Silicon Frontline enhances post-layout verification tools Product News 2/19/2010 Post a comment Startup Silicon Frontline Technology, Inc. has introduced the latest versions of its products for post-layout verification: F3D (Fast 3D) for fast 3D extraction and R3D (Resistive 3D) for 3D extraction and analysis of large resistive structures like power devices.
Tanner EDA, Sound Design Technologies develop PDKs Product News 2/18/2010 Post a comment Tanner EDA, a division of Tanner Research Inc. (Monrovia, Calif.), announced it has combined its specialized IC design software combined with integrated passives and chip-stacking technologies from Sound Design Technologies Ltd. (Ontario, Canada).
Analyst boosts forecast for PC processor sales Product News 2/17/2010 Post a comment Growth in unit sales of PC processors and PC servers will be stronger than expected this year, according to a report by Wall Street Analyst firm Barclays Capital, however, the firm forecasts declines in the average selling prices of the chips for the next two years.
Car electronics to become a complex commodity, experts predict Product News 2/17/2010 Post a comment Which type of motor will suit best future mobility requirements against the background of tighter climate gas emission regulations? This question is fiercely discussed within the automotive industry: While the traditionalist faction believes that conventional combustion engines still offer a large potential to improve efficiency and thus significantly reduce pollutant emissions, others call for radical moves towards a zero-emission vehicle which of course will be driven by an elect
EU project to define next gen design methodologies Product News 2/17/2010 Post a comment Scientists and companies from Europe and Brazil have joined forces in an EU-backed project that aims to develop design methods and EDA tools in a view to remove the limitations in physical implementation effectiveness associated with technology scaling and advanced sub-wavelength lithography.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.