Chip developers continue to push integration envelope Product News 4/10/2001 Post a comment Chip vendors among the nearly 350 exhibitors at the Embedded Systems Conference here this week will take the wraps off system-on-chip (SoC) devices, microcontrollers (MCUs), digital signal processors (DSPs) and communications circuits that pack more functionality into smaller packages than previously possible.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.