Atmel to outsource German fab operation News & Analysis 9/30/2008 Post a comment In a complex arrangement that in effect rids the company of the Heilbronn, Germany manufacturing operation it has been trying to sell for two years, Atmel said that a U.K. company has agreed to buy the fab's equipment and lease the facility from Atmel.
R&D chiefs share their strategies News & Analysis 9/30/2008 Post a comment Researchers in computer science are taking on new models and fresh subjects as the tackle with new and old challenges, according to a panel discussion that gathered R&D executives from Google, IBM, Microsoft and PARC.
Robotic posture control demonstrated News & Analysis 9/30/2008 Post a comment A two-wheeled, inverted pendulum robot that demonstrates posture control in robots that must balance was shown at Ceatac Japan by Waseda University's Humanoid Robotics Institute and industry partner STMicroelectronics.
Strains showing on sapphires growth for electronics News & Analysis 9/30/2008 Post a comment The sapphire substrate market for electronic applications reached 4.61 million wafers (2 inch equivalent) for LEDs last year, as well as tens of thousands of 6 inch wafers for SoS RF applications in 2007, according to report from Yole Development (Lyon, France).
TSMC, Virage Logic expand IP agreement News & Analysis 9/30/2008 Post a comment Virage Logic and Taiwan Semiconductor Manufacturing Co. have extended their agreement to provide intellectual property for system-on-chip designs for mainstream and advanced process technologies.
Chinese design center licenses MIPS cores News & Analysis 9/30/2008 Post a comment MIPS Technologies has licensed its low-power MIPS32 M4K and MIPS32 4Kc processor cores to China's Shenzhen Integrated Circuit Design Industrial Center, an IC design industry base supported by the Chinese Ministry of Science and Technology.
Recherche publique, privée créent un laboratoire sur les antennes News & Analysis 9/30/2008 Post a comment Le CNRS, l'Université Nice-Sophia Antipolis et Orange Labs annoncent la création du CREMANT, centre de recherche mutualisé sur les antennes pour technologies sans fil, les antennes sur puces, les antennes intelligentes ou encore les capteurs pour la santé. L'objectif à terme consiste à s'imposer sur le marché européen des systèmes communicants.
RF components to see few benefits from basestation growth News & Analysis 9/30/2008 Post a comment The global market for RF components for cellular basestations will remain flat at $1.1 billion through 2013 according to market research group Strategy Analytics. This despite the fact that actual shipments of basestations are forecast to grow to 13.4 million units in 2013, a CAAGR (compound annual average growth rate) of nearly 70 percent.
ASML tips next gen EUV lithography system News & Analysis 9/30/2008 Post a comment Lithography gear provider ASML (Veldhoven, the Netherlands) has unveiled a production version of its upcoming NXE range of EUV machines that, the company says, is part of a roadmap that supports cost-effective chip manufacturing to at least 11 nanometres (nm).
Cloud computing hard to harness, experts say News & Analysis 9/30/2008 Post a comment The vision of cloud computing is simple, but making it a reality will require years of work in areas such as parallel programming primitives, authentication standards and application programming interfaces, said panelists at an annual research event at the headquarters of Internet auctioneer eBay Inc.
Firms launch mobile broadband awareness campaign News & Analysis 9/29/2008 Post a comment An initiative led by the GSM Association has united 16 IT and wireless service providers--including Microsoft , Dell, Toshiba, Qualcomm and T-Mobile--to drive the adoption of notebook computers with mobile broadband capability.
Apple offers unlocked iPhone in Hong Kong News & Analysis 9/29/2008 Post a comment In an apparent break from the marketing strategy it has employed in the rest of the world, Apple is offering in Hong Kong a carrier-independent, "unlocked" iPhone that can be used with each customer's wireless operator of choice.
Creditors to sell Hynix stake News & Analysis 9/29/2008 Post a comment The Korea Exchange Bank (KEB), the single largest shareholder of Hynix Semiconductor Inc., plans to sell its combined 36 percent stake that it holds with eight other companies in the chip maker.
DS2 demos 280-Mbps powerline communications News & Analysis 9/29/2008 Post a comment Diseno de Sistemas en Silicio SA (Valencia, Spain), also known as DS2, has demonstrated technology being developed for 400-Mbit per second powerline communications, at the Broadband World Forum, which opened in Brussels, Monday (Sept. 29).
Underwater helicopter surfaces News & Analysis 9/29/2008 1 comment Undersea robots have until now operated like fixed-wing aircraft, requiring motion to maneuver. Massachusetts Institute of Technology researchers now say they have created the helicopter-of-the-sea, the Odyssey IV.
Nokia, Huawei sign cross licensing accord News & Analysis 9/29/2008 Post a comment Finnish communications group Nokia and its wireless infrastructure joint venture Nokia Siemens Networks (NSN) have sealed a cross-licensing agreement with China's Huawei covering essential patents for wireless standards.
ARM to develop SoC platform for IBM chip alliance at 28-nm News & Analysis 9/29/2008 Post a comment ARM Holdings plc (Cambridge, England) has agreed to develop a system-on-chip design platform of physical intellectual property at the 32-nm and 28-nm nodes for the Common Platform technology alliance of International Business Machines Corp., Chartered Semiconductor Manufacturing Ltd. and Samsung Electronics Co. Ltd. for distribution to their customers.
Sarnoff expands electrostatic discharge IP portfolio News & Analysis 9/29/2008 Post a comment Soon after joining the TSMC Design Center Alliance, Sarnoff Europe SA (Gistel, Belgium) announced it has expanded its TakeCharge Electrostatic Discharge IP portfolio with silicon-proven solutions for the TSMC 40-nm G process technology.
Cooperation to innovate humanoid robotics and medical-care robots News & Analysis 9/29/2008 Post a comment STMicroelectronics and the Waseda University Humanoid Robotics Institute (HRI) announced the development of a high-performance two-wheel inverted pendulum robot, called WV-1 (Waseda wheeled Vehicle-No.1), which is the first result of an ongoing cooperation for the research and development of technology and solutions for innovative humanoid robots and medical-care robot systems.
Bluetooth headset turns to SUN and goes green Teardown 9/29/2008 Post a comment Last year, I purchased a hands-free Bluetooth car kit as a Christmas gift for a family member who, as a sales rep, spends significant time talking in her car. Worried for her safety as she drives with one hand on the wheel and the other around a cell phone, I initially felt a sense of pride as she unwrapped a gift that demonstrated concern for her well-being. Sometimes, however, a buzz can be short-lived. After a quick explanation of what the gift was, I could see a bit of uneasiness creep in as
On the hot seat News & Analysis 9/29/2008 Post a comment There's trouble brewing in chip-making paradise. Manufacturers are rolling out 45-nm ICs, with 32-nm designs in the works; 22 nm and even smaller devices are in R&D. But delivery of chips at 32 nm and beyond won't be a cool breeze.
In multicore SOC architectures buses are a last resort News & Analysis 9/29/2008 Post a comment The one-processor system model that has dominated electronic system design since 1971 is now thoroughly obsolete. Today's SOC designers readily accept the idea of using multiple processors in their complex systems to achieve design goals and use the terms "control plane" and "data plane" to describe how these various on-chip processors are used on the chip. These terms appeared during the Internet and networking boom. At first, these terms referred to the design of multiple-board networking syst
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.