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Content posted in August 2009
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Lab-on-chip innovator Michelle Khine to be honored
News & Analysis  
8/31/2009   Post a comment
Michelle Khine, a professor at the University of California at Irvine, will be honored next month for inventing a method for fabricating microfluidic devices without a clean room.
Macronix mulls plan to build 300-mm fabs
News & Analysis  
8/31/2009   Post a comment
Taiwan's Macronix International Co. Ltd. is mulling plans to build two 300-mm fabs--at a cost of $4.9 billion, according to reports.
China stimulus seen as opportunity for IC firms
News & Analysis  
8/31/2009   Post a comment
Market research firm Gartner advised semiconductor firms to step up efforts to work with Chinese manufacturers in order to cash in on a rise in that country's domestic demand being driven by a government subsidy program for home appliances.
Communications failure ends India's first lunar mission
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8/31/2009   Post a comment
India's first lunar mission was called off after communications were lost with the Chandrayaan 1 spacecraft headed to the moon.
Taejin opts for Tower Semiconductor's power management process to produce voltage regulator ICs
News & Analysis  
8/31/2009   Post a comment
Taejin Technology, Co., Ltd., (Daejeon, Korea), a linear and switching regulators supplier, has selected global specialty foundry, Tower Semiconductor, Ltd., (Migdal Ha'emek, Israel) to manufacture Taejin's low power, high efficiency voltage regulator ICs.
Magma posts loss, amends tender offer
News & Analysis  
8/31/2009   Post a comment
Magma Design Automation posted a loss in accordance with generally accepted accounting principles of $4.3 million on revenue of $28.8 million for the first quarter of its fiscal 2010, the company reported last week.
Vimicro buys surveillance line from Alcatel-Lucent
News & Analysis  
8/31/2009   Post a comment
China's Vimicro International Corp., a multimedia semiconductor provider, has entered into a definitive agreement to acquire the video surveillance system technology line from Alcatel-Lucent Shanghai Bell Ltd. Co.
SRAM market consolidates as Sony exits
News & Analysis  
8/31/2009   Post a comment
The SRAM market continues to consolidate.
Globalfoundries in multi-year contract with Cadence
News & Analysis  
8/31/2009   Post a comment
Foundry services provider Globalfoundries has signed a multi-year technology contract with semiconductor design software vendor Cadence Design Systems. The deployment covers large parts of the design chain including verification and manufacturing.
Nonvolatile memory IP market set to stall, says Gartner
News & Analysis  
8/31/2009   Post a comment
The market for nonvolatile memory intellectual property was $23 million in 2008, down 6.3 percent from 2007, according to market analysis company Gartner Inc. Gartner expects the market to grow 3 percent in 2009
Shin-Etsu joins Sematech's 22-nm resist program
News & Analysis  
8/31/2009   Post a comment
Shin-Etsu Chemical Co. Ltd has joined SEMATECH's Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex.
Intel raises Q3 revenue guidance on increased demand
News & Analysis  
8/31/2009   Post a comment
Chipmaker Intel Corp. (Santa Clara, Calif.) raised its guidance Friday (Aug. 28) for revenue for the third quarter to $9.0 billion, plus or minus $200 million, citing stronger demand for its microprocessors and chipsets as the reason.
July averaged chip sales up 5.3% on previous month
News & Analysis  
8/31/2009   Post a comment
The three-month average of global sales of semiconductors rose to $18.15 billion in July, up 5.3 percent from $17.24 billion in June. July sales were down 18.2 percent from $22.19 billion in July 2008.
European chip market continues slow recovery
News & Analysis  
8/31/2009   Post a comment
In July, sales for the European chip industry were up for the third month in a row, reports the European Semiconductor Industry Association (ESIA).
European chip vendors research manufacturing advantage
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8/31/2009   Post a comment
A group of European chip manufacturers and academic institutions have gathered in a research project aiming at improving the competitiveness of European chip industry. The 'IMPROVE' project focuses on specific aspects of chip semiconductor production: virtual metrology and predictive maintenance.
LDRA integrates tool suite with IBM Rational Rose RealTime MDDE
News & Analysis  
8/29/2009   Post a comment
The LDRA tool suite, which supports the analysis, instrumentation, and testing of both auto-generated and user-created source code, has been integrated into the IBM Rational Rose RealTime model-driven development environment.
California Micro fights back in proxy battle
News & Analysis  
8/29/2009   1 comment
The bitter proxy battle has intensified at California Micro Devices Inc. (CMD).
Engineer bonus, jobs and Dresden lead weekly story ranking
News & Analysis  
8/28/2009   Post a comment
Here are the top five online stories for the week beginning Sunday, Aug. 23, as ranked by EE Times Europe readers, up to and including Friday, Aug. 28. The ranking is based on the number of reader "views" or "hits" on a particular article.
Liquid-OLED could boost flexible displays, e-readers
News & Analysis  
8/28/2009   Post a comment
The possibility of combining the rich color gamut of organic light emitting diode (OLED) displays with enhanced flexibility is opened up by an academic paper on a liquid-OLED display in a recent issue of Applied Physics Letters.
Bliley : OCXOs are only 9 mm high
News & Analysis  
8/28/2009   Post a comment
Bliley Technologies has released the sub-miniature OCXO (oven controlled crystal oscillator) DIP NVG79.
Hands-on training tool seeks to address analog design skill shortages
News & Analysis  
8/28/2009   Post a comment
To address analog design skill shortages, The Institute for System Level Integration has introduced a hands-on training tool that enables would-be analog designers to design, build and perform measurements on analogue circuits.
Paper: Infineon cuts payments to former CEO Ziebart
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8/28/2009   Post a comment
According to Financial Times Deutschland (FTD), Infineon's supervisory board has agreed to reduce the interim payments to ex-CEO Wolfgang Ziebart. Insiders believe the move is an act of personal revenge.
Gateways, Web shape next-gen home networks
News & Analysis  
8/28/2009   Post a comment
Tomorrow's home networks will be shaped by a race to bring the Web to digital home products and the rising influence of service providers, according to a market watcher Parks Associates in an online talk.
Failure not an option: Heading off chip flaws during design
News & Analysis  
8/27/2009   Post a comment
Engineers could detect design flaws resulting in cracks, fractures and interface faults before chip fabrication using a new method that harnesses an electronics failure simulation technique called peridynamic equations.
IBM visualizes single molecule structure
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8/27/2009   Post a comment
Scientists at IBMs Zurich laboratory have succeeded to visualize the structure of an individual molecule using non-contact atomic force microscopy (AFM). The move is a further step to a still very distant future: Molecular electronics.
Group bids to spend $178M on smart grids
News & Analysis  
8/27/2009   1 comment
A team of utilities, vendors and research groups has submitted a five-year, $178 million proposal to the U.S. Department of Energy to build a smart electric grid demonstration system in the Pacific Northwest region, one of more than 400 bids for economic stimulus grants the DoE has received, contending for as much as $3.9 billion in government funds aimed at accelerating work on smart grids.
Shortlink : Wireless module covers 2 km line of sight
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8/27/2009   Post a comment
Shortlink has introduced the SL4300-Cx transceiver module for use in the standard ISM/SRD band of 868MHz.
Years of high NAND memory prices coming, says IC Insights
News & Analysis  
8/27/2009   Post a comment
The flash memory market is about to go through a change from a situation that favored buyers to one that will favor NAND flash memory suppliers over the next few years, according to IC Insights' recently released mid-year update to the McClean Report.
Lithium-ion battery leader leads funding drive for Norway's Think Global electric vehicle maker
News & Analysis  
8/27/2009   Post a comment
Norwegian electric vehicle producer, Think Global AS, is to receive $47 million of equity funding from a group of investors lead by Ener1, Inc., which is the parent company of EnerDel, a leading manufacturer of advanced lithium-ion automotive battery systems based in Indianapolis, USA, and an existing supplier to Think.
Nvidia offers $5,000 in prizes to Cuda programmers
News & Analysis  
8/27/2009   1 comment
Graphics chipmaker Nvidia Corp. (Santa Clara, Calif.) has said it plans to offer prizes totaling $5,000 to five programmers who use the Cuda parallel programming environment to solve the first of a series of challenges.
Fujitsu, TSMC partner on 28-nm logic ICs
News & Analysis  
8/27/2009   Post a comment
Fujitsu Microelectronics Ltd. and Taiwan Semiconductor Manufacturing Co. Ltd. are collaborating on the development of a 28-nm manufacturing process technology for Fujitsu.
E-paper display market to hit $600 million in 2010, says analyst
News & Analysis  
8/27/2009   Post a comment
The total e-paper display market is set to be 22 million units and $431 million in revenues in 2009 and is set to grow with a compound annual growth rate of 41 percent for revenues and 64 percent for units over the next decade, according market research company DisplaySearch.
Dialog begins shipping Intel Atom companion power management IC for in-vehicle infotainment applications
News & Analysis  
8/27/2009   Post a comment
Dialog Semiconductor Plc (Kirchheim, Germany) has collaborated with Harman Becker, the Harman International Automotive Division, to develop the DA6001 power management IC as a companion device for the Intel Atom processor.
Startup rewrites NXP’s legacy in 3D passive integration
News & Analysis  
8/27/2009   Post a comment
Economic crises can have positive as well as negative impacts. Thus, if NXP had not divested its wireless business and decided to sell its integrated passives device unit near Caen, Normandy (France), Ipdia would not have emerged with an ambition to deliver next-generation 3D-SiP modules for various applications, including advanced LED modules.
Dresden is like Silicon Valley: hungry talent & excellent education
News & Analysis  
8/27/2009   1 comment
How comes that the Dresden area is the most remarkable center for start-up activities in Germany? The answer is that in the town, all ingredients necessary such as excellent mathematical education and a generation of engineers with great ideas meet. The ignition spark, however, has been imported from the U.S. – in person of Gerhard Fettweis, professor at the Dresden Technical University. In the interview Fettweis explains what are the essentials for start-up friendly environments and which techn
Plenty of business in VDSL for Lantiq
News & Analysis  
8/27/2009   Post a comment
Christian Wolff, designated CEO of Infineon's wireline business sold to Golden Gate Capital, explains the company's strategies in terms of product spectrum, technologies and geographies.
Synfora adds Esterel Studio to IP portfolio
News & Analysis  
8/27/2009   Post a comment
Synfora, Inc. has purchased the Esterel Studio tool suite developed by Esterel EDA Technologies.
Singapore, Swiss researchers collaborate on microfluidics
News & Analysis  
8/26/2009   Post a comment
Singapore Institute of Manufacturing Technology (SIMTech), a research institute of the Singaporean Agency for Science, Technology and Research, has signed an agreement with the Centre Suisse d'Electronique et de Microtechnique SA (CSEM), Switzerland, to carry out joint research and exchange staff for the development of microfluidic technologies.
Spansion to sell Suzhou factory to Powertech
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8/26/2009   Post a comment
Nonvolatile memeory maker Spansion Inc. (Sunnyvale, Calif.) has announced its wholly owned subsidiary Spansion LLC has agreed to sell its final manufacturing facility located in Suzhou, China and related equipment to Powertech Technology Inc. (Hsinchu, Taiwan) for $31 million in cash.
Sun, IBM push multicore boundaries
News & Analysis  
8/26/2009   Post a comment
Sun Microsystems claimed a new watermark for server CPUs, unveiling Rainbow Falls, a 16-core, 128-thread processor at the Hot Chips conference, but analysts gave the IBM Power7 kudos as the more compelling achievement in the latest round of high-end server processors.
NEC Electronic, Renesas delay merger for second time
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8/26/2009   Post a comment
Japanese chipmakers NEC Electronics Corp. and Renesas Technology Corp. said Wednesday (Aug. 26) that they will delay the signing of a merger agreement until the end of September. This is the second time in a month the companies have delayed the prospective merger.
Gartner ups semi market expectations
News & Analysis  
8/26/2009   Post a comment
Strong customer demand and the effects of stimulus packages in China helped to partially iron out the dent in the global semiconductor market. Against this background, market researcher Gartner has lifted its revenue forecast to minus 17 percent for 2009. Earlier, the experts predicted a decline of 22.4 percent. But reasons persist to remain cautious.
Grace offers 130-nm embedded flash
News & Analysis  
8/26/2009   Post a comment
Shanghai-based foundry service provider Grace Semiconductor has developed a 130nm manufacturing process for embedded flash products. For this achievement, the company combined two proven processes.
MIT's robotic fish target monitoring tasks
News & Analysis  
8/25/2009   Post a comment
Robotic fish could swim in schools of hundreds to perform surveys, environmental monitoring, reconnaissance and other underwater tasks, according to MIT researchers.
Femtocells to see 70 million users in 2014, says research firm
News & Analysis  
8/25/2009   Post a comment
Femtocell shipments will grow from 0.2 million units in 2009 to 12 million units worldwide in 2014 demonstrating a compound annual growth rate (CAGR) of 127 percent, according to Berg Insight (Gothenburg, Sweden).
Dublin startup samples UWB transceivers
News & Analysis  
8/25/2009   Post a comment
Fabless chip company DecaWave Ltd. (Dublin, Ireland) has shipped evaluation kits for its first product the ScenSor chip. Scensor is a CMOS ultra-wideband IC based on the IEEE 802.15.4a standard that supports data rates of 110-kbps, 850-kbps, 6.8-Mbps, and 27-Mbps.
Toyota tops 'clunker' sales list
News & Analysis  
8/25/2009   1 comment
Toyota Motor Co. was the primary beneficiary of the U.S. government's "Cash for Clunkers" program, accounting for three of the top five models purchased by new car buyers, according to a new survey of the auto stimulus program.
Carbon nanotube interconnect startup raises $4.1 million
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8/25/2009   Post a comment
Surrey NanoSystems Ltd. (Newhaven, England) has raised £2.5 million (about $4.1 million) in second round venture capital to help it develop a silicon-friendly, low-temperature carbon nanotube growth process. Surrey NanoSystems believes CNTs can be used as semiconductor interconnect.
Berlin startup to present 40 GBit/s Ethernet proposal
News & Analysis  
8/25/2009   Post a comment
Data speeds of up to 40 GBit/s can be achieved with a technology developed by Berlin-based startup company VI Systems GmbH. The proposal will be presented at the Ethernet Alliance Forum in September.
Engineer seeks $60 million bonus from Atmel
News & Analysis  
8/25/2009   3 comments
Dr. Andreas Paul Schueppen, a former employee of Atmel Germany GmbH, is preparing for his first day in court in a case filed against his former employer in which he is claiming he is owed 42 million euro (about $60 million) as an "inventor's bonus."
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