Integrated bi-directional OVP device protects portable electronics Product News 1/30/2009 Post a comment ON Semiconductor has introduced the industry's first integrated bi-directional device, with positive and negative (+/-) overvoltage protection (OVP) for cell phones, MP3/4, PDAs and GPS systems, and overcurrent protection (OCP) for portable accessories such as FM transceiver, load speakers and flash modules.
Tzero readies mobile UWB chip Product News 1/30/2009 2 comments Startup Tzero Technologies hopes 2009 will be the year ultrawideband establishes a foothold and sketched out plans for a new mobile chip that is the latest part of its two-pronged strategy.
Army boosts flexible display research Product News 1/30/2009 Post a comment Researchers at Arizona State University developing display technology have renewed an R&D contract with the U.S. Army for an additional five years at ASU's Flexible Display Center.
Samsung claims it is first to make 4-Gbit DDR3 DRAM Product News 1/29/2009 Post a comment Samsung Electronics Co. Ltd. has announced that it has developed a 4-Gbit DDR3 DRAM chip using a 50-nm manufacturing process. The memory operates at 1.35 volts and has a maximum data transmission speed of 1.6-Gbits per second, Samsung said.
Leadis sells display driver unit to startup Product News 1/28/2009 Post a comment Leadis Technology Inc., an analog and mixed-signal semiconductor developer of color display drivers, announced the sale of its display driver business to AsTek Inc., a privately-held company located in Korea.
Startup shows chip for non-contact controls Product News 1/28/2009 Post a comment Startup company Ident Technology AG (Wessling, Germany) has produced a proof-of-concept chip supporting the company's capacitive data transport technology. The technology enables innovative user interfaces and safety features in the automotive and industrial automation industry.
Extremely thin wire reduces harness weight Product News 1/28/2009 Post a comment Delphi says it has developed particularly thin wires for automotive wiring harnesses. The technology could help to significantly reduce the weight of this problematic part of a car's electrical system.
High Density LXI 2 Amp Matrices Product News 1/28/2009 Post a comment Pickering Interfaces is expanding its range of customer focused LXI switch matrices with the introduction of the 60-554 High Density 256x16 EMR (Electromechanical Relay) Matrix.
RFID read/write devices with ISO functionality Product News 1/28/2009 Post a comment Siemens's Industry Automation Division has redesigned its high frequency 13.56 megahertz range Simatic RF310R and RF380R RFID read/write devices so that they can also work with ISO 15693 standard transponders (tags).
TTTech rolls TTEthernet evaluation system Product News 1/27/2009 Post a comment TTTech Computertechnik AG (Vienna) has announced the availability of evaluation systems for its real-time based TTEthernet data communication technology. The system enables users to analyze the properties of TTEthernet systems and the development of distributed real-time applications.
Bridgelux rolls LED arrays for lighting apps Product News 1/27/2009 Post a comment Seeking to reduce the cost and complexity of light-emitting diode (LED) technology, Bridgelux Inc. has expanded its strategy and rolled out an LED array product line for use in solid-state lighting and other applications.
Microchip: Motor control eval board enhances DSC-based apps Product News 1/27/2009 Post a comment Microchip Technology has introduced the dsPICDEM MCLV motor control development board - along with free motor-control software source code and an enhanced IDE - as a cost-effective method for developing dsPIC-based sensored or sensorless BLDC and PM synchronous motor control applications.
SiTime unveils lowest power family of programmable oscillators Product News 1/26/2009 Post a comment MEMS-based silicon timing solutions specialist, SiTime Corporation, has introduced a new family of programmable oscillators that are designed to extend battery life in portable and consumer electronics by delivering the industry's lowest power consumption and fastest start-up time.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.