OnChip delivers tiny silicon capacitor Product News 5/1/2008 Post a comment OnChip Devices has released a wire-bondable miniature silicon chip capacitor that the company claims is the industry's smallest and thinnest, measuring 10 x 10 mils sq. (0.25 x 0.25 mm) with thicknesses as thin as 4 mils (0.1 mm).
16-bit, 105-Msps serial output A/D converter conserves FPGA I/O pins Product News 5/1/2008 Post a comment With a high speed 2-wire serial interface, the LTC2274 from Linear reduces the number of data I/O lines required between a 16-bit A/D converter and the FPGA from 16 CMOS or 32 LVDS parallel data lines to a single, self-clocking, differential pair communicating at 2.1-Gbit/s, freeing up valuable FPGA pins.
Low-cost, versatile Class D amplifiers line debuts Product News 5/1/2008 Post a comment Maxim Integrated Products has introduced the MAX9736A/B, a family of versatile single-supply, filterless Class D speaker amplifiers, which provide high-performance, thermally efficient amplifier solutions at the lowest solution cost.
Broadcom expands networking portfolio Product News 5/1/2008 Post a comment Broadcom has expanded its network switching portfolio for businesses deploying 802.11n Wi-Fi networks with an end-to-end solution that combines its Intensi-fi silicon with its FASTPATH networking software to deliver features that IT managers require across their wireless networks.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.