Surface-mount MLCC products extend capacitance values Product News 5/29/2007 Post a comment Kemet developed several new multilayer chip capacitor (MLCC) products in C0G dielectric. Capacitance values have been extended in 25 V rated EIA 0402, 0603, 0805, 1206 and 1210 case sizes. Tolerance offerings include F (±1%); G (±2%); J (±5%); K (±10%); and M (±20%).
Power sensor measures true-RMS power Product News 5/29/2007 Post a comment Anritsu says it has introduced a highly accurate power sensor that measures true-RMS power, regardless of the input signal or its bandwidth, over 63 dB of dynamic range from 50 MHz to 6 GHz.
Edxact demo's enhanced netlist reduction tools at DAC Product News 5/29/2007 Post a comment Edxact SA, a French EDA startup company specializing in parametric extraction and physical verification, announced it would demonstrate new versions of its Jivaro netlist reduction technology and Comanche interconnection analysis tool at the Design Automation Conference early June in San Diego, California.
Solid-state MUX delivers 40-V switching Product News 5/29/2007 Post a comment Pickering Interfaces is expanding its PXI switching product line with the 40-682 versatile multiplexer (MUX) that uses high-performance solid state switching to provide it with long service life, no switch bounce, and low on resistance.
New TV broadcast UHF transistor announced Product News 5/29/2007 Post a comment NXP has launched the BLF878, the world's first true 300W ultra-high frequency (UHF) transistor in
High Voltage Generation 6 LDMOS. The new power transistor is targeted at the TV transmitter/broadcast market.
Sierra fuels 45 nm IC physical design Product News 5/28/2007 Post a comment Offering new support for 45 nm IC design, Sierra Design Automation is upgrading its Olympus-SoC design suite with a new global routing solution, a multi-corner clock tree synthesis capability, and a 45 nm "ready" router.
Temperature sensor offers easy thermal diode monitoring Product News 5/28/2007 Post a comment TI has introduced an integrated +/-1 degree C maximum remote junction temperature sensor and local temperature sensor, designed to monitor thermal diodes found in CPUs, microprocessors, graphics processing units and FPGAs. The TMP411 is said to simplify the design process with easy thermal diode monitoring.
Power integrity suite spans ICs, packages, boards Product News 5/28/2007 Post a comment Promising a comprehensive noise and power analysis solution for chip, package and pc-board design, Apache Design Solutions is announcing Sentinel, a product line that generates compact Spice-compatible models for portability across design teams.
NHK crafts 33 million-pixel image sensor for next-gen TV Product News 5/28/2007 Post a comment
Japan Broadcasting Corp. (NHK) has developed a 33 million-pixel CMOS image sensor that delivers "8k x 4k" video resolution, which Japan's largest broadcaster is promoting as Super Hi-Vision for future broadcast services. NHK demonstrated the sensor at an open house at its Science & Technical Research Laboratories.
Statistical pioneer rolls threaded timing analysis Product News 5/28/2007 Post a comment
Promising a dramatic speedup for timing analysis, Extreme DA Corp. this week will introduce a multithreaded static and statistical timing analyzer that runs on multicore CPU platforms. GoldTime uses the company's patent-pending ThreadWave technology, which promises gains in both performance and capacity.
MIPS gets out-of-order with its latest 32-bit MPU core Product News 5/28/2007 Post a comment Bringing a number of high-end computing technologies to the embedded world, MIPS Technologies Inc. unveiled its new RISC-based, 32-bit processor architecture last week. The intellectual-property (IP) core in- cludes a superscalar, out-of-order technology for use in a range of high-performance applications.
E-paper, flexible displays creep closer to market Product News 5/28/2007 Post a comment Electronic paper seems to be coming of age. E Ink Corp. exhibited a slew of recently launched products at the Society for Information Display conference here last week. The Cambridge, Mass., company also showed flexible-display prototypes from half a dozen E Ink customers, signaling a rapid advancement in flexible displays across the industry in the past year.
Boards : Dual cores power high-performance systems Product News 5/28/2007 Post a comment
When Intel Corp. unveiled its Core Duo microprocessor early last year, the chip giant promised that its device, which places two mobile-processing cores on one chip, would deliver huge performance gains and reduce battery consumption by at least 40 percent compared with its single-core processors.
Rodney Smith, long time Altera CEO, dies in accident Product News 5/27/2007 Post a comment Rodney Smith, a sports-car loving executive who built a startup programmable-logic company called Altera into an industry powerhouse, was killed Friday in a bicycle accident in Menlo Park. Smith, who retired four years as chairman and CEO of the FPGA company, was 67.
Pixel architecture delivers higher performance image sensors Product News 5/25/2007 Post a comment OmniVision Technologies has announced its third-generation pixel design, called OmniPixel3. Featuring a 1.75-micron pixel, this new architecture is expected to deliver image sensors with higher resolution, enhanced performance and improved image quality in a smaller form factor.
Forte claims SystemC-to-GDSII flow Product News 5/25/2007 Post a comment Forte Design Systems is claiming an automated path from SystemC to GDSII with Cynthesizer 3.3, a new release of its behavioral synthesis tool that links to Magma Design Automation's Blast Create.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.