Resistors fit to MIL specs Product News 6/26/2000 Post a comment State of the Art Inc. has expanded its line of thin- and thick-film chip resistors qualified to MIL-PRF-55342 (revision G, amendment 3).
Insert card guides target high-shock applications Product News 6/26/2000 Post a comment Bivar Inc.'s Grip-O-Gide deep-channel conductive insert card guides feature a 0.2-inch (5.1) slot depth aimed at improving board retention under high vibration and shock, such as in automotive and outdoor industrial applications.
StarPro Delivers 3600 MMACs Using Three VLIW DSPs/Chip Product News 6/26/2000 Post a comment The fourth generation DSP race for base station and front-end Telecom/Datacom processing is about to get tougher. Lucent has stepped onto the track with its new DSP chip architecture, StarPro. Ray Weiss takes an in depth look at the chip architecture that is at the leading performance edge of the DSP pack.
Inductors are free of lead Product News 6/20/2000 Post a comment Jaro Components says that its HFI and HFC surface-mount inductors meet upcoming lead-free requirements for electronics sold in Europe and other mandatory environmental protection standards.
WAN enclosures handle harshest environments Product News 6/20/2000 Post a comment Outdoor WAN cabinets designed for wireless telecom, datacom and other applications from Pentair Electronic Packaging are said to be flexible, tested and prequalified to help protect electrical and electronic equipment in harsh environments.
Smart switches display graphics Product News 6/20/2000 Post a comment The IS series of software-controlled push-button switches from NKK Switches can be programmed to display what the company called an infinite variety of text, still images or moving images.
Small inductors aim at wireless Product News 6/20/2000 Post a comment The NML series of multilayer chip inductors in 0402 and 0603 packages from NIC Components Corp. are said to feature high Q (greater than 50 at 1 GHz; less than 27 nanohenries) for high-frequency wireless communication applications.
Connectors fit wire-to-wire Product News 6/20/2000 Post a comment The AMP unit of Tyco Electronics has introduced a 0.1-inch (2.54-mm) center-line MTA-100 posted insulation displacement connector (IDC) with full shrouding to eliminate connector mismating.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.