FCI XL series 0.20 mm pitch FPC connector
Product News 11/16/2010 Post a comment
FCI has developed a 0.20mm pitch FPC connector series that can withstand high cable-retention forces, making it suitable for consumer applications, including mobile phones, smart phones, digital still cameras and other miniature consumer applications.
Fujitsu’s IO-Link Starter Kit simplifies automation dev
Product News 11/16/2010 1 comment
Fujitsu Semiconductor Europe has launched an IO-Link starter kit, which is designed to provide developers of automation solutions a quick and easy introduction to all aspects of IO-Link as well as to support IO-Link communication in both master and slave mode.
E-Switch TM1000 tilt switch
Product News 11/15/2010 Post a comment
With this high life cycle expectancy, E-Switch says its TM1000 series tilt switch is well-suited for portable equipment, gaming and computer, security devices and medical equipment applications.
Vishay's SiHG47N60S power MOSFET
Product News 11/12/2010 1 comment
Vishay is offering a 600V power MOSFET that features a 15.12 O-nC gate charge times on-resistance and 0.07 O on resistance in a TO-247 package.
Digi launches first system-on-module with global 3G cellular connectivity
Product News 11/12/2010 Post a comment
The ConnectCore 3G from Digi International is the industry’s first embedded module with integrated application processing and Qualcomm Gobi technology. Gobi technology supports High Speed Packet Access (HSPA) or Evolution-Data Optimized (EV-DO) networks, the two dominant standards for 3G data networks, from the same cellular radio.
Kontron expands features on embedded computer COBALT for rugged MIL apps
Product News 11/10/2010 Post a comment
Kontron has made several key feature enhancements to its Kontron high-performance embedded computer COBALT (Computer Brick Alternative), including a DC power supply and additional customizable I/O capabilities that are particularly suited to the rugged and harsh environmental demands of control systems in new military vehicle applications.
Microsemi PLAD15KP introduced
Product News 11/9/2010 4 comments
Plastic Large Area Device TVS from Microsemi meets goals of Radio Technical Committee for Aeronautics (US) & European Civil Aviation Electronic organization
Stacking, board-to-board connection solution
Product News 11/9/2010 Post a comment
As spatial requirements become more critical in telecommunications, computer, military and rail systems, Tyco Electronics developed the STRADA Mesa mezzanine connector to offer a stacking, board-to-board connection solution for efficient PCB space utilization.
Network switches support SBCs for Hi-Rel applications
Product News 11/9/2010 Post a comment
Concurrent Technologies has announced two fabric switch boards to complement its range of single board computers. The FR 331/306 (VPX) and FX 322/0xx (VXS) enable multiple single board computers to inter-communicate, providing backplane connectivity compliant with VITA 46.x and VITA 41.x standards for aerospace, military, industrial and telecommunication secure networks.
Fujitsu launches FM3 line of MCUs based on ARM Cortex M3
Product News 11/8/2010 Post a comment
Fujitsu Semiconductor Europe has released 44 microcontrollers (MCUs) from its new FM3 family of general-purpose RISC microcontrollers using the ARM Cortex M3 core. The FM3 family includes the High-Performance MB9BF500/400/300/100 series for the 32-bit market, which demands high-speed performance, and the Basic MB9AF100 series for the 16-bit market, designed for superior cost-performance and low power consumption.
New Lattice MachX02 is the Do-It-All PLD
Product News 11/8/2010 3 comments
65nm MachX02 PLDs deliver 3X increase in logic density, 10X increase in embedded memory, more than a 100X reduction in static power, 30% lower cost compared to their predecessors.
BEEcube's BEE4-W speeds prototyping of military/aerospace comm designs
Product News 11/3/2010 Post a comment
The BEE4-W is BEEcube's latest generation FPGA Berkeley Emulation Engine (BEE) platform, specifically designed to address rapid system-level prototyping of wireless and digital communications designs. It is a commercial, stackable full speed multi-FPGA based prototyping platform, integrated with DAC/ADC modules for mixed signal and digital communications designs. With four (4) integrated ADC and DAC solutions, the Xilinx Virtex-6 FPGA based BEE4-W enables a wide range of high-performance, real-t