MagnaChip withdraws IPO - again News & Analysis 6/30/2010 Post a comment MagnaChip Semiconductor LLC, a spinoff from Hynix Semiconductor Inc. that filed for bankruptcy protection in June 2009, has withdrawn a planned initial public offering due to "adverse market conditions."
HP, QLogic, Emulex FCoE News & Analysis 6/29/2010 Post a comment Hewlett-Packard is adopting new Fibre Channel over Ethernet chips from Emulex and QLogic in its latest round of data center systems, giving a much boost to the upcoming suppliers who face competition from entrenched chip designers including Broadcom, Intel and Marvell.
Supreme Court's Bilski patent ruling News & Analysis 6/29/2010 12 comments In a slim 5-4 majority, the Supreme Court decided not to endorse or define a test of what can be patented, instead, it issued a narrow decision in the case of Bernard Bilski vs. the U.S. Patent Office.
GE licenses Rambus LED technology News & Analysis 6/29/2010 Post a comment GE Lighting, a unit of the General Electric Company's appliances and lighting business, has signed a licensing agreement for the use of Rambus' lighting patents, reference designs and manufacturing process know-how.
EUV litho sources improving, says workshop News & Analysis 6/29/2010 2 comments Sources for extreme ultraviolet lithography are not yet sufficiently bright to allow commercial wafer throughputs, but they are improving sufficiently for beta tools shipping in 2011, according to participants at a workshop held in Maui, Hawaii.
Rohde & Schwarz find scope for expansion News & Analysis 6/29/2010 Post a comment Rohde & Schwarz is today launching its first dedicated oscilloscopes. It has developed its own ASICs and A to D converters to support the new design which is described as 20 times faster than existing devices.
Freescale plans basestation-on-chip News & Analysis 6/29/2010 2 comments Freescale Semiconductor plans to best its embedded communications competitors not just by depending on raw computing speed for its processors but by reaching the higher integration levels needed to put a "basestation on a chip," according to Lisa Su, senior vice president and general manager for networking and multimedia.
BOM for iPhone 4 is $188, says iSuppli News & Analysis 6/28/2010 2 comments The 16-Gbyte version of Apple's iPhone 4 carries a bill of materials cost of $187.51, keeping with Apple's strategy of maintaining hefty profit margins on the popular smartphone, according to a teardown analysis conducted by market research firm iSuppli.
Samsung, TSMC hit by ITC complaint News & Analysis 6/28/2010 3 comments STC.UNM (STC)--the technology-transfer arm of the University of New Mexico (UNM)--said that it is charging Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Samsung Electronics Co. Ltd. with alleged patent infringement.
Analyst: China's IC manufacturing spend paying off News & Analysis 6/28/2010 Post a comment Semiconductor fabs in China produced 40 billion ICs in 2009, accounting for 25.1 percent of domestic demand, up from 20.9 percent in 2004, according to a new report that concludes that massive investments in China's semiconductor industry are paying dividends.
Smart consumer devices News & Analysis 6/28/2010 Post a comment Consumer electronics is on the brink of a "smart devices revolution" according to the consumer electronics panel members at last week's Freescale Technology Forum.
CoorsTek buys ceramics unit for $245M News & Analysis 6/28/2010 Post a comment CoorsTek Inc., a manufacturer of ceramic and specialty material components, has signed a definitive agreement to purchase the advanced ceramics business of Saint-Gobain for about $245 million.
media tablet iPad Killer News & Analysis 6/28/2010 3 comments Whatever you prefer to call the next-gen media tablet, the popularity of these devices speaks to changes underway in how we use computers and consume content.
Obducat CEO resigns amid losses News & Analysis 6/28/2010 1 comment Amid losses and order delays, Patrik Lundstrom has been named acting CEO of Obducat AB (Malmo, Sweden), a supplier of nano-imprint lithography tools.
Report: Firms buy stake in PSi News & Analysis 6/28/2010 Post a comment Integrated Micro-Electronics Inc. (IMI)and Narra Venture Capital II have acquired a 67 percent stake in PSi Technologies Inc. (PSi) of the Philippines for $30 million.
Firm to pay up to $58M for Atmel's smart card biz News & Analysis 6/28/2010 Post a comment Atmel said it has entered into a definitive agreement to sell its Secure Microcontroller Solutions business to Inside Contactless for up to $58 million after completing consultation with the Works Council at Atmel's SMS facility in Rousset, France.
ADI to spend $28 million on Irish R&D News & Analysis 6/28/2010 1 comment IDA Ireland, the government agency responsible for industrial development in Ireland, has announced a 23 million euro (about $28 million) investment in R&D at Analog Devices facility in Raheen, County Limerick.
Atmel completes sale of fab in France News & Analysis 6/24/2010 Post a comment Germany's LFoundry GmbH, an analog and mixed-signal foundry, has completed its previously-announced acquisition of Atmel Corp.’s wafer fabrication operation in Rousset, France.
First look inside iPhone 4 Teardown 6/24/2010 6 comments You could call the new Apple iPhone 4 an iPad Nano because it uses at least six chips from the popular Apple tablet, according to analysts from UBM TechInsights that have done a teardown of the new smartphone, revealing it uses a MEMS gyro from STMicroelectronics.
China's $25 billion to boost domestic production, says analyst News & Analysis 6/24/2010 2 comments LONDON — The Chinese government is preparing to spend $25 billion on wafer fabs to boost domestic chip manufacturing over the next five years, according to market research company The Information Network. This is set to boost the proportion of local demand met by domestic wafer fabs and diminish Chinese chip imports, the analysis firm said
MIPS to restructure, align with Android News & Analysis 6/24/2010 Post a comment Processor IP licensor MIPS Technologies Inc. has announced a restructuring plan that will see it reduce headcount and incur a $1 million restructuring charge. The changes are expected to save company between $2 million and $2.4 million in annual expense, including the current financial year.
PCI Express 3.0 delayed until 2011 News & Analysis 6/24/2010 3 comments The PCI SIG has released an interim 0.71 version of the PCI Express 3.0 specification that supports up to 8 GigaTransfers/second and aims to start testing products for compliance in early 2011, about a year later than originally anticipated.
AMD x86 cores at Hot Chips News & Analysis 6/24/2010 Post a comment AMD is expected to steal the limelight at the annual Hot Chips conference when it describes two new x86 cores that mark the first major architectural advance for the company in several years.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.