TI debuts new DLP .7 XGA 3 chip for ProV projectors Product News 7/4/2007 Post a comment Texas Instruments announced at InfoComm 2007 the DLP .7 XGA 3 chip, a platform for front projection products in the 5,000-7,500 lumens range. The new platform was designed to bring 3 chip DLP brightness, color and reliability to the demanding and often budget constrained large venue customers in the Pro AV market.
ADC operates at 350 MSPS Product News 7/3/2007 Post a comment Kenet has released a higher speed and lower power KAD2708-350 analog-to-digital converter (ADC) that operates at 350 MSPS. The company also announced the addition of CMOS outputs for lower-speed versions.
New Maxim HDMI/DVI switch maintains signal integrity Product News 7/3/2007 Post a comment Maxim Integrated Products has introduced the MAX4886 quad, high-speed, high-bandwidth,
HDMI/DVI passive switch capable of switching between two digital video signals into a single monitor or multiple HDMI/DVI connectors while maintaining a high level of signal integrity.
Hall-effect sensor suits harsh automotive and industrial apps Product News 7/3/2007 Post a comment Allegro has introduced a dual-channel Hall-effect sensor suitable for use in speed and direction sensing applications incorporating encoder ring magnet targets. The A3423 is highly sensitive and temperature stable making it suitable for use in harsh automotive and industrial environments.
ESL rolls out fiber-to-RS485/422/232 interface converter Product News 7/2/2007 Post a comment Aimed at defense applications, Electro Standards Laboratories' (ESL) Model 4149 high speed ruggedized fiber-to-RS485/422/232 interface converter provides typical operating speeds of 1.5-Mbits/s for RS232 to fiber conversion and 20-Mbits/s for RS485/422 to copper conversion.
Power supplies offer flexible output voltage Product News 7/2/2007 Post a comment Advanced Power Solutions has released the APS600/800Rx-N series of 600 and 800 watt flexible output switching power supplies with multiple packaging options, including U-Frame, top cover, end-mount fan and top-mount fan packages.
AMD to ship native x86 quad-core processors in August Product News 7/2/2007 Post a comment AMD's quad-core Opteron processors, code-named Barcelona, are planned for shipment in both standard and low-power versions at launch later this summer, marking the first time the chip maker has made both standard and low-power parts immediately available as part of a new processor launch.
Green Hills expands product suite to support Freescale's i.MX27 Product News 7/2/2007 Post a comment Green Hills Software Inc, announced that its product suite, including the MULTI integrated development environment, µ-velOSity royalty-free RTOS, TimeMachine tool suite, Green Hills compilers, and Green Hills Probe are now available for the Freescale i.MX27 multimedia applications processor.
MIT spin-off tips secret behind low-power A/Ds Product News 7/2/2007 Post a comment MIT spin-off Kenet reveals that it uses charge packets, like charge-coupled devices (CCDs), rather than power-hungry amplifiers to build what it says are the coolest-running, lowest-power analog-to-digital (A/D) converters devised to date.
SolarWorld to double production capacity Product News 7/2/2007 Post a comment Solar energy systems manufacturer SolarWorld has plans to double its wafer production capacity. The company will invest 600 million (about $ 805 million) to build a new wafer production line in Freiberg (Germany).
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.