ASIC pioneer reinvents 3-D FPGAs Product News 1/29/2010 8 comments By building a three-dimensional field-programmable FPGA with an ultra-dense anti-fuse interconnect, NuPGA claims to be able to achieve the density of an ASIC at a fraction of the cost.
Plextek reaches co-marketing agreement with TriQuint Product News 1/29/2010 Post a comment Plextek, the Cambridge-based electronics and communications design consultancy today announced that it is cooperating with TriQuint Semiconductor, a leading RF products manufacturer and foundry services provider, on a co-marketing agreement.
MegaChips licenses Forte's HLS software Product News 1/27/2010 1 comment Japan-based MegaChips Corp. announced it has adopted Cynthesizer SystemC high-level synthesis (HLS) software from Forte Design Systems for its hardware and electronic system level (ESL) design needs.
UV LEDs provide a 10 times longer lifespan Product News 1/27/2010 Post a comment The QuasarBrite UV family of LEDs announced by Lumex provide a 10 times longer lifespan, a tight beam angle, enhanced durability and up to 50 percent cost savings compared to alternative technologies, says the manufacturer.
Wolfson unveils ultra low power DAC Product News 1/26/2010 Post a comment Wolfson Microelectronics has launched what the company claims is the world-leading ultra low power DAC designed to extend playback time, reduce system cost and enhance audio performance in portable applications, including media players, headsets, multimedia phones and navigation devices.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.