China stimulus seen as opportunity for IC firms News & Analysis 8/31/2009 Post a comment Market research firm Gartner advised semiconductor firms to step up efforts to work with Chinese manufacturers in order to cash in on a rise in that country's domestic demand being driven by a government subsidy program for home appliances.
Magma posts loss, amends tender offer News & Analysis 8/31/2009 Post a comment Magma Design Automation posted a loss in accordance with generally accepted accounting principles of $4.3 million on revenue of $28.8 million for the first quarter of its fiscal 2010, the company reported last week.
Globalfoundries in multi-year contract with Cadence News & Analysis 8/31/2009 Post a comment Foundry services provider Globalfoundries has signed a multi-year technology contract with semiconductor design software vendor Cadence Design Systems. The deployment covers large parts of the design chain including verification and manufacturing.
European chip vendors research manufacturing advantage News & Analysis 8/31/2009 Post a comment A group of European chip manufacturers and academic institutions have gathered in a research project aiming at improving the competitiveness of European chip industry. The 'IMPROVE' project focuses on specific aspects of chip semiconductor production: virtual metrology and predictive maintenance.
Gateways, Web shape next-gen home networks News & Analysis 8/28/2009 Post a comment Tomorrow's home networks will be shaped by a race to bring the Web to digital home products and the rising influence of service providers, according to a market watcher Parks Associates in an online talk.
IBM visualizes single molecule structure News & Analysis 8/27/2009 Post a comment Scientists at IBMs Zurich laboratory have succeeded to visualize the structure of an individual molecule using non-contact atomic force microscopy (AFM). The move is a further step to a still very distant future: Molecular electronics.
Group bids to spend $178M on smart grids News & Analysis 8/27/2009 1 comment A team of utilities, vendors and research groups has submitted a five-year, $178 million proposal to the U.S. Department of Energy to build a smart electric grid demonstration system in the Pacific Northwest region, one of more than 400 bids for economic stimulus grants the DoE has received, contending for as much as $3.9 billion in government funds aimed at accelerating work on smart grids.
Nvidia offers $5,000 in prizes to Cuda programmers News & Analysis 8/27/2009 1 comment Graphics chipmaker Nvidia Corp. (Santa Clara, Calif.) has said it plans to offer prizes totaling $5,000 to five programmers who use the Cuda parallel programming environment to solve the first of a series of challenges.
Startup rewrites NXP’s legacy in 3D passive integration News & Analysis 8/27/2009 Post a comment Economic crises can have positive as well as negative impacts. Thus, if NXP had not divested its wireless business and decided to sell its integrated passives device unit near Caen, Normandy (France), Ipdia would not have emerged with an ambition to deliver next-generation 3D-SiP modules for various applications, including advanced LED modules.
Dresden is like Silicon Valley: hungry talent & excellent education News & Analysis 8/27/2009 1 comment How comes that the Dresden area is the most remarkable center for start-up activities in Germany? The answer is that in the town, all ingredients necessary such as excellent mathematical education and a generation of engineers with great ideas meet. The ignition spark, however, has been imported from the U.S. – in person of Gerhard Fettweis, professor at the Dresden Technical University. In the interview Fettweis explains what are the essentials for start-up friendly environments and which techn
Plenty of business in VDSL for Lantiq News & Analysis 8/27/2009 Post a comment Christian Wolff, designated CEO of Infineon's wireline business sold to Golden Gate Capital, explains the company's strategies in terms of product spectrum, technologies and geographies.
Singapore, Swiss researchers collaborate on microfluidics News & Analysis 8/26/2009 Post a comment Singapore Institute of Manufacturing Technology (SIMTech), a research institute of the Singaporean Agency for Science, Technology and Research, has signed an agreement with the Centre Suisse d'Electronique et de Microtechnique SA (CSEM), Switzerland, to carry out joint research and exchange staff for the development of microfluidic technologies.
Spansion to sell Suzhou factory to Powertech News & Analysis 8/26/2009 Post a comment Nonvolatile memeory maker Spansion Inc. (Sunnyvale, Calif.) has announced its wholly owned subsidiary Spansion LLC has agreed to sell its final manufacturing facility located in Suzhou, China and related equipment to Powertech Technology Inc. (Hsinchu, Taiwan) for $31 million in cash.
Sun, IBM push multicore boundaries News & Analysis 8/26/2009 Post a comment Sun Microsystems claimed a new watermark for server CPUs, unveiling Rainbow Falls, a 16-core, 128-thread processor at the Hot Chips conference, but analysts gave the IBM Power7 kudos as the more compelling achievement in the latest round of high-end server processors.
NEC Electronic, Renesas delay merger for second time News & Analysis 8/26/2009 Post a comment Japanese chipmakers NEC Electronics Corp. and Renesas Technology Corp. said Wednesday (Aug. 26) that they will delay the signing of a merger agreement until the end of September. This is the second time in a month the companies have delayed the prospective merger.
Gartner ups semi market expectations News & Analysis 8/26/2009 Post a comment Strong customer demand and the effects of stimulus packages in China helped to partially iron out the dent in the global semiconductor market. Against this background, market researcher Gartner has lifted its revenue forecast to minus 17 percent for 2009. Earlier, the experts predicted a decline of 22.4 percent. But reasons persist to remain cautious.
Grace offers 130-nm embedded flash News & Analysis 8/26/2009 Post a comment Shanghai-based foundry service provider Grace Semiconductor has developed a 130nm manufacturing process for embedded flash products. For this achievement, the company combined two proven processes.
Dublin startup samples UWB transceivers News & Analysis 8/25/2009 Post a comment Fabless chip company DecaWave Ltd. (Dublin, Ireland) has shipped evaluation kits for its first product the ScenSor chip. Scensor is a CMOS ultra-wideband IC based on the IEEE 802.15.4a standard that supports data rates of 110-kbps, 850-kbps, 6.8-Mbps, and 27-Mbps.
Toyota tops 'clunker' sales list News & Analysis 8/25/2009 1 comment Toyota Motor Co. was the primary beneficiary of the U.S. government's "Cash for Clunkers" program, accounting for three of the top five models purchased by new car buyers, according to a new survey of the auto stimulus program.
Carbon nanotube interconnect startup raises $4.1 million News & Analysis 8/25/2009 Post a comment Surrey NanoSystems Ltd. (Newhaven, England) has raised £2.5 million (about $4.1 million) in second round venture capital to help it develop a silicon-friendly, low-temperature carbon nanotube growth process. Surrey NanoSystems believes CNTs can be used as semiconductor interconnect.
Engineer seeks $60 million bonus from Atmel News & Analysis 8/25/2009 3 comments Dr. Andreas Paul Schueppen, a former employee of Atmel Germany GmbH, is preparing for his first day in court in a case filed against his former employer in which he is claiming he is owed 42 million euro (about $60 million) as an "inventor's bonus."
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.