FCI XL series 0.20 mm pitch FPC connector Product News 11/16/2010 Post a comment FCI has developed a 0.20mm pitch FPC connector series that can withstand high cable-retention forces, making it suitable for consumer applications, including mobile phones, smart phones, digital still cameras and other miniature consumer applications.
Fujitsu’s IO-Link Starter Kit simplifies automation dev Product News 11/16/2010 1 comment Fujitsu Semiconductor Europe has launched an IO-Link starter kit, which is designed to provide developers of automation solutions a quick and easy introduction to all aspects of IO-Link as well as to support IO-Link communication in both master and slave mode.
E-Switch TM1000 tilt switch Product News 11/15/2010 Post a comment With this high life cycle expectancy, E-Switch says its TM1000 series tilt switch is well-suited for portable equipment, gaming and computer, security devices and medical equipment applications.
Vishay's SiHG47N60S power MOSFET Product News 11/12/2010 1 comment Vishay is offering a 600V power MOSFET that features a 15.12 O-nC gate charge times on-resistance and 0.07 O on resistance in a TO-247 package.
Digi launches first system-on-module with global 3G cellular connectivity Product News 11/12/2010 Post a comment The ConnectCore 3G from Digi International is the industry’s first embedded module with integrated application processing and Qualcomm Gobi technology. Gobi technology supports High Speed Packet Access (HSPA) or Evolution-Data Optimized (EV-DO) networks, the two dominant standards for 3G data networks, from the same cellular radio.
Kontron expands features on embedded computer COBALT for rugged MIL apps Product News 11/10/2010 Post a comment Kontron has made several key feature enhancements to its Kontron high-performance embedded computer COBALT (Computer Brick Alternative), including a DC power supply and additional customizable I/O capabilities that are particularly suited to the rugged and harsh environmental demands of control systems in new military vehicle applications.
Microsemi PLAD15KP introduced Product News 11/9/2010 4 comments Plastic Large Area Device TVS from Microsemi meets goals of Radio Technical Committee for Aeronautics (US) & European Civil Aviation Electronic organization
Stacking, board-to-board connection solution Product News 11/9/2010 Post a comment As spatial requirements become more critical in telecommunications, computer, military and rail systems, Tyco Electronics developed the STRADA Mesa mezzanine connector to offer a stacking, board-to-board connection solution for efficient PCB space utilization.
Network switches support SBCs for Hi-Rel applications Product News 11/9/2010 Post a comment Concurrent Technologies has announced two fabric switch boards to complement its range of single board computers. The FR 331/306 (VPX) and FX 322/0xx (VXS) enable multiple single board computers to inter-communicate, providing backplane connectivity compliant with VITA 46.x and VITA 41.x standards for aerospace, military, industrial and telecommunication secure networks.
Fujitsu launches FM3 line of MCUs based on ARM Cortex M3 Product News 11/8/2010 Post a comment Fujitsu Semiconductor Europe has released 44 microcontrollers (MCUs) from its new FM3 family of general-purpose RISC microcontrollers using the ARM Cortex M3 core. The FM3 family includes the High-Performance MB9BF500/400/300/100 series for the 32-bit market, which demands high-speed performance, and the Basic MB9AF100 series for the 16-bit market, designed for superior cost-performance and low power consumption.
New Lattice MachX02 is the Do-It-All PLD Product News 11/8/2010 3 comments 65nm MachX02 PLDs deliver 3X increase in logic density, 10X increase in embedded memory, more than a 100X reduction in static power, 30% lower cost compared to their predecessors.
BEEcube's BEE4-W speeds prototyping of military/aerospace comm designs Product News 11/3/2010 Post a comment The BEE4-W is BEEcube's latest generation FPGA Berkeley Emulation Engine (BEE) platform, specifically designed to address rapid system-level prototyping of wireless and digital communications designs. It is a commercial, stackable full speed multi-FPGA based prototyping platform, integrated with DAC/ADC modules for mixed signal and digital communications designs. With four (4) integrated ADC and DAC solutions, the Xilinx Virtex-6 FPGA based BEE4-W enables a wide range of high-performance, real-t
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments