Features added to Atmel's 8/16-bit AVR XMEGA MCUs Product News 7/13/2011 Post a comment Atmel Corporation has added unique features to their 8/16-bit AVR XMEGA microcontroller (MCU) family with what the company claims is the industry’s lowest power consumption of 100nA with 5µS wake-up time. The new AVR XMEGA family includes full-speed USB, the fastest and highest-precision analog systems, a Direct Memory Access (DMA) controller, and an event system that maximizes real-time performance and throughput while reducing CPU load.
Harvesting solar, wind and rain energy all at once Product News 7/12/2011 Post a comment A hybrid photovoltaic-piezoelectric device has been developed at the Institute of Material Research and Innovation (IMRI) of the University of Bolton, UK, which is capable of generating electrical energy from solar, wind and rain energy. The organic photovoltaic cell based on P3HT and PCBM has been developed on a piezoelectric PVDF polymer substrate.
Enecsys' single, duo micro-inverters obtain UL 1741 certification Product News 7/12/2011 Post a comment Solar photovoltaic micro-inverter manufacturer Enecsys Ltd. (Cambridge, UK) announced it has obtained the UL 1741 certification for the SMI-S240W-60 and SMI-S240W-72, 240 Watt, single micro-inverters for 60 cell and 72 cell solar modules, and for the SMI-D360W-72, a 360 Watt Duo product for 72 cell solar modules.
Advantest announces NAND flash test solutions Product News 7/11/2011 Post a comment Advantest Corporation announced the availability of two new solutions for next-generation NAND flash memory test: the T5773 for package test and the HA5100CELL, based on the Harmonic architecture, for wafer test.
Atmel samples SAM3S16 ARM-based MCU with 1MB embedded Flash Product News 7/11/2011 Post a comment Atmel Corporation is sampling its SAM3S16 Cortex-M3 MCU, a 32-bit ARM Cortex -M3-based microcontroller with 1MB embedded Flash and 128KB SRAM. The new MCU's high performance, low power and large memory density suit it for user interfaces requiring capacitive touch, increased data processing, and connectivity.
TI unveils sub-1GHz RF at sub-$1 Product News 7/10/2011 Post a comment A two-chip bundle costing less than $1.00 is aimed at enabling long-range wireless connectivity for cost-sensitive, low-power applications such as toys, security systems and more.
ITT cannon KJAYA series Product News 7/7/2011 Post a comment ITT's MIL-DTL 38999 Series III style connector for low-pressure applications uses lightweight aluminum shells that provide a sealed, watertight and airtight solution for pressures up to 15psi.
Baolab creates ultra-low cost 3D digital MEMS compasses in CMOS Product News 7/6/2011 2 comments The BLBC3-D NanoCompass from Baolab Microsystems is the first product that will be made using the company's NanoEMS technology, which enables nanoscale MEMS (Micro Electro Mechanical Systems) to be built using standard high-volume CMOS lines and to be fully integrated monolithically with the analogue and digital electronics.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.