High-power, flat LED modules Product News 2/26/2010 Post a comment The MiniZeni series from Sharp radiates high efficiency, deliver high color rendering index (CRI) values of up to 87 and boast a long service life whilst measuring only 15x12x1.6mm
ST beefs up SPEAr MPU line Product News 2/25/2010 Post a comment STMicroelectronics has added four new devices to its SPEAr microprocessor family, targeting embedded-control applications across market segments from computer peripherals and communication to industrial automation.
MSC Vertriebs offers lowest power SERDES capable FPGA Product News 2/25/2010 Post a comment MSC Vertriebs GmbH is offering the Lattice ECP3 family which defines a new mid-range, value-based class of FPGAs, not only by further reducing costs, but also by reducing total power consumption by more than 50 percent for typical designs, compared to competitive SERDES-capable FPGAs.
Coax antenna connector system Product News 2/25/2010 Post a comment Yamaichi Electronics unveils a new high frequency connector, the HF201 series consists of a one or two-pin plug connector and an insulating body on the cable side
0.7mm-high slide switch targets mobile devices Product News 2/24/2010 Post a comment Alps Electric Europe announced the development of the SSAJ series, a 0.7mm-high slide switch that enables the design of more compact electronic devices including mobile phones, digital cameras and compact music players
IR rolls GaN devices Product News 2/24/2010 Post a comment International Rectifier Inc. has introduced the industry's first family of commercial integrated power stage products utilizing IR's gallium nitride (GaN)-based power device technology platform.
GateRocket rolls new version of FPGA debug tool Product News 2/23/2010 Post a comment FPGA verification and debug software vendor GateRocket Inc. Tuesday (Feb. 23) announced the newest version of its RocketVision debugging software, introducing new capabilities that allow designers to select individual design blocks to run in their simulator or GateRocket's RocketDrive hardware verification system.
Xilinx banks on power efficiency for 28-nm Product News 2/22/2010 Post a comment By the end of this year, Xilinx Inc. will begin sampling 28-nm FPGAs that consume half the power of its current devices while offering twice the capacity as previously possible, the company said Monday (Feb. 22).
Mentor Graphics to address variant diversity Product News 2/22/2010 Post a comment With the acquisition of Freescale's Virtual Garage software product line, EDA software vendor Mentor Graphics plans to address two aspect that increasingly complicate automotive electronic designer's work: First, the conflict between added value and costs associated with the complexity of multiple electronics options in cars. The second aspect is the availability of vehicle-specific design data to service workshops for instance dynamic circuit diagrams.
KEMET releases new high temperature C0G dielectric platform Product News 2/22/2010 Post a comment KEMET has released new High Temperature Surface Mount C0G multilayer ceramic capacitors (MLCCs) that feature a robust and proprietary base metal dielectric system that offers industry-leading performance relative to capacitance and case size combined with capacitance stability at extreme temperatures up to +200 degrees C.
Vizio takes lead in U.S. LCD-TV sales Product News 2/22/2010 Post a comment Vizio Inc. became the leading seller of LCD-TVs in the U.S. in 2009, leaping over giants Samsung and Sony by nearly doubling its 2008 shipments, but Samsung holds its position as top vendor of flat-panel TVs overall, according to the latest figures from market watcher iSuppli Corp.
Tiny RF switch delivers +67 dBm IIP3 Product News 2/22/2010 Post a comment Peregrine Semiconductor recently announced an SP4T RF switch that is designed using the company's green UltraCMOS silicon-on-sapphire process technology, yielding broadband RF performance to 3-GHz.
Scalable integration between OneSpin's ABV tool and Platform LSF Product News 2/22/2010 Post a comment EDA software vendor OneSpin Solutions GmbH (Munich, Germany) has presented the customizable integration between its 360 MV formal assertion-based verification (ABV) tool and Platform Computing's LSF infrastructure, a workload management solution for high performance computing (HPC) environments.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.