Inductors deliver low inductance, low DCR Product News 5/30/2008 Post a comment Vishay has launched a toroidal, high-current, high-temperature inductor that touts the industry's highest rated saturation current, and the industry's lowest inductance and direct current of resistance (DCR).
New LinkSwitch simplifies CV/CC charger designs Product News 5/29/2008 Post a comment Newest generation touts an output accuracy of 5 percent over line and temperature variations, includes line-drop compensation circuitry, and guarantees very low no-load dissipation to easily meet Energy Star 2.0 standards for external power supplies.
ST moves SPEAr SoCs to 65nm Product News 5/29/2008 Post a comment By transferring the SPEAr family to 65-nm process technology, ST's SoC can integrate an advanced ARM926EJ-S processor core with two 16k memory caches, running at 333MHz, for data and instructions and up to 300,000 gates (ASIC-equivalent) of embedded configurable logic.
Vincotech showcases multipurpose power modules Product News 5/29/2008 Post a comment At the PCIM trade fair in Nuremberg, Vincotech introduced new products. The company which emerged from the former Tyco Electronics Power Systems through a buyout from investment company Gores Group introduced several power modules for solar, motor control and UPS applications.
Power MOSFETS offered in PowerPAK SC-70 package Product News 5/29/2008 Post a comment Vishay Intertechnology has released 15 power MOSFETS in a PowerPAK SC-70 package. This offering is said to include the industry's first 12-V devices in this package type, together with the industry's lowest on-resistance for voltage rating and package size.
ST extends 32-bit MCU family Product News 5/28/2008 Post a comment STMicroelectronics NV (Geneva, Switzerland) has added 28 devices to its family of 32-bit Flash microcontrollers based on ARM's Cortex-M3 core to provide up to 512 Kbytes of Flash, larger SRAM and additional peripherals for displays, sound, storage and advanced control.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.