up on the $20.3 billion reported for May 2007, according to the Semiconductor Industry Association (SIA) and based on figures from WSTS.
Fabless chip market up 16% in Q1, says GSA News & Analysis 6/27/2008 Post a comment Fabless semiconductor company revenue totaled $13.4 billion in the first quarter of 2008, up 16 percent compared with the first quarter of 2007, according to the Global Semiconductor Alliance industry group.
Nokia, Symbian, Infineon, ST-NXP lead story ranking News & Analysis 6/27/2008 Post a comment Here are the top six online stories for the week beginning Sunday, June 22, as ranked by EE Times Europe readers, up to and including Friday, June 27. The ranking is based on the number of reader "views" or "hits" on a particular article.
Sony Ericsson posts another profits warning News & Analysis 6/27/2008 Post a comment A profit warning from Sony Ericsson sent the share price of most mobile phone makers lower as the joint venture between Sony and Ericsson said second-quarter sales and net income would be hit by slowing demand for mid- to high-end models, and that it would only break even for the quarter.
Global chip sales seen 7% up in May News & Analysis 6/27/2008 Post a comment The three-month moving average of global chip sales is estimated to have come in at $21.7 billion in May, up a healthy 7 percent on the $20.3 billion achieved in May 2007, according to Bruce Diesen, analyst at Carnegie Research.
Russia's Angstrem modernizes wafer fab News & Analysis 6/27/2008 Post a comment Chip manufacturer Angstrem (Zelenograd, Russia) has commissioned M+W Zander FE GmbH (Stuttgart, Germany) to expand and modernize its existing wafer fab. The investment amounts to 150 million (about $233 million).
Autodesk ends interest in bid for Flomerics News & Analysis 6/27/2008 Post a comment Autodesk will not pursue its interest in simulation software group Flomerics (Hampton Court, England) leaving the field clear again for Mentor Graphics, who has a 29 percent stake in the British company and who has made several bids to take control.
UK academic gets funds to improve code generation News & Analysis 6/27/2008 Post a comment A researcher from the School of Electronics and Computer Science at the University of Southampton has received funding of £300,000 pounds ($594,000) from the Engineering and Physical Sciences Research Council to improve the safety and usability of automatically generated software code used in the automotive and aerospace industries.
X-Fab emphasizes role as pure-play foundry News & Analysis 6/27/2008 Post a comment Despite offering intensive engineering support to its customers, X-Fab Semiconductor Foundries AG (Erfurt, Germany) rejects business models that include an own product development. Nevertheless, the company plans long-term growth, explains X-Fab CEO Hans-Jürgen Straub.
Infineon gives Bauer CEO title, axing "spokesman" designation News & Analysis 6/27/2008 Post a comment Infineon Technologies AG has quietly restored the title of chief executive officer to its top executive, dropping the ponderous designation of "spokesman of the management board" it gave Peter Bauer in May when he replaced Wolfgang Ziebart at the helms of the German semiconductor company.
Coming (not too) soon: wireless set-top boxes News & Analysis 6/27/2008 Post a comment Wireless is coming to the cable TV set-top box, but just which wireless and when is still not clear, said a Cox Communications executive after a panel on wireless video networking at the Connections conference.
Safe bet: tire pressure sensors Teardown 6/26/2008 Post a comment One of Portelligent's analysts had the presence of mind to gather up the damaged tire pressure monitor (TPM) from his Toyota during a recent service center visit.
MEMS market tops $6 billion News & Analysis 6/26/2008 Post a comment The worldwide microelectromechanical systems market topped $6 billion in 2007 and is growing at a compound annual rate of 14 percent, according to industry surveys.
Extreme design: SuitSat pushes engineers' limits Teardown 6/26/2008 1 comment When engineers from Microchip Technology took a routine microcontroller inquiry, little did they know they'd be embarking on a multiyear space mission that would challenge every aspect of their earthbound engineering experience, while reconnecting them with the excitement and sense of exploration that led them to choose engineering to begin with.
EVE names VP of worldwide operations News & Analysis 6/26/2008 Post a comment Emulation and Verification Engineering SA (EVE), French developer of hardware and software coverification tools, announced it has appointed Christophe Ballan as vice president of worldwide operations. He reports directly to Luc Burgun, EVE's CEO.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.