LED drivers keep pace with light Product News 1/30/2003 Post a comment ON Semiconductor says its NCP5008 and NCP5009 white-LED drivers are among the first to accommodate external phototransistor feedback to provide automatic adjustment of LED brightness according to ambient light.
Passives makers actively eliminate lead Product News 1/30/2003 Post a comment Driven by the European Union's move to ban lead in electronic assemblies by 2006 as well as a similar move in Japan, many passive-component manufacturers are well ahead of the deadline to phase out lead in electronic components.
Board taps FPGAs, PowerPCs to speed image processing Product News 1/30/2003 Post a comment Mercury Computer Systems Inc.'s new RACE++ Series VantageRT FCN board offers signal- and image-processing capabilities in a package that includes field-programmable gate arrays (FPGAs) and PowerPC microprocessors connected by a switch fabric.
Components distributors hope it's Bluetooth's year Product News 1/21/2003 Post a comment If there is an industry that needs the Next Big Thing to drive growth, electronic components is it. And in 2003, Bluetooth technology-enabled in cell phones, headsets, PDAs and even PCs and peripherals-could be the long-awaited driver. That possibility has not been lost on components distributors. Avnet, an earlier believer in Bluetooth, opened its first Bluetooth design center-under the auspices of Avnet Radio Frequency Design Services-in Singapore in May 2001. Avnet quickly began offering a Bl
300-V MOSFET replaces relays Product News 1/16/2003 Post a comment International Rectifier's IRF3000 is a 300-volt, n-channel HEXFET developed to replace electromechanical relays in telecom and networking applications.
Dc/dc chip runs at up to 600 kHz Product News 1/16/2003 Post a comment Microsemi Corp.'s LX1672 high-frequency multiphase dc/dc controller chip is aimed at double-data-rate termination, multioutput power supplies, video card power supplies and set-top box applications.
APEC sticks to practical solutions Product News 1/13/2003 Post a comment There are few things today that stay the same over any length of time, even in power. So it's nice to know that this year's Applied Power Electronics Conference and Exposition (APEC) is, by all indications, keeping to the high standards for which it has a lways been known.
How Test Engineers Can Use Microsoft .NET Product News 1/13/2003 Post a comment As the test and measurement of electronic components and systems has increased in complexity, so has the difficulty in developing control software for T&M equipment. Agilent Technologies' Ken Colasuonno discusses the use of an open standard, Microsoft .NET, to automate common low-level programming tasks for programming test instruments, accessing measurement data, and displaying T&M results.
Parts share E2PROM bus Product News 1/3/2003 Post a comment Integrated Silicon Solution Inc.'s IS24C128 serial E2PROM has cascadable chip address lines that allow multiple devices to share the two-wire bus, supporting expandable address space.
Connector makers prep for PICMG 3.0 Product News 1/3/2003 Post a comment Relieved connector makers say the newest spec of the PCI Industrial Computer Manufacturers Group (PICMG) for next-generation telecom equipment will spur component growth in 2003, despite a prolonged downturn in the communications industry.
Dc/dc meets double-data-rate needs Product News 1/3/2003 Post a comment Artesyn touts its DDR12 point-of-load dc/dc converter as the first such unit to address the specialized dual-voltage, source-and-sink requirements of all double-data-rate synchronous DRAMs.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.