Data converters target cellular base stations Product News 5/31/2011 Post a comment Analog Devices Inc. (ADI) has introduced four high-speed data converter products that support signal sampling rates necessary to accommodate multi-carrier radio platform requirements for 3G and 4G cellular infrastructure communication standards, including CDMA2000, UMTS/LTE, TD-SCDMA and TD-LTE.
Brazilian IP startup makes PMU for Lfoundry use Product News 5/31/2011 Post a comment Chipus Microelectronics SA, a Brazilian startup licensor of analog and mixed-signal circuit designs, has announced the availability of a power management unit for use on LFoundry's 150-nm mixed-signal process technology.
Intel embeds Mirics in PC-with-TV motherboard Product News 5/30/2011 6 comments Mirics Ltd., a developer of a software modem technology for digital TV reception, has said that Intel Corp. is planning to deliver global broadcast TV reception through an Intel branded PC motherboard.
PLX demos 10G chip 300 meters with 50% power reduction Product News 5/25/2011 Post a comment PLX Technology just announced a successful demo of 10Gbps Ethernet data and electrical transfer over a breakthrough distance of 300 meters using common and economical Cat6A unshielded twisted pair copper cable, and in full compliance with IEEE 802.3an.
EVE, Xena team on Ethernet hardware-assisted verification Product News 5/25/2011 Post a comment XenaCompact generates multi-port Ethernet traffic through EVE’s in-circuit emulation (ICE) speed-rate adapter with traffic buffering to manage dataflow to ZeBu for design under test (DUT) emulation.
Keywords: EVE, Zebu, Xena Network, Ethernet Tester, Co-Verification, Ethernet, Network Infrastructure, Emulator, Hardware-Assisted, Co-Verification
Mixed-signal MCUs on 90nm process Product News 5/25/2011 Post a comment Targeting designers of industrial and consumer applications who need solutions with low power consumption and increased integration, Freescale has introduced the ColdFire+ MCF51Qx and MCF51Jx microcontroller families.
IMEC, Atrenta to show 3-D design flow at DAC Product News 5/24/2011 3 comments EDA company Atrenta Inc., working with the IMEC research institute on a 3-D integration project, has developed a planning and partitioning design flow for heterogeneous 3-D stacked IC assemblies. They plan to demo the flow at the DAC exhibition.
Open source protocol targets 'Internet of things' Product News 5/22/2011 Post a comment NXP Semiconductors has announced it will make the IEEE 802.15.4 based wireless connectivity network layer software it inherited from the acquisition of Jennic, JenNET-IP, open source, in a bid to generate greater interest in the 'Internet of Things' concept.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.