OnChip delivers tiny silicon capacitor Product News 5/1/2008 Post a comment OnChip Devices has released a wire-bondable miniature silicon chip capacitor that the company claims is the industry's smallest and thinnest, measuring 10 x 10 mils sq. (0.25 x 0.25 mm) with thicknesses as thin as 4 mils (0.1 mm).
16-bit, 105-Msps serial output A/D converter conserves FPGA I/O pins Product News 5/1/2008 Post a comment With a high speed 2-wire serial interface, the LTC2274 from Linear reduces the number of data I/O lines required between a 16-bit A/D converter and the FPGA from 16 CMOS or 32 LVDS parallel data lines to a single, self-clocking, differential pair communicating at 2.1-Gbit/s, freeing up valuable FPGA pins.
Low-cost, versatile Class D amplifiers line debuts Product News 5/1/2008 Post a comment Maxim Integrated Products has introduced the MAX9736A/B, a family of versatile single-supply, filterless Class D speaker amplifiers, which provide high-performance, thermally efficient amplifier solutions at the lowest solution cost.
Broadcom expands networking portfolio Product News 5/1/2008 Post a comment Broadcom has expanded its network switching portfolio for businesses deploying 802.11n Wi-Fi networks with an end-to-end solution that combines its Intensi-fi silicon with its FASTPATH networking software to deliver features that IT managers require across their wireless networks.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.