Newport Media gets the ISDB picture in smartphones News & Analysis 6/29/2012 5 comments Fabless chip company Newport Media has won design slots for its digital television receiver SoCs in smartphones and feature phones from Samsung, HTC, LG, Motorola and ZTE. The chips are specifically for reception of Integrated Services Digital Broadcasting-Terrestrial transmissions, which are standard in Latin American and Japanese markets.
Litho firm buys packaging patents from IBM News & Analysis 6/28/2012 2 comments Ultratech, a supplier of lithography and laser-processing systems used to manufacture semiconductors, said it acquired the rights to a collection of chip packaging patents from IBM. The purchase price was not disclosed.
Marvell aims to be China chip leader News & Analysis 6/28/2012 10 comments No, Marvell Technology is not moving to China. However, the U.S. fabless chip company wants to become “the largest semiconductor company in China,” according to a Marvell executive.
Report: Qualcomm wafer fab not ruled out News & Analysis 6/28/2012 30 comments Paul Jacobs, CEO of Qualcomm, the world's largest fabless chip company, has not ruled out owning a wafer fab or putting large amounts of cash down to ensure the firm's supply of semiconductor chips, according to a Bloomberg report.
Researchers report solid-state quantum leaps News & Analysis 6/27/2012 5 comments Labs in the U.S. and Europe separately reported progress in adapting solid-state materials to store spintronic quantum states, a critical hurdle on the path to using spintronics in quantum computing.
Wire insulation enables relaxed design rules News & Analysis 6/27/2012 1 comment The semiconductor industry is seeing increasing demand for miniaturization which necessitates changes in chip design, including larger numbers of I/O per unit space, multi-tier devices, and stacked dies that increase wire density.
Maxim pledges $200M boost for U.S. chip making News & Analysis 6/27/2012 2 comments Analog and mixed-signal chip maker Maxim said it plans to spend $200 million to upgrade its wafer fabs in Oregon, Texas and California. The investment will also create additional manufacturing jobs.
AMD rolls low-power embedded APU News & Analysis 6/27/2012 Post a comment AMD introduced an accelerated processing unit targeted at very low power, small form factor and cost-sensitive embedded designs that require a combination of x86 compatibility and graphics.
PV gross margins fell 75% in Q1 News & Analysis 6/26/2012 2 comments Average gross profits of crystalline photovoltaic (PV) industry module manufacturers fell to 9 cents per watt in the first quarter of 2012 and are expected to decline further to 7 cents per watt by the end of 2012, according to IMS Research market report.
Virtual jobs fair offers engineers work in Singapore News & Analysis 6/26/2012 21 comments Engineers with experience in the consumer electronics and semiconductor sectors and who are prepared to continue their careers in Singapore could benefit from the first ever online recruitment event being organized by Contact Singapore.
Why TI does MCU designs in Shanghai News & Analysis 6/26/2012 32 comments Multinational chip companies who’ve consigned some of their design work to China tend to do so quietly; but a few leading companies are clearly making deeper inroads in China, and they’re not especially shy about it.
Rambus names Ronald Black CEO News & Analysis 6/25/2012 Post a comment Rambus named Ronald Black, a 20-year veteran of the semiconductor and mobile industries, to the position of CEO, replacing Howard Hughes, who announced earlier this year he would retire.
Video: '7 minutes of terror' for next Mars probe News & Analysis 6/25/2012 58 comments Curiosity, the Mars rover scheduled to land in August, will rely on a rocket-powered sky crane to slow its velocity from 13,000 mph to zero in seven minutes. A NASA video explains the unprecedented landing sequence.
Sony, Panasonic join hands to print OLED displays News & Analysis 6/25/2012 10 comments Sony and Panasonic have said they will collaborate in the development of organic light emitting diode (OLED) panels and modules for TVs and large-sized displays and, at the same time, consider the oossibility of collaboration in mass production of OLED displays.
Former Movidius executive joins haptic startup as CEO News & Analysis 6/25/2012 1 comment Paul Costigan has become CEO of Senseg, a Finnish startup company that has developed touch interface technology that generates the feeling of virtual buttons on smooth surfaces. The technology has potential in smartphones, tablet computers and many other consumer and industrial applications.
Reports: Olympus-Sony partnership News & Analysis 6/22/2012 6 comments Olympus Corp. is negotiating a roughly 50 billion yen investment from Sony Corp. The move, if materialized, will make Sony a partner in Olympus’ efforts to rebuild itself from last year’s accounting scandal.
Freescale, Vivante, Rightware team on automotive display News & Analysis 6/22/2012 3 comments Automotive displays have been getting a lot more dynamic and flexible and long gone are the days of a physical needle twitching in front of circular dial. That trend is set to continue thanks to Rightware, a developer of user interface graphics, Freescale and Vivante. The three companies have joined forces to create an automotive infotainment and instrumentation display platform.
Dial 'M' for MediaTek News & Analysis 6/22/2012 12 comments MediaTek’s bid to buy Mstar is likely to cement the supremacy of the combined power of the two Taiwan-based companies -- often described as the “M brothers” -- in the digital consumer market,
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.