Computer board touts STD bus migration Product News 7/30/2001 Post a comment WinSystems has a single-board computer (SBC) for the STD bus that's said to provide an upward migration path for STD systems while maintaining hardware, I/O and software compatibility over an industrial temperature range of -40 degrees C to 85C.
64-bit RISC MPU uses superscalar scheme Product News 7/30/2001 Post a comment NEC Electronics' 64-bit VR5500 MIPS RISC microprocessor is the first in a line of MPUs based on NEC's two-way superscalar VR5500 processor architecture and manufactured on its 0.13-micron process technology. It delivers 600 Mips at 300 MHz.
HP cuts 6,000 more jobs, warns that Q3 sales will fall 14-16% Product News 7/26/2001 Post a comment PALO ALTO, Calif. -- Hewlett-Packard Co. here today announced plans to slash 6,000 jobs, or 6.5% of its workforce, and warned that its fiscal third-quarter sales would declined 14-16% over the like period a year ago.
The workforce reduction will save the company about $500 million annually, said Carly Fiorina, HP chairman and chief executive. "Economies around the world continue to weaken as we move through the quarter," Fiorina said. "Our consumer business is being particularly hard hit with r
Kycon shrinks USB connector Product News 7/23/2001 Post a comment Kycon's B-type mini-Universal Serial Bus connector has all the advantages of a standard USB connector in 60 percent less space, the company said.
Flash MCU allows remote programming Product News 7/23/2001 Post a comment Atmel Corp. has launched the first five members of a microcontroller family with "self-programming" flash memory. MCUs in the megaAVR family have read-while-write capability and can program or reprogram the flash memory block, via an SPI, UART or two-wire interface, even while application code is executing in the boot-block sector.
Controllers fill remote bill Product News 7/23/2001 Post a comment Kikusui's PIA-4800 series controllers, available exclusively in the United States from IFR Systems, are capable of controlling up to 32 dc power supplies or electronic loads for automated test and burn-in applications.
Multichip pack combines PowerPC, SRAM Product News 7/23/2001 Post a comment A multichip package from White Electronic Designs that combines a PowerPC 755 RISC processor with a 1-Mbyte synchronous SRAM Level 2 cache is targeted for embedded-control applications where density and performance are a priority.
Philips to cut 4,000 more jobs, halts capital spending as fab capacity falls to 35% Product News 7/18/2001 Post a comment LONDON -- Royal Philips Electronics (Amsterdam, Netherlands) is shedding up to 4,000 jobs in its semiconductor division and has effectively halted capital spending for the rest of the year in response to the industry downturn.
The company divulged the moves Tuesday (July 17) while announcing worse-than-expected results for its second quarter. In additional cost-cutting measures, a further 1,500 people are expected to be let go from the group's components operation, which handles mobile display
AMSL's SVG unit once again delays 193-nm tool shipments to Intel; MPU giant concerned, sources say Product News 7/18/2001 Post a comment SAN FRANCISCO -- ASM Lithography's Silicon Valley Group unit has quietly once again delayed the shipments of its latest tools based on 193-nm, argon-fluoride (ArF) technology by another three to four months, a move that impacts its sole customer--Intel Corp.
Originally, SVG was supposed to deliver to Intel its so-called Micrascan 193 high-numerical aperture (HNA) scanners in April. But in April, SVG said it would delay the shipment schedule from April to this month (see
Overlay connects boards Product News 7/16/2001 Post a comment The DNA PCI-P0 Overlay from DNA Computing Solutions interconnects the 64-bit, 66-MHz PCI bus between as many as five boards.
Online design collaboration gets real Product News 7/16/2001 Post a comment Faced with an increasingly urgent need to deliver products faster, at lower cost and built by multinational design teams, distributors of electronic components are joining with Internet exchanges and other industry players to make online design collaboration a reality.
Intel to back thin-film and FRAM technologies in future Product News 7/11/2001 Post a comment SANTA CLARA, Calif. -- Intel Corp. here today described its future roadmap for nonvolatile memories, hinting that it will center its product development efforts based on a pair of emerging and competing technologies--thin-film and ferroelectric.
In a presentation given to press and analysts, executives from Intel said the company is developing separate but advanced chip products based on ovonics unified memory (OUM) and polymeric ferroelectric (FRAM) technologies.
8-Mbit SRAM aims at wireless Product News 7/9/2001 Post a comment Integrated Silicon Solution Inc. is marketing an 8-Mbit asynchronous SRAM with 70-nanosecond access and a 20-mA operating current (as low as 15 microamps in standby).
Web site targets custom headers Product News 7/9/2001 Post a comment Molex Inc. is helping engineers speed up the design process for custom headers via a new online option that allows users to generate price quotes and drawings instantly.
LCD monitors conserve energy, save space on desktops Product News 7/9/2001 Post a comment For years it seemed that computers offered higher speeds and new features almost monthly, while the monitor on the desk remained largely the same. Now hardly a week goes by without the announcement of a slimmer frame, a bigger screen or cut in price.
Hitachi tips 16-bit flash MCU Product News 7/2/2001 Post a comment A 16-bit, single-chip microcontroller from Hitachi Semiconductor (America) Inc. combines a CPU core that runs at up to 20 MHz with 256 kbytes of on-chip flash, an LCD controller/driver and a dual-tone, multiple-frequency (DTMF) output circuit.
512-kbit I2C E2PROM debuts Product News 7/2/2001 Post a comment Microchip Technology is offering a 512-kbit I2C serial E2PROM in a standard 8-lead SOIC package. With the 24LC515, users of the company's current 256-kbit devices have an upgrade path to higher-density E2PROM in the same package.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.