Monitors verify protocols Product News 5/29/2001 Post a comment A line of white-box protocol monitors, called CheckerWare Monitors, has been added to the 0-In Design Automation Inc. suite of white-box verification solutions. The monitors verify protocol correctness for a range of complex industry-standard buses and interfaces, including PCI, PCI-X, Low Pin Count (LPC), Utopia Levels 1-4, Amba buses for the ARM microprocessor, SDRAM and double-data-rate SDRAM.
Force Computers flexes 2U rack-mount system Product News 5/29/2001 Post a comment The Flexor System 2, a 2U system for high-density rack-mount applications from Force Computers Inc. includes a Flexor range single-board computer with integrated graphics, Ethernet, disk controller, serial and Universal Serial Bus.
Title VGA ports get ESD protector Product News 5/29/2001 Post a comment California Micro Devices' integrated passive VGA port protector, the PACVGA105, has seven channels of electrostatic-discharge protection for the signal lines commonly found in a PC's VGA port.
Winbond launches 256Mbit DDR SDRAM line Product News 5/24/2001 Post a comment HSINCHU, Taiwan -- Winbond Electronics Corp. has introduced a line of 256Mbit double-data-rate (DDR) SDRAM chips, following the lead of first-tier companies such as Samsung Electronics Co. Ltd.
Consortium reviews new standards for testing networking chip and board technologies Product News 5/23/2001 Post a comment PALO ALTO, Calif. -- A consortium that hopes to set new IC-testing standards for high-speed networking chip and board-level technologies has narrowed its proposals to three separate solutions.
The so-called AC-Extest Working Group--an organization that consists of automatic-test equipment suppliers, chip makers, and OEMs--plans to review IC-testing proposals from three different companies: Agilent Technologies, Cisco Systems, and Philips.
Aluminum nitride in terminator Product News 5/21/2001 Post a comment Bird Component Products Inc. has substituted aluminum nitride as an alternative to beryllium oxide substrates to create the environmentally friendly Model 100-NST-FN termination offerings.
VMEbus DSP board boasts 10,000 Mips Product News 5/21/2001 Post a comment A hot-swappable VMEbus DSP board from Communication Automation Corp. combines 96 DSP cores with a pair of MIPS RISC processors, for what the company says is a peak performance of more than 10,000 Mips.
SBC features programmability Product News 5/21/2001 Post a comment A programmable single-board computer from Tidal Engineering Corp. has a fully integrated C development environment and an IEEE-488 General Purpose Interface Bus controller for flexible, rapid instrument development.
PC133 DIMMs have low profile Product News 5/21/2001 Post a comment A 1.125-inch-high, 168-pin PC133 dual in-line memory module from Kentron Technologies is available with densities ranging from 128 Mbytes to 1 Gbyte.
Stacking connector touts very high density Product News 5/21/2001 Post a comment Teradyne Connection Systems' newest interconnect offering, the very high-density metric (VHDM) six-row stacking connector, provides a press-fit solution for stacking applications such as daughtercard-to-backplane and daughtercard-to-granddaughtercard links.
MCUs migrate to flash memories Product News 5/14/2001 Post a comment San Jose, Calif. - Declining prices and market timing pressures are driving a mass migration from mask ROM to flash memory embedded into microcontroller ICs.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.