Magnetic RAM Remains Niche Memory – for Now News & Analysis 6/30/2014 4 comments One report is bullish on MRAM's growth prospects and its potential to replace DRAM and SRAM, while the primary vendor of the nonvolatile memory still sees plenty of short-term opportunity in niche applications, including enterprise storage.
AMS, Dialog Confirm Merger Talks News & Analysis 6/30/2014 6 comments Mixed-signal, power, and RF chip companies AMS AG and Dialog Semiconductor plc have announced that they are in discussions over a possible merger.
Silicon Highway Narrows, Twists News & Analysis 6/30/2014 6 comments The need for multi-patterning at 20 nm and beyond is one of several factors adding cost and complexity for chip vendors, two experts say.
Google Boots Up Project Ara News & Analysis 6/27/2014 9 comments Project Ara is literally up and running, as members of Google’s Advanced Technology and Projects team demonstrated a prototype modular phone at the company’s developer conference. Although the smartphone prototype, froze while booting up, project leads were excited about the device’s potential.
Seeing Is Believing With Google’s Tango Tablet News & Analysis 6/26/2014 8 comments Project Tango will be in consumer hands as early as next year, speakers at Google's I/O developer conference said today. Google is in early engagements with LG to produce the 3D depth sensing tablet next year.
Cirrus to Take Half Audio IC Market, Says Report News & Analysis 6/26/2014 6 comments Price pressure in the growing audio IC market is leading to consolidation and will continue, according to SensiAn Research. And it is happening top-down with the acquisition of Wolfson Microelectronics by Cirrus Logic.
Google Previews Upcoming Android Release News & Analysis 6/25/2014 23 comments At its annual I/O developer conference held today, Google announced a litany of updates to its mobile, auto, entertainment, and wearable platforms with a new version of Android. The upcoming Android L release will run on three smartwatches, 25 vehicles, and a phone for emerging markets.
TRW Launches Its Largest R&D Center -- in China News & Analysis 6/24/2014 2 comments TRW Automotive Holdings has opened an R&D center in China. Placing its largest technology center in the Middle Kingdom provides a clear hint about where the automotive supplier expects further growth.
China Smartphones: Hot for Sensor Hubs News & Analysis 6/23/2014 5 comments Hillcrest Labs has snatched a smartphone design win for its sensor hub software from Coolpad. This illustrates the insatiable desire among smartphone and wearable vendors to add more sensors to their devices.
Micron 3D Memory Supercharges Xeon Phi News & Analysis 6/23/2014 8 comments Analysts have speculated wildly about the technical details of the massively parallel next-generation Knights Landing Xeon Phi. Today Intel and its 3D memory partner, Micron Technology Inc., put all that speculation to rest.
Intel Massive Parallel Upgrades Due News & Analysis 6/23/2014 8 comments Intel ups the ante in supercomputer processors by boosting Xeon Phi from 1 to 3 teraflops, adding an on-chip optical fiber interface and 16 Gbytes of 3D hybrid memory cube jointly developed with Micron.
X-Fab Cranks Up MEMS Capacities News & Analysis 6/23/2014 Post a comment Semiconductor foundry X-Fab is expanding its MEMS manufacturing capacity in its Erfurt and Itzehoe locations. At these locations, X-Fab is adding 21.500 square feet of cleanroom facilities.
Brazil Wins in LFoundry Rousset Sell-Off News & Analysis 6/20/2014 1 comment South American wafer fab Six Semiconductores of Belo Horizonte, Brazil, has been selected by the Commercial Court of Paris to buy the assets of the bankrupt LFoundry Rousset wafer fab site.
Supreme Court Rules Against Software Patents News & Analysis 6/19/2014 28 comments In a case that may affect the tech industry for years to come, the Supreme Court struck down a case on the patentability of software. The unanimous vote in Alice Corporation Pty. Ltd. v. CLS Bank International renders software patents ineligible as abstract ideas.
Molex's Shopping Spree Continues News & Analysis 6/18/2014 1 comment Following the recent acquisition of the heavy-duty connector business of Westec last May, and after acquiring the Munich-based FCT Electronics Group in August last year, Molex, which only merged with cabling and connector giant Koch Industries in November last year, is now acquiring Flamar Cavi Elettrici S.r.l.
Is China the World's Leading Cyberspy? News & Analysis 6/17/2014 6 comments This is the first of a three-part series examining the fallout on industry from China's alleged cyberspying. Today we examine the proof of spying and its effects on industry.
Analog Devices' $2 Billion RF Buy News & Analysis 6/17/2014 6 comments With its $2 billion cash deal to acquire RF chip maker Hittite Microwave Corp. last week, ADI will gain more than a 1,000 RF chip products that cover the frequency range of DC to 110 GHz: RF (0 to 6 GHz), microwave (6 GHz to 20 GHz), and millimeter wave (20 GHz to 110 GHz).
Make Way for Autonomous Cars News & Analysis 6/17/2014 1 comment Google's recent announcement that it would produce approximately 100 self-driving cars came as a surprise to the general public, but it's hardly a new idea within the auto industry.
DRAM's Mood Swings Stabilize News & Analysis 6/17/2014 5 comments From factory fires to consolidations, DRAM manufacturers have been through a lot, but now appear to be stabilizing as the market takes off.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.