Forum planned on 40/100G Ethernet News & Analysis 6/30/2009 Post a comment The Ethernet Alliance will host a one-day forum in Silicon Valley on the changes coming with the 40 and 100 Gbit/second versions of the IEEE P802.3ba standard now in the works.
US EPA approves California auto emissions standard News & Analysis 6/30/2009 Post a comment The Obama administration Tuesday approved California's long-standing bid to set its own tough standards for vehicle emissions, a decision in tune with a national plan to boost fuel efficiency and reduce greenhouse gases linked to climate change.
Virginia Tech tools up with MathWorks News & Analysis 6/30/2009 Post a comment The MathWorks and Virginia Tech College of Engineering have signed a new three-year agreement for The MathWorks to provide resources and support for course components that utilize MathWorks tools.
Protests interrupt Cisco keynote News & Analysis 6/30/2009 1 comment Protesters interrupted a keynote speech by Cisco Systems chief executive John Chambers at the company's annual Cisco Live event in San Francisco today.
Micron puts 34-nm NAND chips in mass production News & Analysis 6/30/2009 Post a comment Micron Technology announced mass production of NAND flash memory chips using 34-nanometer (nm) process technology. Micron also said its subsidiary, consumer memory product provider Lexar Media, would deliver flash memory cards and USB flash drives based on the 34-nm devices.
Innovations in the 'More than Moore' era News & Analysis 6/30/2009 Post a comment For decades semiconductor developments have been driven by Moore’s Law productivity gains. This led to extremely fast digital processors, increases in bandwidth and huge memories that boost the productivity of PCs, mobile phones and other applications demanding heavy data traffic and storage. However, the economics of the IC industry as well as developments in society, are creating a paradigm-shift in the semiconductor world.
IBM re-uses PV thermal energy for better efficiency News & Analysis 6/30/2009 1 comment IBM researchers recently have shown that the reuse of cooling liquid for computers can increase the total efficiency of a system. Now they do a similar trick on solar cells. The result could be an overall efficiency of better than 50 percent.
Broadcom jacks up Emulex offer 19%, drops lawsuit News & Analysis 6/30/2009 Post a comment Broadcom Corp. has increased its offer for Emulex Corp. 20 percent, raising the value of the deal to $912 million, and has also dropped a lawsuit against the board of directors in a bid to engage the management in a friendly takeover discussion.
Spoerle greift Atom-Entwicklern unter die Arme News & Analysis 6/30/2009 Post a comment Eine beschleunigte und erleichterte Entwicklung von x86-basierten Embedded-Produkten verspricht der Distributor Spoerle Nutzern seines EPC-X86-Designkonzepts. Entwickler können dabei auf umfangreiche Funktionsbibliotheken und andere fachliche Unterstützung zugreifen.
Minalogic change de président News & Analysis 6/30/2009 Post a comment Le pôle de compétitivité Minalogic, dédié aux micro- et nanotechnologies et au logiciel embarqué, vient de nommer Philippe Delorme à sa présidence.
Amkor's founder to step down as CEO News & Analysis 6/29/2009 Post a comment Amkor Technology President and Chief Operating Officer Ken Joyce will assume the role of CEO of the company effective Oct. 1. James Kim, Amkor's founder, will step down as CEO and become executive chairman.
Climate bill spurs less green power than hoped News & Analysis 6/29/2009 Post a comment The renewable energy mandate in the climate change bill approved by the U.S. House of Representatives last week does not go far enough for green power proponents, but the proposed national standard is likely as strong as it will get.
Green pressure sensors tap quartz MEMS News & Analysis 6/29/2009 Post a comment Epson Toyocom unveiled a green sensor technology that eliminates dangerous oil and gases from pressure sensors, instead using a quartz microelectromechanical system (QMEMS) tuning fork as the sensing element.
ASE gains $365 million syndicated loan News & Analysis 6/29/2009 1 comment Taiwan's Advanced Semiconductor Engineering Inc. (ASE) has signed a syndicated loan agreement with 17 banks. The five-year loan is worth NT$12 billion ($364.7 million).
Industry agrees on unified cellphone chargers News & Analysis 6/29/2009 Post a comment The members of industry association Digitaleurope have signed a memorandum of understanding aiming at developing a common charging solution for mobile phones. The move dangles the availability of a charger that can be used across all almost brands.
Semico projects five-fold netbook growth News & Analysis 6/29/2009 Post a comment As many as 59 million netbooks will ship in 2013, nearly 22 percent of the mobile PC market and up almost five-fold from 2008, according to a new report by Semico Research that profiles the major chip contenders in the sector.
Green shoots start to sprout in green sector News & Analysis 6/29/2009 Post a comment Canada's alternative energy sector is showing signs of a budding recovery, as companies resurrect financing deals and public offerings that withered with the recession, but that revival remains very fragile.
Stantum, Sitronix team for multi-touch controllers News & Analysis 6/29/2009 Post a comment Stantum Technologies, the French multi-touch sensing technologies specialist, has teamed with Taiwanese group Sitronix (Hsinchu), which focuses on LCD driver and SoC design, to develop voltage matrix multi-touch single-chip solutions.
Siemens platform addresses Hi-Mix Low-Volume production News & Analysis 6/29/2009 Post a comment After several months of field testing, Siemens Electronics Assembly Systems GmbH (Munich) has launched sales for its Siplace SX component insertion machine platform. With a high degree of flexibility, the platform particularly addresses production environments characterized by frequent product changes and low volumes.
Sematech addresses EUV inspection gap News & Analysis 6/26/2009 Post a comment Following recent warning shots from Intel Corp., Sematech on Friday (June 26) sounded the alarm bells--again. The chip-making consortium warned that there is still a major funding shortfall and a lack of mask inspection gear to enable extreme ultraviolet (EUV) lithography.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.