ON Semiconductor expands power management portfolio Product News 10/26/2009 Post a comment ON Semiconductor has introduced 24 new 30 volt (V), N-channel Trench MOSFETs in DPAK, SO-8FL, 8FL, and SOIC-8 packages featuring enhanced switching performance for synchronous buck converters in computing and game console applications
Applied Materials to restructure in Switzerland Product News 10/26/2009 Post a comment Chip and solar manufacturing equipment vendor Applied Materials Inc. announced it plans to cut 130 jobs, on a total of 280, at its Applied Materials Switzerland SA Precision Wafering Systems Division in Cheseaux, Switzerland.
Tilera announces plan for 100-core processors Product News 10/26/2009 3 comments Tilera Corp. will announced plans for a 100-core embedded processors at the Many-Core Virtual Conference this week where system maker Top Layer networks will discuss its use of Tilera's architecture.
Consumer electronics enforce automotive security discussion Product News 10/23/2009 Post a comment For many years, the automotive industry treated questions concerning the security of the vehicle's electronic inner life as top secret and as something one should not talk about. The rising complexity of the environment and the increasing exposure to telematics and consumer electronics now enforces a more open discussion.
1-A, 36-V DC/DC μModule Regulator offers EMC compliance Product News 10/22/2009 Post a comment Linear Technology Corporation has introduced a complete 1A DC/DC regulator system-in-a-package that includes the inductor, switching DC/DC controller, power switches, filters and all support components housed in a 9 mm x 15 mm x 2.82 mm land grid array (LGA) package.
TI launches ARM processors for industrial apps Product News 10/21/2009 1 comment Texas Instruments Inc. (Houston, Texas) has announced the availability of two Cortex-A8 based microprocessors optimized for industrial applications. Cortex-A8 is developed by ARM Holdings plc (Cambridge, England).
Infineon maintains pole position in smart card IC market Product News 10/21/2009 Post a comment A strong presence in government ID and payment applications has helped chip maker Infineon to keep its top position in the market for smart card ICs. A study of market research company Frost & Sullivan names drivers and restraints in this competitive market.
Superconducting element detects explosives Product News 10/21/2009 2 comments Air passengers find it annoying, experts claim it is indispensible for flight safety: Entrainment of liquids and gels on board of airplanes is subject to tight restrictions. The Juelich Research Center (Juelich, Germany) has developed a promising technology to reliably discriminate explosives from harmless liquids.
NXP offers power chip for CFLs Product News 10/21/2009 1 comment NXP Semiconductors has introduced a 600 V power IC that can drive and control dimmable CFL applications up to 21 W, and features 3 integrated switches.
Altera unveils dev kit for Cyclone III LS Product News 10/21/2009 Post a comment Altera announced the availability of the Cyclone III LS FPGA Development Kit, featuring hardware and software solutions that allow customers to prototype and test designs for Altera's Cyclone III LS FPGAs.
Lattice offers MachXO dev kit for system control designs Product News 10/21/2009 Post a comment Lattice Semiconductor announced the immediate availability of the MachXO Control Development Kit, offering designers of CPLDs and low-density FPGAs a suite of board management and system control resources to enable the development of system control designs.
Gennum samples single-chip 10G EPON transceiver Product News 10/20/2009 Post a comment Gennum Corp. has started to sample in limited quantities the GN7350, a single-chip 10G EPON transceiver for next generation PON systems that it says will help reduce power and cost while enhancing ONU (optical network unit) performance.
Melexis : Automotive ASSPs enable smart actuators Product News 10/20/2009 Post a comment Based on long standing experience in development of fully integrated window lift ICs, Melexis extends its product portfolio of ASSPs with a new generation of system solutions for different smart actuator applications, like window lifter, roof control, engine flaps as well as seatbelt retractors and others.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.