Vishay PLTT series thin-film resistor Product News 3/31/2011 Post a comment Providing nearly a 100°C extension in operating temperature range over traditional thin film chip resistors, Vishay's product features a low standard TCR of ±5 ppm/°C and tolerances down to ±0.02 %.
1000x bandwidth increase for 4G mobile networks Product News 3/31/2011 Post a comment Addressing the astronomical and historically underestimated increase in mobile data traffic demand, Broadcom unveiled its BCM56440 StrataXGS switch series this week, capable of delivering 1000x more bandwidth than legacy time-division multiplexing (TDM) networks
Synopsys offers IP for TSMC 28-nm process Product News 3/30/2011 Post a comment EDA company Synopsys Inc. has announced that is interface physical layer intellectual property cores and embedded memory SRAM for the 28-nm process technology from Taiwan Semiconductor Manufacturing Co. Ltd.
Large diameter high temperature solder-in EMI filters Product News 3/29/2011 Post a comment Large diameter high temperature solder-in EMI filters Spectrum Advanced Specialty Products added a high temperature version to its solder-in filter product line of 10.16mm (0.400") diameter mounting EMI filters, with a construction able to withstand 300°C.
Li-ion charger maximizes battery cell performance Product News 3/29/2011 Post a comment Li-ion charger maximizes battery cell performance Norwegian power design specialist, Mascot AS has introduced a high-quality, high-performing charger for lithium-ion (Li-ion) batteries, which features 3-stage charging for maximum battery performance.
Wearable computer comes with more communication options Product News 3/27/2011 Post a comment Eurotech launched the Zypad WL1500 series of wearable computers, an improvement over the company’s products that delivers a longer battery life and faster performance, as well as increased cellular communication functionality and improved wearing comfort.
ST launches market's smallest 3-axis analog gyroscope Product News 3/26/2011 3 comments The L3G462A from STMicroelectronics (ST) is a motion-sensor with what the company claims is the market’s smallest 3-axis analog-output gyroscope. Housed inside an ultra-small 4mm x 4mm x 1mm package, ST’s newest gyroscope combines superior performance and reliability with smart power management and design flexibility. The new sensor is designed for high-precision gesture control and intuitive user interfaces, and is targeted for mobile phones, tablets, game controllers and other consumer devices
Xelerated's HX336 NPU reduces power consumption by 50%, rapid transition to 100GE Product News 3/23/2011 Post a comment The HX336 from Xelerated is a wirespeed single-chip network processor (NPU) with advanced traffic management and deep packet buffering for 100GE/OTU4 systems, the latest addition to Xelerated's HX family of network processors. The HX336 reduces power consumption by approximately 50 percent compared to competing multi-chip packet processing and traffic management solutions.
Synopsys rolls next gen DesignWare Data Converter IP Product News 3/23/2011 Post a comment Synopsys Inc. has released the next generation DesignWare Data Converter IP solutions to help designers significantly reduce the area and power dissipation of their system on chips (SoCs), simplify system integration and lower overall silicon cost.
Altair, Alcatel-Lucent okay LTE chipset Product News 3/22/2011 Post a comment Mobile communications chip company Altair Semiconductor Ltd. has announced that a combination of its FourGee 4G-LTE chipset and Alcatel-Lucent infrastructure has completed a three-month field trial with a U.S. wireless carrier and is now commercially available.
RoHS compliant high CV stacked capacitors Product News 3/22/2011 Post a comment AVX Corporation has expanded its switch mode power supply (SMPS) capacitor series to include a RoHS compliant version. The addition of the RoHS TurboCap to this product series increases the global product range.
SMT Hi-Rel COTS series of solid tantalum chip capacitors Product News 3/22/2011 Post a comment Vishay Intertechnology’s latest surface-mount Hi-Rel COTS series of solid tantalum chip capacitors combines Weibull grading and surge-current test options per MIL PRF 55365, a low-ESR option, and built-in fuses for high reliability and protection against short circuits in critical applications.
Xilinx ships first 28nm Kintex-7 FPGAs Product News 3/21/2011 2 comments A friend at Xilinx just emailed me to say: ‘We shipped parts to two customers on Friday and we’ve posted a video to YouTube – everyone here is ecstatic about how quickly these came in and how well they’re testing.’
HSPA M2M module available in BGA form factor Product News 3/20/2011 Post a comment To future-proof data transmission devices against non-availability of the 2G network, Telit is launching the HE series beginning with the HE863, a powerful, low-cost and fully equipped HSPA M2M module with embedded GPS receiver and 22 GPIOs in a BGA form factor.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.