250mA LDO withstands 80V input Product News 2/26/2009 Post a comment Linear Technology has announced a high reliability (MP) grade, wider temperature range version of the LT3013, a micropower LDO with input voltage capability up to 80V.
NEC miniaturizes DPAK form factor Product News 2/26/2009 Post a comment After the introduction of its HSON-8 power transistor package, NEC Europe again rolls a new package form factor and design aiming at power devices in particular for automotive applications.
Software tool automates ECU software checks Product News 2/24/2009 Post a comment Automotive realtime networking expert TTTech Automotive (Vienna) has announced a software tool to validate the consistency of Autosar components in electronic control units (ECUs). TTX-Autoverify increases the engineering efficiency during system integration and thus helps to reduce time-to-market and costs, the vendor claims.
Lattice : Mid-range FPGAs offer 3G SERDES Product News 2/24/2009 Post a comment Lattice Semiconductor has announced the mid-range 65nm LatticeECP3 family, its third generation high value FPGAs, which claims the industry’s lowest power consumption and price of any SERDES-capable FPGA device.
Marvell rolls plan for 'plugtop PCs' Product News 2/24/2009 Post a comment Marvell Technology Group Ltd. has announced a so-called Plug Computing initiative and a $99 developer's kit using its 1.2 GHz ARM-based processor to drive to its vision of a variety of "wall-warts" that build in its Sheeva CPU and act like embedded home computers.
Silicon Lab : Wireless radio offers high output power Product News 2/23/2009 Post a comment Silicon Laboratories’ EZRadioPRO embedded wireless radio family claims the highest single-chip output power (up to +20 dBm) and highest sensitivity (-118 dBm), providing a best-in-class link budget that increases communication range while minimizing power consumption.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.