Breaking News
News & Analysis, Opinion, Teardown
Content posted in June 2012
Page 1 / 5   >   >>
Novaled expands agreement with Samsung Mobile Display
News & Analysis  
6/29/2012   2 comments
Novaled has entered into a multi-year licensing and purchase agreement with Samsung Mobile Display to provide dopant materials used in the transport layers of its AMOLED display modules from Novaled.
UMC licenses IBM technology for 20-nm FinFETs
News & Analysis  
6/29/2012   9 comments
UMC said it licensed technology from IBM to expedite the development of its 20-nm CMOS process, including FinFET 3-D transistors.
Newport Media gets the ISDB picture in smartphones
News & Analysis  
6/29/2012   5 comments
Fabless chip company Newport Media has won design slots for its digital television receiver SoCs in smartphones and feature phones from Samsung, HTC, LG, Motorola and ZTE. The chips are specifically for reception of Integrated Services Digital Broadcasting-Terrestrial transmissions, which are standard in Latin American and Japanese markets.
Litho firm buys packaging patents from IBM
News & Analysis  
6/28/2012   2 comments
Ultratech, a supplier of lithography and laser-processing systems used to manufacture semiconductors, said it acquired the rights to a collection of chip packaging patents from IBM. The purchase price was not disclosed.
Micron reportedly strikes deal to buy Elpida for $2.5 billion
News & Analysis  
6/28/2012   15 comments
U.S.-based memory chip vendor Micron Technology has reached a deal to acquire bankrupt Japanese DRAM vendor Elpida Memory for roughly $2.5 billion, according to an English language report by Japan's Nikkei newspaper.
Marvell aims to be China chip leader
News & Analysis  
6/28/2012   10 comments
No, Marvell Technology is not moving to China. However, the U.S. fabless chip company wants to become “the largest semiconductor company in China,” according to a Marvell executive.
Report: Qualcomm wafer fab not ruled out
News & Analysis  
6/28/2012   30 comments
Paul Jacobs, CEO of Qualcomm, the world's largest fabless chip company, has not ruled out owning a wafer fab or putting large amounts of cash down to ensure the firm's supply of semiconductor chips, according to a Bloomberg report.
Nordic streamlines code in latest RF chips
News & Analysis  
6/28/2012   10 comments
Nordic Semiconductor announced the first members of its nRF51 family of 2.4 GHz RF chips that take a fresh approach to separating protocol and apps software.
U-blox makes LTE move, buys Cognovo and 4M Wireless
News & Analysis  
6/28/2012   2 comments
Swiss GPS and wireless chip company U-blox is acquiring 4G chip company Cognovo and LTE protocol licensor 4M Wireless for approximately $26 million.
Legislation seeks to relax restrictions on tracking fake chips
News & Analysis  
6/28/2012   12 comments
A House proposal seeks to reverse U.S. customs rules that prevent chip makers from examining fake chips to determine their authenticity. However, the bill is a long way from final passage.
Researchers report solid-state quantum leaps
News & Analysis  
6/27/2012   5 comments
Labs in the U.S. and Europe separately reported progress in adapting solid-state materials to store spintronic quantum states, a critical hurdle on the path to using spintronics in quantum computing.
Bourns buy of Jensen Devices opens auto lamp play
News & Analysis  
6/27/2012   1 comment
Bourns, Inc. has completed its purchase of substantially all of the assets of Jensen Devices AB (Stockholm, Sweden), a design and manufacturing firm of gas discharge tubes.
Google launches 7-inch, $199 Android tablet
News & Analysis  
6/27/2012   27 comments
As expected, Google used the occasion of its Google I/O developer event to launch a 7-inch media tablet, made by Taiwan's Asustek, which will be available in mid-July starting at $199.
Wire insulation enables relaxed design rules
News & Analysis  
6/27/2012   1 comment
The semiconductor industry is seeing increasing demand for miniaturization which necessitates changes in chip design, including larger numbers of I/O per unit space, multi-tier devices, and stacked dies that increase wire density.
U.S., European manufacturers join forces to compete with China
News & Analysis  
6/27/2012   56 comments
U.S. and European EMS providers are beginning to join forces as one way to compete with China's electronics manufacturing juggernaut.
Maxim pledges $200M boost for U.S. chip making
News & Analysis  
6/27/2012   2 comments
Analog and mixed-signal chip maker Maxim said it plans to spend $200 million to upgrade its wafer fabs in Oregon, Texas and California. The investment will also create additional manufacturing jobs.
Indian fabless startup seeks $20 million, say reports
News & Analysis  
6/27/2012   15 comments
Fabless mobile computing chip company Ineda Systems Pvt Ltd. (Hyderabad, India) is planning to raise $20 million over the next few months, according to local reports.
Displayport, HDMI duel over mobile links
News & Analysis  
6/27/2012   2 comments
VESA’s Mobility Displayport will compete with Silicon Image’s MHL for which will be the interconnect of choice for high def video in handsets and beyond.
Court halts U.S. sales of Samsung's Galaxy Tab 10.1
News & Analysis  
6/27/2012   4 comments
A U.S. judge on Tuesday backed Apple Inc's request to stop Samsung Electronics selling its Galaxy Tab 10.1 tablet in the United States, Reuters reported.
Infineon lowers guidance as business softens
News & Analysis  
6/27/2012   Post a comment
German chip company Infineon has updated its outlook for the third and fourth quarters of its 2012 fiscal year.
Intel announces another university research center
News & Analysis  
6/27/2012   2 comments
Intel CTO Justin Rattner announced the seventh Intel Science and Technology Center will focus on social computing and be based at the University of California, Irvine.
MediaTek to bring premier smartphone features to $150 - $200 handsets
News & Analysis  
6/27/2012   13 comments
Gunning for a growing market in mid- and entry-level smartphones, MediaTek is rolling out a new dual-core mobile phone platform, offering advanced multimedia features similar to those available on high-end smartphones such as Apple’s iPhones 4.
AMD rolls low-power embedded APU
News & Analysis  
6/27/2012   Post a comment
AMD introduced an accelerated processing unit targeted at very low power, small form factor and cost-sensitive embedded designs that require a combination of x86 compatibility and graphics.
2x2mm MEMS microphones delivered in tough plastic packages
News & Analysis  
6/27/2012   Post a comment
STMicroelectronics' novel microphone-assembly process ensures superior electrical and acoustic performance, unbeatable mechanical robustness, and slimmer form factors, according to the manufacturer.
PV gross margins fell 75% in Q1
News & Analysis  
6/26/2012   2 comments
Average gross profits of crystalline photovoltaic (PV) industry module manufacturers fell to 9 cents per watt in the first quarter of 2012 and are expected to decline further to 7 cents per watt by the end of 2012, according to IMS Research market report.
Wolfson wins audio slot in Samsung smartphone
News & Analysis  
6/26/2012   6 comments
Wolfson Microelectronics, a Scottish mixed-signal fabless chip company, has announced that its WM1811 audio hub IC is being used within the Galaxy S III smartphone from Samsung.
Virtual jobs fair offers engineers work in Singapore
News & Analysis  
6/26/2012   21 comments
Engineers with experience in the consumer electronics and semiconductor sectors and who are prepared to continue their careers in Singapore could benefit from the first ever online recruitment event being organized by Contact Singapore.
Dow Corning and Suss cooperate on making 3-D TSV chips
News & Analysis  
6/26/2012   Post a comment
Dow Corning and SUSS MicroTec are collaborating on developing a material and equipment system solution for high volume manufacturing of 3-D TSV packaged devices.
Quantum film firm InVisage appoints Madavi chairman
News & Analysis  
6/26/2012   2 comments
InVisage, a California startup developing a novel form of image sensor, has appointed industry veteran Syrus Madavi as chairman of the board.
Imec, Murata team on reconfigurable radio IC design
News & Analysis  
6/26/2012   1 comment
Next generation wireless access asks for reconfigurable radios. Imec and Murata Manufacturing Co. Ltd. said they have sealed a three-year R&D collaboration to work on cognitive reconfigurable radio front-end.
Slideshow: Scenes from the FTF 2012 Tech Lab
News & Analysis  
6/26/2012   3 comments
Snapshots from the hundreds of cool exhibits at the Freescale Technology Forum 2012 Tech Lab.
Why TI does MCU designs in Shanghai
News & Analysis  
6/26/2012   32 comments
Multinational chip companies who’ve consigned some of their design work to China tend to do so quietly; but a few leading companies are clearly making deeper inroads in China, and they’re not especially shy about it.
Dow Corning, SUSS MicroTec team on TSV chip packaging
News & Analysis  
6/26/2012   Post a comment
Materials vendor Dow Corning and semiconductor manufacturing equipment provider SUSS MicroTec said they would collaborate on a temporary bonding solution for 3-D through-silicon via semiconductor packaging.
Fab tool spending to fall 9% in 2012, says Gartner
News & Analysis  
6/25/2012   Post a comment
Worldwide wafer fab equipment spending is on pace to total $33 billion in 2012, a decline of 9 percent from $36.2 billion in 2011, according to market research firm Gartner.
Rambus names Ronald Black CEO
News & Analysis  
6/25/2012   Post a comment
Rambus named Ronald Black, a 20-year veteran of the semiconductor and mobile industries, to the position of CEO, replacing Howard Hughes, who announced earlier this year he would retire.
Renesas seeks $620 million from KKR, says report
News & Analysis  
6/25/2012   13 comments
Struggling Japanese chip company Renesas Electronics Corp. is to seek a 50 billion yen (about $620 million) investment from private equity firm Kohlberg Kravis Roberts & Co., according to a Nikkei report.
Nexus 5001 expands test debug interfaces
News & Analysis  
6/25/2012   Post a comment
The Nexus 5001 Forum has added two new interfaces and ratified IEEE-ISTO 5001-2012 Standard as a global embedded processor debug interface.
Video: '7 minutes of terror' for next Mars probe
News & Analysis  
6/25/2012   58 comments
Curiosity, the Mars rover scheduled to land in August, will rely on a rocket-powered sky crane to slow its velocity from 13,000 mph to zero in seven minutes. A NASA video explains the unprecedented landing sequence.
Sony, Panasonic join hands to print OLED displays
News & Analysis  
6/25/2012   10 comments
Sony and Panasonic have said they will collaborate in the development of organic light emitting diode (OLED) panels and modules for TVs and large-sized displays and, at the same time, consider the oossibility of collaboration in mass production of OLED displays.
Patent snafus could delay new video codec
News & Analysis  
6/25/2012   10 comments
The upcoming H.265 EVC video codec promises big gains in video compression, but chip makers are afraid to design products using it due to the lack of a patent pool.
Former Movidius executive joins haptic startup as CEO
News & Analysis  
6/25/2012   1 comment
Paul Costigan has become CEO of Senseg, a Finnish startup company that has developed touch interface technology that generates the feeling of virtual buttons on smooth surfaces. The technology has potential in smartphones, tablet computers and many other consumer and industrial applications.
Intel may see $2B growth beyond PCs in 2013
News & Analysis  
6/25/2012   13 comments
Next year, Intel is poised to generate $2 billion in revenues—half its expected revenue growth—from chips outside its traditional x86 PC processors, said an analyst.
Freescale takes shotgun approach to base station SoCS
News & Analysis  
6/22/2012   4 comments
Freescale Semiconductor is casting a wide net in its pursuit of sockets in the nascent market for small cell base stations, according to Scott Aylor, general manager of Freescale's wireless access division.
Look Ma, no network: Group drives LTE Direct
News & Analysis  
6/22/2012   4 comments
More than a dozen companies are supporting a proposed standard called LTE Direct for device-to-device links among Long Term Evolution handsets.
Small cells still not ready for mobile prime time
News & Analysis  
6/22/2012   9 comments
Engineers still have significant work ahead to deliver small cell base stations to ease heavily loaded mobile data networks, according to talks at a recent mobile event.
Sony to spend $1-billion on CMOS sensor production
News & Analysis  
6/22/2012   8 comments
Sony has announced that it plans to spend about 80 billion yen (about $1 billion) by September 2013 to expand its manufacturing capacity for stacked CMOS image sensors.
Reports: Olympus-Sony partnership
News & Analysis  
6/22/2012   6 comments
Olympus Corp. is negotiating a roughly 50 billion yen investment from Sony Corp. The move, if materialized, will make Sony a partner in Olympus’ efforts to rebuild itself from last year’s accounting scandal.
Freescale, Vivante, Rightware team on automotive display
News & Analysis  
6/22/2012   3 comments
Automotive displays have been getting a lot more dynamic and flexible and long gone are the days of a physical needle twitching in front of circular dial. That trend is set to continue thanks to Rightware, a developer of user interface graphics, Freescale and Vivante. The three companies have joined forces to create an automotive infotainment and instrumentation display platform.
Dial 'M' for MediaTek
News & Analysis  
6/22/2012   12 comments
MediaTek’s bid to buy Mstar is likely to cement the supremacy of the combined power of the two Taiwan-based companies -- often described as the “M brothers” -- in the digital consumer market,
Leti codevelops sun-powered roller shutter
News & Analysis  
6/22/2012   9 comments
Transferring technological value to SMEs is an objective per se for France-based CEA-Leti research center. One illustration is the co-development of a solar-powered roller shutter with France-based Bubendorff SAS.
Page 1 / 5   >   >>


Flash Poll
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Rishabh N. Mahajani, High School Senior and Future Engineer

Future Engineers: Don’t 'Trip Up' on Your College Road Trip
Rishabh N. Mahajani, High School Senior and Future Engineer
7 comments
A future engineer shares his impressions of a recent tour of top schools and offers advice on making the most of the time-honored tradition of the college road trip.

Max Maxfield

Juggling a Cornucopia of Projects
Max Maxfield
20 comments
I feel like I'm juggling a lot of hobby projects at the moment. The problem is that I can't juggle. Actually, that's not strictly true -- I can juggle ten fine china dinner plates, but ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
41 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

Karen Field

July Cartoon Caption Contest: Let's Talk Some Trash
Karen Field
151 comments
Steve Jobs allegedly got his start by dumpster diving with the Computer Club at Homestead High in the early 1970s.

Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)