Torex : Voltage regulators offer low dropout voltage Product News 2/23/2009 Post a comment Available in the tiny USP-6C package (1.8 x 2.0 x 0.6 mm), as well as in standard SOT-25 and SOT-89-5 versions, the XC6220 Series of voltage regulators from Torex Semiconductor offer low dropout voltage – typically 20 mV with a 100 mA load.
ARM preps tiny core for low-power microcontrollers Product News 2/23/2009 2 comments With help from lead partner and licensee NXP, ARM Holdings plc has designed a very low gate-count ARM processor core suitable for use in microcontrollers aimed at ultra-low power applications. Chips are expected to ship from licensees before the end of 2009.
French startup teams with TI for 3D handset display Product News 2/20/2009 Post a comment MicroOLED SA (Grenoble, France), a spin-off from the CEA-Leti research institute there, has added a high-definition multimedia interface (HDMI) to its high-definition microdisplays allowing them to connect to the Texas Instruments OMAP platform.
Hyperstone : 32-Bit MCU suits cost-sensitive applications Product News 2/20/2009 Post a comment Hyperstone has introduced the high-performance E2 – 32-bit RISC/DSP microcontroller with additional on-chip highlights such as programmable serial communication engine, an analog to digital converter and 32 kBytes on chip (I-RAM) complemented by an external memory and peripheral interface controller.
Thermoharvester-driven wireless sensor node enables battery-free operation Product News 2/19/2009 Post a comment Micropelt GmbH claims to offer the world's first commercial availability thermo-powered wireless sensor system, the TE-Power NODE. The company's built-in chip thermogenerator takes a few degrees of temperature differential and harvests that thermal energy to operate the wireless sensor node, enabling unlimited battery-free operation.
Car-to-car becomes bike-to-bike Product News 2/19/2009 Post a comment In a joint research project, Technical University of Darmstadt and automotive technology provider carhs.communiation GmbH (Alzenau, Germany) are trying to transfer car-to-car communications systems to the world of motorbikes. Besides warnings of potential dangerous road conditions, the system will include a human-to-human communications option for biker groups.
LCD equipment market to fall 41% Product News 2/18/2009 Post a comment The flat-panel display equipment market grew 30 percent in 2008, but the sector is expected to drop by 41 percent in 2009, according to The Information Network, a New Tripoli, Penn.-based market research company.
Stimulus: DoE readies $4.3 billion for smart grid Product News 2/18/2009 Post a comment The U.S. Department of Energy has 60 days to set up a competitive process to award an estimated $4.3 billion for projects that will upgrade the nation's electric grid as one of the top clean technology provisions of the $787 billion economic stimulus package signed by President Barack Obama.
LED driver claims flickerless dimming Product News 2/17/2009 Post a comment Responding to a significant number of requests for a TRIAC dimmable LED driver, National Semiconductor has introduced a constant-current controller that enables uniform dimming of LEDS without flicker.
Infineon showcases third generation SiC Schottky diodes at APEC Product News 2/17/2009 Post a comment At the Applied Power Electronics Conference and Exhibition, APEC, in Washington, DC, Infineon Technologies AG has introduced its third generation thinQ! SiC Schottky diodes that feature the industry's lowest device capacitance for any given current rating, which enhances overall system efficiency at higher switching frequencies and under light load conditions.
LSI rolls multicore strategy Product News 2/17/2009 Post a comment LSI Corp. rolled out at the Mobile World Congress a new multicore strategy behind an upcoming family of chips targeting wireless infrastructure gear, mixing and matching its portfolio of cores and on-chip interconnects from recent acquisitions to create new standard products and ASIC offerings.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.